Military Field Programmable Gate Arrays (FPGA) 12

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC7V585T-3FFG1761E

Xilinx

FPGA

Military

Ball

1761

BGA

Square

Plastic/Epoxy

582720

Yes

1.03 V

45525

CMOS

750

1

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.97 V

1 mm

125 °C (257 °F)

0.58 ns

45525 CLBS

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B1761

4

3.5 mm

42.5 mm

No

e1

1818 MHz

30 s

750

245 °C (473 °F)

42.5 mm

XC7VX485T-3FFG1157E

Xilinx

FPGA

Military

Ball

1157

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

125 °C (257 °F)

0.58 ns

37950 CLBS

-55 °C (-67 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

3.35 mm

35 mm

No

e1

1818 MHz

600

35 mm

EPF8820GM883B-3

Altera

FPGA

Military

Pin/Peg

192

PGA

Square

Ceramic

672

No

CMOS

38535Q/M;38534H;883B

152

3.3/5,5 V

Grid Array

PGA192,17X17

Field Programmable Gate Arrays

2.54 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Perpendicular

S-XPGA-P192

No

e0

148

220 °C (428 °F)

EPF8820WM883B-3

Altera

FPGA

Military

Gull Wing

208

QFP

Square

Ceramic

672

Yes

CMOS

38535Q/M;38534H;883B

152

3.3/5,5 V

Flatpack

QFP208,1.2SQ,20

Field Programmable Gate Arrays

.5 mm

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-XQFP-G208

No

e0

148

220 °C (428 °F)

A54SX32-CQ256B

Microsemi

FPGA

Military

Flat

256

QFF

Square

Ceramic, Metal-Sealed Cofired

2880

Yes

3.63 V

2880

CMOS

MIL-STD-883 Class B

246

32000

3.3

3.3,5 V

Flatpack

TPAK256,3SQ,20

Field Programmable Gate Arrays

2.97 V

.5 mm

125 °C (257 °F)

1 ns

2880 CLBS, 32000 Gates

-55 °C (-67 °F)

Tin Lead

Quad

S-CQFP-F256

3.06 mm

36 mm

No

48000 system gates avaiable

e0

205 MHz

246

36 mm

A54SX32-CQ256M

Microsemi

FPGA

Military

Flat

256

QFF

Square

Ceramic, Metal-Sealed Cofired

2880

Yes

3.63 V

2880

CMOS

246

32000

3.3

3.3,5 V

Flatpack

TPAK256,3SQ,20

Field Programmable Gate Arrays

2.97 V

.5 mm

125 °C (257 °F)

1 ns

2880 CLBS, 32000 Gates

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQFP-F256

3.06 mm

36 mm

No

48000 system gates avaiable

e0

205 MHz

20 s

246

225 °C (437 °F)

36 mm

MPF300TS-FC484M

Microchip Technology

FPGA

Military

Ball

484

BGA

Square

Plastic/Epoxy

300000

Yes

1.03 V

CMOS

284

1

Grid Array

BGA484,22X22,40

.97 V

1 mm

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

S-PBGA-B484

3.39 mm

23 mm

It also Operates at 1.05 V nominal supply

284

23 mm

MPF300TS-FCV484M

Microchip Technology

FPGA

Military

Ball

484

FBGA

Square

Plastic/Epoxy

300000

Yes

1.03 V

CMOS

284

1

Grid Array, Fine Pitch

BGA484,22X22,32

.97 V

.8 mm

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

S-PBGA-B484

3.32 mm

19 mm

It also Operates at 1.05 V nominal supply

284

19 mm

MPF200TS-FCS325M

Microchip Technology

FPGA

Military

Ball

325

LFBGA

Rectangular

Plastic/Epoxy

192000

Yes

1.03 V

CMOS

170

1

Grid Array, Low Profile, Fine Pitch

BGA325,21X21,20

.97 V

.5 mm

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

R-PBGA-B325

1.45 mm

11 mm

It also Operates at 1.05 V nominal supply

170

14.5 mm

MPF300TS-FCS536M

Microchip Technology

FPGA

Military

Ball

536

LFBGA

Square

Plastic/Epoxy

300000

Yes

1.03 V

CMOS

300

1

Grid Array, Low Profile, Fine Pitch

BGA536,30X30,20

.97 V

.5 mm

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

S-PBGA-B536

1.45 mm

16 mm

It also Operates at 1.05 V nominal supply

300

16 mm

MPF500TS-FC784M

Microchip Technology

FPGA

Military

Ball

784

BGA

Square

Plastic/Epoxy

481000

Yes

1.03 V

CMOS

388

1

Grid Array

BGA784,28X28,40

.97 V

1 mm

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

S-PBGA-B784

3.47 mm

29 mm

It also Operates at 1.05 V nominal supply

388

29 mm

AX2000-1CGS624M

Microchip Technology

FPGA

Military

624

CGA

Square

Ceramic, Metal-Sealed Cofired

32526

Yes

1.575 V

21504

CMOS

418

2000000

1.5

Box

Grid Array

1.425 V

125 °C (257 °F)

21504 CLBS, 2000000 Gates

-55 °C (-67 °F)

Bottom

S-CBGA-X624

1060000 typical gates avaialable

418

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.