Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V2000-5BG575I	Xilinx	FPGA		Ball	575	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	408	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA575,24X24,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B575	3	2.6 mm	31 mm	No	e0	750 MHz		408	225 °C (437 °F)	31 mm
XC2V2000-5FF896I	Xilinx	FPGA		Ball	896	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	624	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA896,30X30,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B896	4	3.4 mm	31 mm	No	e0	750 MHz	30 s	624	225 °C (437 °F)	31 mm
XC2V2000-5FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.575 V	2688	CMOS	456	2000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	2688 CLBS, 2000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	750 MHz	30 s	456	225 °C (437 °F)	27 mm
XC2V250-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V250-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	200	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	650 MHz	30 s	200	225 °C (437 °F)	23 mm
XC2V250-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V250-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	200	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	384 CLBS, 250000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	750 MHz	30 s	200	225 °C (437 °F)	23 mm
XC2V250-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3456	Yes	1.575 V	384	CMOS	172	250000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.35 ns	384 CLBS, 250000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	820 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V3000-4BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	3584 CLBS, 3000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V3000-4BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V3000-4BG728I	Xilinx	FPGA		Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No	e0	650 MHz		516		35 mm
XC2V3000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2V3000-4FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	650 MHz	30 s	484	225 °C (437 °F)	27 mm
XC2V3000-5BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	684	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V3000-5BG728I	Xilinx	FPGA		Ball	728	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	516	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA728,27X27,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin Lead	Bottom	S-PBGA-B728	3	2.6 mm	35 mm	No	e0	750 MHz		516		35 mm
XC2V3000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	720	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	750 MHz	30 s	720	225 °C (437 °F)	35 mm
XC2V3000-5FG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	32256	Yes	1.575 V	3584	CMOS	484	3000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	3584 CLBS, 3000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No	e0	750 MHz	30 s	484	225 °C (437 °F)	27 mm
XC2V40-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	64 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	650 MHz	30 s	88	225 °C (437 °F)	17 mm
XC2V40-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	64 CLBS, 40000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	750 MHz	30 s	88	225 °C (437 °F)	17 mm
XC2V4000-4BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V4000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V4000-4FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	912	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	650 MHz	30 s	912	225 °C (437 °F)	40 mm
XC2V4000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	5760 CLBS, 4000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V4000-5BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	684	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V4000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	51840	Yes	1.575 V	5760	CMOS	824	4000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	5760 CLBS, 4000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V500-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS	172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	650 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V500-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS	264	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	650 MHz	30 s	264	225 °C (437 °F)	23 mm
XC2V500-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS	172	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	750 MHz	30 s	172	225 °C (437 °F)	17 mm
XC2V500-5FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	6912	Yes	1.575 V	768	CMOS	264	500000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	768 CLBS, 500000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	750 MHz	30 s	264	225 °C (437 °F)	23 mm
XC2V6000-4BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.44 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	650 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V6000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V6000-5BF957C	Xilinx	FPGA	Other	Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm	85 °C (185 °F)	0.39 ns	8448 CLBS, 6000000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V6000-5BF957I	Xilinx	FPGA		Ball	957	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	684	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA957,31X31,50	Field Programmable Gate Arrays	1.425 V	1.27 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B957	4	3.5 mm	40 mm	No	e0	750 MHz	30 s	684	225 °C (437 °F)	40 mm
XC2V6000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	76032	Yes	1.575 V	8448	CMOS	824	6000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	8448 CLBS, 6000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V80-4FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	650 MHz	30 s	120	225 °C (437 °F)	17 mm
XC2V80-5FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	120	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	128 CLBS, 80000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	750 MHz	30 s	120	225 °C (437 °F)	17 mm
XC2V8000-4FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	824	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	650 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V8000-4FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.44 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	650 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2V8000-5FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	824	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	750 MHz	30 s	824	225 °C (437 °F)	35 mm
XC2V8000-5FF1517I	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	104832	Yes	1.575 V	11648	CMOS	1108	8000000	1.5	1.5,1.5/3.3,3.3 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.39 ns	11648 CLBS, 8000000 Gates		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No	e0	750 MHz	30 s	1108	225 °C (437 °F)	40 mm
XC2VP2-6FF672C	Xilinx	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1200 MHz	30 s	204	220 °C (428 °F)	27 mm
XC2VP2-6FF672I	Xilinx	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	204		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B672	4	2.65 mm	27 mm	No	e0	1200 MHz	30 s	204	220 °C (428 °F)	27 mm
XC2VP2-6FG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	1200 MHz	30 s	140	225 °C (437 °F)	17 mm
XC2VP2-6FG256I	Xilinx	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	140		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	e0	1200 MHz	30 s	140	225 °C (437 °F)	17 mm
XC2VP2-6FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	156		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	352 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	1200 MHz	30 s	156	225 °C (437 °F)	23 mm
XC2VP2-6FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	3168	Yes	1.575 V	352	CMOS	156		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	352 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	e0	1200 MHz	30 s	156	225 °C (437 °F)	23 mm
XC2VP20-6FF1152C	Xilinx	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm	85 °C (185 °F)	0.32 ns	2320 CLBS	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm
XC2VP20-6FF1152I	Xilinx	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	20880	Yes	1.575 V	2320	CMOS	564		1.5	1.5,1.5/3.3,2/2.5,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.425 V	1 mm		0.32 ns	2320 CLBS		Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B1152	4	3.4 mm	35 mm	No	e0	1200 MHz	30 s	564	225 °C (437 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.