Serial Communication Controllers

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Low Power Mode	JESD-609 Code	No. of I/O Lines
TL16C752CIPFBRQ1	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100	3	FLATPACK, THIN PROFILE, FINE PITCH		4.5 V	105 Cel	.375 MBps	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.2 mm		7 mm	ALSO OPERATES AT 1.8V/2.5V/3.3V NOMINAL SUPPLY	NO	8		ASYNC, BIT	48 MHz	30	260	7 mm	CMOS	40 mA	5 V		2		.5 mm	S-PQFP-G48	2	YES	e4
SIO1007-JV	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.63 V		ISO/TS-16949	16	FLATPACK, LOW PROFILE, FINE PITCH		2.97 V	70 Cel		0 Cel		QUAD	1.6 mm		7 mm		NO	0		ASYNC, BIT; SYNC, BYTE; UART		NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS		3.3 V		1	IRDA; LPC; PCI	.4 mm	S-PQFP-G64		YES
SCH3224-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	COMMERCIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	70 Cel	.1875 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	4	2	PCI; UART	.65 mm	S-PBGA-B100		YES	e1	24
SCH3226I-SY	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	BALL	100	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.63 V	8		0	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA100,11X11,25	2.97 V	85 Cel	.1875 MBps	-40 Cel	TIN SILVER COPPER	BOTTOM	.8 mm	256	8 mm		NO	0		SYNC, BYTE	33 MHz			8 mm	CMOS	1 mA	3 V	0	6	PCI; UART	.65 mm	S-PBGA-B100		YES	e1	40
XR16C2850IMTR-F	Exar	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			3	FLATPACK, THIN PROFILE, FINE PITCH		2.97 V	85 Cel	.78125 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		7 mm	ALSO OPERATES AT 3.3V SUPPLY	NO	8		ASYNC, BIT	24 MHz			7 mm	CMOS		5 V		2		.5 mm	S-PQFP-G48		YES	e3
LAN7800T-I/VSX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	8			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	2.97 V	85 Cel	625 MBps	-40 Cel	MATTE TIN	QUAD	.9 mm	512	6 mm		NO				25 MHz			6 mm	CMOS		3.3 V		10		.4 mm	S-XQCC-N48		YES	e3	8
LAN7850/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	70 Cel	125 MBps	0 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2	USB	.5 mm	S-PQCC-N56		YES
LAN7850T-I/8JX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.26 V			0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	1.1 V	85 Cel	125 MBps	-40 Cel		QUAD	1 mm		8 mm		YES	0		ASYNC, BIT; SYNC, BYTE	25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	CMOS	183 mA	1.2 V		2	USB	.5 mm	S-PQCC-N56		YES
FT4232H-56Q-TRAY	FTDI	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	UNSPECIFIED	YES	1.98 V				CHIP CARRIER, HEAT SINK/SLUG	LCC56,.31SQ,20	1.62 V	85 Cel	1.5 MBps	-40 Cel		QUAD	1 mm		8 mm		YES			ASYNC, BIT; SYNC, BYTE	12 MHz	40	260	8 mm	CMOS		1.8 V		4	I2C; RS-232; RS-422; RS-485; SPI; UART; USB	.5 mm	S-XQCC-N56	3	YES		8
LAN9252T/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-PQFP-G64		YES
LAN9252TI/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252TI/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-PQFP-G64		YES
LAN9252TV/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	105 Cel	12.5 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252T/ML	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		TS 16949	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			9 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-XQCC-N64		YES
LAN9252/PT	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		TS 16949	16	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	70 Cel	12.5 MBps	0 Cel	MATTE TIN	QUAD	1.2 mm		10 mm		YES	16	NRZI	SYNC, BYTE; ETHERNET	25 MHz			10 mm	CMOS		3.3 V		4	I2C, SPI	.5 mm	S-PQFP-G64		YES
PI7C9X1170ACLEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.97 V	85 Cel	4.125 MBps	-40 Cel		DUAL	1.2 mm		4.4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	7.8 mm	CMOS		3.3 V		1	I2C; IRDA; RS-232; RS-485; SPI	.65 mm	R-PDSO-G24		NO
PI7C9X1170BCLEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.63 V			0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		2.97 V	85 Cel	4.125 MBps	-40 Cel		DUAL	1.2 mm		4.4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	5 mm	CMOS		3.3 V		1	I2C; IRDA; RS-232; RS-485; SPI	.65 mm	R-PDSO-G16		NO
PI7C9X1170CZDEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V			0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel	4.125 MBps	-40 Cel		QUAD	.9 mm		4 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	0		ASYNC, BIT	64 MHz	30	260	4 mm	CMOS		3.3 V		1	I2C; IRDA; RS-232; RS-485; SPI	.5 mm	S-XQCC-N24		NO
PI7C9X760CZDEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	2.75 V			2	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.25 V	85 Cel	4.125 MBps	-40 Cel		QUAD	.9 mm		4 mm	also operates with 3.3v @ 64mhz and 1.8v @ 32mhz and 24mhz	NO	0		ASYNC, BIT	250 MHz	NOT SPECIFIED	NOT SPECIFIED	4 mm	CMOS	6 mA	2.5 V		1	I2C; IRDA; RS-232; RS-485; SPI; UART	.5 mm	S-XQCC-N24		YES		8
PI7C9X752FAEX	Diodes Incorporated	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ,20	1.62 V	85 Cel	2 MBps	-40 Cel		QUAD	1.2 mm		7 mm	ALSO OPERATES AT 1.8V AND 2.5V NOMINAL	NO	8		ASYNC, BIT	80 MHz	NOT SPECIFIED	NOT SPECIFIED	7 mm	CMOS	15 mA	1.8 V			IRDA; RS-232; RS-485	.5 mm	S-PQFP-G48		NO
MCP2517FD-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100; TS 16949	0	SMALL OUTLINE	SOP14,.25	2.7 V	150 Cel	1 MBps	-40 Cel		DUAL	1.75 mm	2048	3.9 mm		NO	0		CAN FD	40 MHz			8.65 mm	CMOS	20 mA			1	SPI	1.27 mm	R-PDSO-G14		YES		2
LAN7431-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	MATTE TIN	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T-I/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	85 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T-V/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		AEC-Q100; TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	105 Cel	256 MBps	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
LAN7431T/YXX	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1.32 V		TS 16949	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.14 V	70 Cel	256 MBps	0 Cel	Matte Tin (Sn) - annealed	QUAD	1 mm		10 mm	ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X	YES	0		SYNC, BYTE; ETHERNET	25 MHz	30	260	10 mm	CMOS		1.2 V		4	PCI	.5 mm	S-XQCC-N72	3	YES	e3
MCP2515-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V		1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
MCP2515-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2515-E/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm		4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1	SPI	.65 mm	R-PDSO-G20		YES	e3
MCP2515-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2515-I/STVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	1.2 mm	14	4.4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			6.5 mm	CMOS	10 mA	5 V		1	SPI	.65 mm	R-PDSO-G20		YES	e3	0
MCP2515T-E/MLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	QUAD	1 mm	14	4 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			4 mm	CMOS	10 mA	5 V		1	SPI	.5 mm	S-PQCC-N20		YES	e3	0
MCP2515T-E/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE	SOP18,.4	4.5 V	125 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm		7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1	SPI	1.27 mm	R-PDSO-G18		YES	e3
MCP2515T-I/SOVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	8	AEC-Q100	0	SMALL OUTLINE	SOP18,.4	4.5 V	85 Cel	.125 MBps	-40 Cel	MATTE TIN	DUAL	2.65 mm	14	7.5 mm		NO	0	NRZ	SYNC; BIT ;BYTE	40 MHz			11.55 mm	CMOS	10 mA	5 V		1	SPI	1.27 mm	R-PDSO-G18		YES	e3	0
MCP2518FDT-H/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949		SMALL OUTLINE	SOP14,.24	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO			SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V		1	SPI	1.27 mm	R-PDSO-G14		YES	e3
MCP2518FDT-E/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V		1	SPI	.65 mm	R-PDSO-N14		YES	e3
MCP2518FDT-E/SLVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE	SOP14,.24	2.7 V	125 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	1.75 mm		3.9 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	8.65 mm	CMOS	20 mA	3.3 V		1	SPI	1.27 mm	R-PDSO-G14		YES	e3
MCP2518FDT-H/QBBVAO	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, CAN	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		AEC-Q100; TS 16949	0	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	LCC14,.18X.12,30	2.7 V	150 Cel	1 MBps	-40 Cel	MATTE TIN	DUAL	.9 mm		3 mm		NO	0		SYNC; BIT ;BYTE	40 MHz	30	260	4.5 mm	CMOS	20 mA	3.3 V		1	SPI	.65 mm	R-PDSO-N14		YES	e3
XR16C850IJTR-F	Maxlinear	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	J BEND	44	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			3	CHIP CARRIER		2.97 V	85 Cel	.25 MBps	-40 Cel		QUAD	4.57 mm		16.585 mm		NO	8	NRZ	ASYNC, BIT	36 MHz			16.585 mm	CMOS		3.3 V		1	ISA	1.27 mm	R-PQCC-J44		YES
EC4-1000-H2S	Amphenol
LAN9253T/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253T-I/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	85 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253T-V/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	105 Cel	12.5 MBps	-40 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4	I2C; SPI	.5 mm	S-XQCC-N64		YES
LAN9253/R4X	Microchip Technology	SERIAL IO/COMMUNICATION CONTROLLER, LAN		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.26 V			16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	1.14 V	70 Cel	12.5 MBps	0 Cel		QUAD	1 mm		9 mm		YES	16	NRZI	SYNC, BYTE	25 MHz			9 mm	CMOS		1.2 V		4	I2C; SPI	.5 mm	S-XQCC-N64		YES
2746391	Phoenix Contact	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V						4.5 V	85 Cel		-40 Cel		DUAL					NO			UART					CMOS		5 V			UART		R-PDSO-G16		NO
Z16C3010AEG	Zilog	SERIAL IO/COMMUNICATION CONTROLLER	INDUSTRIAL	GULL WING	100	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			16	FLATPACK, FINE PITCH	QFP100,.63SQ,20	4.5 V	105 Cel	1.25 MBps	-40 Cel	TIN	QUAD	1.8 mm		14 mm		NO	16			10 MHz	20	260	14 mm	CMOS	50 mA	5 V				.5 mm	S-PQFP-G100	3	YES	e3	13
BCM5720A0KFBG	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	169	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			55 Cel		0 Cel		BOTTOM				3.3V to 1.2V Voltage Regulator Control available	YES			SYNC, BIT, BYTE, ETHERNET	24 MHz		260		CMOS					PCI, SMBUS		S-PBGA-B169	3	YES

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.