Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
ICE40LP1K-SWG16TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE40LP1K-SWG16TR50	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160	CMOS			1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm								1.48 mm
ICE40LP1K-SWG16TR	Lattice Semiconductor	FPGA	Industrial	Ball	16	VFBGA	Rectangular	Plastic/Epoxy	1280	Yes	1.26 V	160	CMOS	10		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9.36 ns	160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B16		.491 mm	1.4 mm						10		1.48 mm
ICE5LP4K-SWG36ITR	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	26		1.2		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.35 mm	100 °C (212 °F)	9 ns	440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm					30 s	26	260 °C (500 °F)	2.078 mm
XC7A200T-2SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		285		1		Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7A200T-1SB484I	Xilinx	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825		285		1		Grid Array, Fine Pitch			.95 V	.8 mm	100 °C (212 °F)	1.27 ns	16825 CLBS	-40 °C (-40 °F)	Tin/Lead	Bottom	S-PBGA-B484		2.44 mm	19 mm			e0			285		19 mm
XC7K410T-2FF900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1	1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	31775 CLBS		Tin Lead	Bottom	S-PBGA-B900		3.35 mm	31 mm	No		e0	1818 MHz		500		31 mm
LCMXO3L-1300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160		206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	160				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160		206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	540		206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858		206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858				2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-6900C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858		206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
XCS30XL-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS40XL-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	205	225 °C (437 °F)	27 mm
XC6VLX195T-3FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS	400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No		e0	1412 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX240T-3FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1412 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX75T-3FF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS	240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1412 MHz	30 s	240	220 °C (428 °F)	23 mm
XCS30-3BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	125 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS30-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS	196	10000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	166 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS30XL-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS	196	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS40-3BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	205	13000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	125 MHz	30 s	205	225 °C (437 °F)	27 mm
XCS40-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS	205	13000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	166 MHz	30 s	205	225 °C (437 °F)	27 mm
XCS40XL-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS	205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	27 mm
XC7K325T-1FB900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy		Yes	1.03 V	25475				1		Grid Array			.97 V	1 mm		0.74 ns	25475 CLBS		Tin Lead	Bottom	S-PBGA-B900	4	2.54 mm	31 mm			e0		30 s		225 °C (437 °F)	31 mm
XC4010E-1BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.3 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	166 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	125 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-4BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.25 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2.7 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	111 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4010E-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	400	Yes	5.5 V	400	CMOS	160	7000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2.7 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 10000 Logic gates	e0	111 MHz	30 s	160	225 °C (437 °F)	27 mm
XC4013E-1BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.3 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	166 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-2BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-2BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		1.6 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-3BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-3BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	125 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-4BG225C	Xilinx	FPGA	Other	Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.25 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.75 V	1.5 mm	85 °C (185 °F)	2.7 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4013E-4BG225I	Xilinx	FPGA		Ball	225	BGA	Square	Plastic/Epoxy	1368	Yes	5.5 V	576	CMOS	192	10000	5	5 V	Grid Array	BGA225,15X15	Field Programmable Gate Arrays	4.5 V	1.5 mm		2.7 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B225	3	2.55 mm	27 mm	No	Max usable 13000 Logic gates	e0	111 MHz	30 s	192	225 °C (437 °F)	27 mm
XC4085XLA-09BG352I	Xilinx	FPGA		Ball	352	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	289	55000	3.3	3.3 V	Grid Array, Low Profile	BGA352,26X26,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B352	3	1.7 mm	35 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	289	225 °C (437 °F)	35 mm
XC4036XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 65000 gates	e0	227 MHz	30 s	288	225 °C (437 °F)	40 mm
XC4052XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	1936	Yes	3.6 V	1936	CMOS	352	33000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	1936 CLBS, 33000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 100000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XLA-08BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e0	263 MHz	30 s	352	225 °C (437 °F)	40 mm
XC4085XLA-09BG432C	Xilinx	FPGA	Other	Ball	432	LBGA	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	352	55000	3.3	3.3 V	Grid Array, Low Profile	BGA432,31X31,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	3136 CLBS, 55000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B432	3	1.7 mm	40 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	352	225 °C (437 °F)	40 mm
XC40200XV-07BG560C	Xilinx	FPGA	Other	Ball	560	LBGA	Square	Plastic/Epoxy	7056	Yes	2.7 V	7056	CMOS	448	130000	2.5	2.5,3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	2.3 V	1.27 mm	85 °C (185 °F)	1 ns	7056 CLBS, 130000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 400000 gates	e0	296 MHz	30 s	448	225 °C (437 °F)	42.5 mm
XC4085XLA-09BG560I	Xilinx	FPGA		Ball	560	LBGA	Square	Plastic/Epoxy	3136	Yes	3.6 V	3136	CMOS	448	55000	3.3	3.3 V	Grid Array, Low Profile	BGA560,33X33,50	Field Programmable Gate Arrays	3 V	1.27 mm		1.1 ns	3136 CLBS, 55000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B560	3	1.7 mm	42.5 mm	No	Can also use 180000 gates	e0	227 MHz	30 s	448	225 °C (437 °F)	42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.