Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S1400AN-4FG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e0	667 MHz	30 s	408	225 °C (437 °F)	27 mm
XC3S1400AN-4FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	667 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S1400AN-5FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	25344	Yes	1.26 V	2816	CMOS	502	1400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	2816 CLBS, 1400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No	e1	770 MHz	30 s	408	250 °C (482 °F)	27 mm
XC3S200AN-4FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	667 MHz	30 s	160	240 °C (464 °F)	17 mm
XC3S200AN-5FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	770 MHz	30 s	160	240 °C (464 °F)	17 mm
XC3S200AN-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS	195	200000	1.2	1.2,1.2/3.3,3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	448 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	770 MHz	30 s	160	260 °C (500 °F)	17 mm
XC3S400AN-4FG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e0	667 MHz		248		21 mm
XC3S400AN-5FGG400C	Xilinx	FPGA	Other	Ball	400	BGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS	311	400000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA400,20X20,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	2.43 mm	21 mm	No	e1	770 MHz	30 s	248	250 °C (482 °F)	21 mm
XC3S50AN-5TQG144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	1584	Yes	1.26 V	176	CMOS	108	50000	1.2	1.2,1.2/3.3,3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.62 ns	176 CLBS, 50000 Gates	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	770 MHz	30 s	101	260 °C (500 °F)	20 mm
XC3S700AN-4FG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e0	667 MHz	30 s	288	225 °C (437 °F)	23 mm
XC3S700AN-4FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.71 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	667 MHz	30 s	288	250 °C (482 °F)	23 mm
XC3S700AN-5FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	13248	Yes	1.26 V	1472	CMOS	372	700000	1.2	1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	1472 CLBS, 700000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	e1	770 MHz	30 s	288	250 °C (482 °F)	23 mm
XC4VLX25-10FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1	1028 MHz	30 s	448	250 °C (482 °F)	27 mm
XC4VLX25-12FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	24192	Yes	1.26 V	2688	CMOS	448		1.2		Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		2688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1	1205 MHz	30 s	448	250 °C (482 °F)	27 mm
XC5VLX110-3FFG1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		800		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No	e1		30 s	800	245 °C (473 °F)	35 mm
XC5VLX110-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1		30 s	440	250 °C (482 °F)	27 mm
XC5VLX110T-3FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640		640		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No	e1		30 s	640	245 °C (473 °F)	35 mm
XC5VLX30-3FF324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No	e0		30 s	220	225 °C (437 °F)	19 mm
XC5VLX30-3FFG324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No	e1		30 s	220	250 °C (482 °F)	19 mm
XC5VLX30-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		400		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1		30 s	400	250 °C (482 °F)	27 mm
XC5VLX30T-3FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)		2400 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1	1412 MHz	30 s	360	250 °C (482 °F)	27 mm
XC5VLX50-3FF324C	Xilinx	FPGA	Other	Ball	324	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		220		1	1,2.5 V	Grid Array	BGA324,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B324	4	2.85 mm	19 mm	No	e0		30 s	220	225 °C (437 °F)	19 mm
XC5VLX50-3FF676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e0		30 s	440	225 °C (437 °F)	27 mm
XC5VLX50-3FFG1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	46080	Yes	1.05 V	3600		560		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No	e1		30 s	560	245 °C (473 °F)	35 mm
XC5VLX50T-3FFG1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	46080	Yes	10.5 V	3600		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	3600 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No	e1		30 s	480	245 °C (473 °F)	35 mm
XC5VLX85-3FFG1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		560		1	1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No	e1		30 s	560	245 °C (473 °F)	35 mm
XC5VLX85-3FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		440		1	1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No	e1		30 s	440	250 °C (482 °F)	27 mm
XC5VLX85T-3FF1136C	Xilinx	FPGA	Other	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480		480		1	1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	6480 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No	e0		30 s	480	225 °C (437 °F)	35 mm
XC5VSX35T-3FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	34816	Yes	1.05 V	2720	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	2720 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1		30 s	360	250 °C (482 °F)	27 mm
XC5VSX50T-3FFG665C	Xilinx	FPGA	Other	Ball	665	BGA	Square	Plastic/Epoxy	52224	Yes	1.05 V	4080	CMOS	360		1	1,2.5 V	Grid Array	BGA665,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.67 ns	4080 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B665	4	2.9 mm	27 mm	No	e1		30 s	360	250 °C (482 °F)	27 mm
XC6VHX250T-1FFG1154C	Xilinx	FPGA	Other	Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	320	245 °C (473 °F)	35 mm
XC6VHX250T-2FFG1154C	Xilinx	FPGA	Other	Ball	1154	BGA	Square	Plastic/Epoxy	251904	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC6VHX255T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	253440	Yes	1.05 V		CMOS	480		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	480	245 °C (473 °F)	45 mm
XC6VHX380T-1FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VHX380T-1FFG1924C	Xilinx	FPGA	Other	Ball	1924	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	640		1	1,1.2/2.5 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1924	4	3.85 mm	45 mm	No	e1	1098 MHz	30 s	640	245 °C (473 °F)	45 mm
XC6VHX380T-2FFG1154C	Xilinx	FPGA	Other	Ball	1154	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	320		1	1,1.2/2.5 V	Grid Array	BGA1154,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1154	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	320	245 °C (473 °F)	35 mm
XC6VHX380T-2FFG1155C	Xilinx	FPGA	Other	Ball	1155	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	440		1	1,1.2/2.5 V	Grid Array	BGA1155,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1155	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	440	245 °C (473 °F)	35 mm
XC6VHX380T-2FFG1923C	Xilinx	FPGA	Other	Ball	1923	BGA	Square	Plastic/Epoxy	382464	Yes	1.05 V		CMOS	720		1	1,1.2/2.5 V	Grid Array	BGA1923,44X44,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B1923	4	3.85 mm	45 mm	No	e1	1286 MHz	30 s	720	245 °C (473 °F)	45 mm
XC6VLX130T-1FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1098 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-1FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No	e0	1098 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX130T-1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX130T-1FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1098 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-1FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	5.08 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1098 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX130T-2FF1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e0	1286 MHz	30 s	600	225 °C (437 °F)	35 mm
XC6VLX130T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC6VLX130T-2FFG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	4	3 mm	23 mm	No	e1	1286 MHz	30 s	240	250 °C (482 °F)	23 mm
XC6VLX130T-2FFG784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.1 mm	29 mm	No	e1	1286 MHz	30 s	400	245 °C (473 °F)	29 mm
XC6VLX130T-L1FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	.93 V		CMOS	600		.9	1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	85 °C (185 °F)	5.87 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No	e1	1098 MHz	30 s	600	245 °C (473 °F)	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.