Microchip Technology Serial Communication Controllers 52

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
LAN9513-JZX-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES					3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		70 Cel	60 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES			SYNC; BIT ;BYTE				9 mm	CMOS		1.8 V		1	Serial IO/Communication Controllers		.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN9250/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN9250/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	1.14 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			10 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQFP-G64		Not Qualified	YES	e3
LAN9250I/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN9250I/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	1.14 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			10 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQFP-G64		Not Qualified	YES	e3
LAN9250T/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN9250T/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	1.14 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			10 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQFP-G64		Not Qualified	YES	e3
LAN9250TI/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN9250TI/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	64	TQFP	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	FLATPACK, THIN PROFILE	TQFP64,.47SQ	1.14 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			10 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQFP-G64		Not Qualified	YES	e3
LAN9250V/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm	25MHZ NOMINAL CLOCK AVAILABLE; IEEE802.3Z NETWORK PROTOCOL AVAILABLE	YES	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-XQCC-N64		Not Qualified	YES	e3
LAN9250TV/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V		TS 16949	16	1.2,3.3	CHIP CARRIER	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZ; BIPH-LEVEL(MANCHESTER)	ASYNC, BIT; SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V			Serial IO/Communication Controllers	I2C; SPI	.5 mm	S-PQCC-N64		Not Qualified	YES	e3
LAN91C111I-NS	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V		TS 16949	16		FLATPACK, FINE PITCH	QFP128,.70x.94,20	2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	3.4 mm		14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz		245	20 mm	CMOS	140 mA	3.3 V		4		680X0; 683XX	.5 mm	R-PQFP-G128	3	Not Qualified	YES	e3
LAN91C111I-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		TS 16949	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		14 mm		NO	32	NRZ; BIPH-LEVEL(MANCHESTER)	SYNC, BIT, BYTE, ETHERNET	25 MHz		260	14 mm	CMOS	140 mA	3.3 V		4		680X0; 683XX	.4 mm	S-PQFP-G128	3	Not Qualified	YES	e3
ENC28J60-I/SP	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	3.6 V	8	TS 16949	0	3.3	IN-LINE	DIP28,.6	3.1 V	85 Cel	1.25 MBps	-40 Cel	MATTE TIN	DUAL	4.572 mm	8192	15.24 mm		NO	0		SYNC; BIT ;BYTE	25 MHz			34.671 mm	CMOS	180 mA	3.3 V		1	Serial IO/Communication Controllers	SPI	2.54 mm	R-PDIP-T28		Not Qualified	YES	e3
KSZ8841-16MVLI-TR	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.5 V			15		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	3.1 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1.6 mm		14 mm		YES	16	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		25 MHz			14 mm	CMOS		3.3 V					.4 mm	S-PQFP-G128			YES
LAN91C113-NU	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	128	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V			16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	2.97 V	85 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		14 mm		NO	16	NRZ; BIPH-LEVEL(MANCHESTER)	BIT, BYTE, ETHERNET	25 MHz			14 mm	CMOS	140 mA	3.3 V		7		680X0; 683XX	.4 mm	S-PQFP-G128			YES	e3
SIO1007-JV	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		ISO/TS-16949	16		FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	70 Cel		0 Cel		QUAD	1.6 mm		7 mm		NO	0		ASYNC, BIT; SYNC, BYTE; UART		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		1		IRDA; LPC; PCI	.4 mm	S-PQFP-G64			YES
SCH3224-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	COMMERCIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	70 Cel	.1875 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	4	2		PCI; UART	.65 mm	S-PBGA-B100			YES	e1	24
SCH3226I-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	85 Cel	.1875 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	0	6		PCI; UART	.65 mm	S-PBGA-B100			YES	e1	40
LAN7800T-I/VSX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	8				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	2.97 V	85 Cel	625 MBps	-40 Cel	MATTE TIN	QUAD	.9 mm	512	6 mm		NO				25 MHz			6 mm	CMOS		3.3 V		10			.4 mm	S-XQCC-N48			YES	e3	8
LAN7850/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	70 Cel	125 MBps	0 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2		USB	.5 mm	S-PQCC-N56			YES
LAN7850T-I/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2		USB	.5 mm	S-PQCC-N56			YES
LAN9252T/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-PQFP-G64			YES
LAN9252TI/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-XQCC-N64			YES
LAN9252TI/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-PQFP-G64			YES
LAN9252TV/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	105 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-XQCC-N64			YES
LAN9252T/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-XQCC-N64			YES
LAN9252/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4		I2C, SPI	.5 mm	S-PQFP-G64			YES
MCP2517FD-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	1.75 mm	2048	3.9 mm		NO	0		CAN FD	40 MHz			8.65 mm	CMOS	20 mA			1		SPI	1.27 mm	R-PDSO-G14			YES		2
LAN7431-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
LAN7431T/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	70 Cel	256 MBps	0 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4		PCI	.5 mm	S-XQCC-N72	3		YES	e3
MCP2515-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V		1		SPI	.5 mm	S-PQCC-N20			YES	e3	0
MCP2515-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2515-E/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20			YES	e3
MCP2515-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2515-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1		SPI	.65 mm	R-PDSO-G20			YES	e3	0
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V		1		SPI	.5 mm	S-PQCC-N20			YES	e3	0
MCP2515T-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3
MCP2515T-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0		SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1		SPI	1.27 mm	R-PDSO-G18			YES	e3	0
MCP2518FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949			SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V		1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-E/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V		1		SPI	.65 mm	R-PDSO-N14			YES	e3
MCP2518FDT-E/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V		1		SPI	1.27 mm	R-PDSO-G14			YES	e3
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V		1		SPI	.65 mm	R-PDSO-N14			YES	e3
LAN9253T/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64			YES
LAN9253-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4		I2C; SPI	.5 mm	S-XQCC-N64			YES

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.