Commercial Extended Field Programmable Gate Arrays (FPGA) 27

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3SD1800A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD1800A-4FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
XC3SD1800A-5CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	309	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	280 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD1800A-5FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	37440	Yes	1.26 V	4160	CMOS	519	1800000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	4160 CLBS, 1800000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	280 MHz	30 s	409	260 °C (500 °F)	27 mm
XC3SD3400A-4CS484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3		19 mm	No		e0	250 MHz	30 s	249	225 °C (437 °F)	19 mm
XC3SD3400A-4CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	250 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-4FG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e0	250 MHz		409		27 mm
XC3SD3400A-4FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	250 MHz	30 s	409	260 °C (500 °F)	27 mm
XC3SD3400A-5CSG484C	Xilinx	FPGA	Commercial Extended	Ball	484	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	309	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3		19 mm	No		e1	280 MHz	30 s	249	260 °C (500 °F)	19 mm
XC3SD3400A-5FGG676C	Xilinx	FPGA	Commercial Extended	Ball	676	BGA	Square	Plastic/Epoxy	53712	Yes	1.26 V	5968	CMOS	469	3400000	1.2	1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	5968 CLBS, 3400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.6 mm	27 mm	No		e1	280 MHz	30 s	409	260 °C (500 °F)	27 mm
XC5VSX95T-3FF1136C	Xilinx	FPGA	Commercial Extended	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes	1.05 V	7360	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)		7360 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.4 mm	35 mm	No		e0	550 MHz	30 s	640	225 °C (437 °F)	35 mm
XC5VSX95T-3FFG1136C	Xilinx	FPGA	Commercial Extended	Ball	1136	BGA	Square	Plastic/Epoxy	94208	Yes		7360	CMOS	640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		7360 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.4 mm	35 mm	No		e1	1205 MHz	30 s	640	245 °C (473 °F)	35 mm
XC2S100E-6FT256C	Xilinx	FPGA	Commercial Extended	Ball	256	BGA	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2 mm	17 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	240 °C (464 °F)	17 mm
XC2S100E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	225 °C (437 °F)	28 mm
XC2S100E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	2700	Yes	1.89 V	600	CMOS	202	37000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	600 CLBS, 37000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 100000	e0	357 MHz	30 s	202	225 °C (437 °F)	20 mm
XC2S200E-6FG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	23 mm
XC2S200E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 150000	e0	357 MHz	30 s	289	225 °C (437 °F)	28 mm
XC2S300E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6912	Yes	1.89 V	1536	CMOS	329	93000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	1536 CLBS, 93000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 300000	e0	357 MHz	30 s	329	225 °C (437 °F)	28 mm
XC2S50E-6PQ208C	Xilinx	FPGA	Commercial Extended	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	28 mm
XC2S50E-6TQ144C	Xilinx	FPGA	Commercial Extended	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1728	Yes	1.89 V	384	CMOS	182	23000	1.8	1.5/3.3,1.8 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)	0.47 ns	384 CLBS, 23000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates = 50000	e0	357 MHz	30 s	182	225 °C (437 °F)	20 mm
XC2S200E-6FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS	289	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	289	250 °C (482 °F)	23 mm
10M02SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	2000	Yes	3.15 V	125		246		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
10M04SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	4000	Yes	3.15 V	250		246		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				246		15 mm
10M08SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				250		15 mm
10M08SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	8000	Yes	3.15 V	500		250		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		500 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				250		15 mm
10M16SAU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M16SCU324C8G	Intel	FPGA	Commercial Extended	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320		3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.