OTHER Serial Communication Controllers 19

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Drive Interface Standard	Low Power Mode	JESD-609 Code	No. of I/O Lines
PR5331C3HN/C360,51	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3,5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel		-30 Cel		QUAD																	Serial IO/Communication Controllers		.5 mm	S-PQCC-N40		Not Qualified
PR5331C3HN/C360,55	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES				3.3,5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel		-30 Cel		QUAD																	Serial IO/Communication Controllers		.5 mm	S-PQCC-N40		Not Qualified
NT2H1311G0DUFZ	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1311G0DUFV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1311G0DUDV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1511G0DUDZ	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1511G0DUDV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1511G0DUFZ	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1511G0DUFV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1611G0DUFZ	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1611G0DUFV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1611G0DUDZ	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H1611G0DUDV	NXP Semiconductors		OTHER												DIE OR CHIP		70 Cel		-25 Cel																			Serial IO/Communication Controllers					Not Qualified
NT2H0301F0DTP,118	NXP Semiconductors		OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					SMALL OUTLINE	SOLCC8,.12,20		70 Cel		-25 Cel		DUAL									30	260							Serial IO/Communication Controllers		.5 mm	R-PDSO-N8	1	Not Qualified
TNETE110APGE	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	0	32	3/5,5	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	4.75 V	95 Cel	1.25 MBps	0 Cel		QUAD	1.6 mm	0	20 mm	YES	32	BIPH-LEVEL(MANCHESTER)		20 MHz	NOT SPECIFIED	NOT SPECIFIED	20 mm	CMOS		5 V	1	2	Serial IO/Communication Controllers	PCI	.5 mm	S-PQFP-G144		Not Qualified		NO		0
LAN91C111-NC	Standard Microsystems	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V		16	3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	2.97 V	85 Cel	12.5 MBps	0 Cel	TIN LEAD	QUAD	3.4 mm		14 mm	NO	32	NRZ; BIPH-LEVEL(MANCHESTER)		25 MHz		235	20 mm	CMOS	140 mA	3.3 V		2	Serial IO/Communication Controllers	ARM; SH; POWERPC; COLDFIRE; 680X0; 683XX; MIPS R3000	.5 mm	R-PQFP-G128	3	Not Qualified		YES	e0
TSB43DA42AZHC	Texas Instruments	CONSUMER CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES			32		GRID ARRAY, LOW PROFILE			85 Cel	400 MBps	-20 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		15 mm		32			33 MHz	30	260	15 mm	CMOS						PCI	1 mm	S-PBGA-B196	3	Not Qualified	IEEE1394; IEEE1394A		e1
SN65LVCP15PWR	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.47 V		0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		3.14 V	85 Cel	.1875 MBps	0 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm		4.4 mm	NO	0		ETHERNET		30	260	9.7 mm	CMOS	131 mA	3.3 V		2			.65 mm	R-PDSO-G28	1	Not Qualified		NO	e4
LAN91C113-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		14 mm	NO	16	NRZ; BIPH-LEVEL(MANCHESTER)	BIT, BYTE, ETHERNET	25 MHz			14 mm	CMOS	140 mA	3.3 V		7		680X0; 683XX	.4 mm	S-PQFP-G128				YES	e3

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.