Other Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LCMXO2-7000HE-4BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

6864

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO2-7000HE-4TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

LCMXO2-7000ZE-1BG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LFBGA

Square

Plastic/Epoxy

6864

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA256,16X16,32

Field Programmable Gate Arrays

1.14 V

.8 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.7 mm

14 mm

No

e1

30 s

206

260 °C (500 °F)

14 mm

LCMXO2-7000ZE-1FTG256C

Lattice Semiconductor

FPGA

Other

Ball

256

LBGA

Square

Plastic/Epoxy

6864

Yes

1.26 V

206

1.2

Tray

1.2 V

Grid Array, Low Profile

BGA256,16X16,40

Field Programmable Gate Arrays

1.14 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

30 s

206

260 °C (500 °F)

17 mm

LCMXO2-7000ZE-1TG144C

Lattice Semiconductor

FPGA

Other

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6864

Yes

1.26 V

114

1.2

Tray

1.2 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e3

30 s

114

260 °C (500 °F)

20 mm

XC7K160T-L2FBG676E

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

.93 V

12675

CMOS

400

.9

0.9,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

.87 V

1 mm

100 °C (212 °F)

0.91 ns

12675 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

4

2.54 mm

27 mm

No

Also Operates at 1 V supply

e1

30 s

400

250 °C (482 °F)

27 mm

XC7V2000T-1FLG1925C

Xilinx

FPGA

Other

Ball

1925

BGA

Square

Plastic/Epoxy

1954560

Yes

1.03 V

152700

CMOS

1200

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

152700 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1925

3.75 mm

45 mm

No

e1

1818 MHz

1200

45 mm

XC7V2000T-2FHG1761C

Xilinx

FPGA

Other

Ball

1761

BGA

Square

Plastic/Epoxy

1954560

Yes

1.03 V

152700

CMOS

850

1

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

152700 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1761

3.75 mm

45 mm

No

e1

1818 MHz

850

45 mm

XC7V2000T-2FLG1925C

Xilinx

FPGA

Other

Ball

1925

BGA

Square

Plastic/Epoxy

1954560

Yes

1.03 V

152700

CMOS

1200

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

152700 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1925

3.75 mm

45 mm

No

e1

1818 MHz

1200

45 mm

XC7VX1140T-1FLG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

1139200

Yes

1.03 V

89000

CMOS

1100

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

89000 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.75 mm

45 mm

No

e1

1818 MHz

1100

45 mm

XC7VX1140T-2FLG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

1139200

Yes

1.03 V

89000

CMOS

1100

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

89000 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.75 mm

45 mm

No

e1

1818 MHz

1100

45 mm

XC7VX330T-1FFG1157C

Xilinx

FPGA

Other

Ball

1157

BGA

Square

Plastic/Epoxy

326400

Yes

1.03 V

25500

CMOS

600

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

25500 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

600

245 °C (473 °F)

35 mm

XC7VX330T-2FFG1157C

Xilinx

FPGA

Other

Ball

1157

BGA

Square

Plastic/Epoxy

326400

Yes

1.03 V

25500

CMOS

600

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

25500 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

600

245 °C (473 °F)

35 mm

XC7VX330T-2FFG1761C

Xilinx

FPGA

Other

Ball

1761

BGA

Square

Plastic/Epoxy

326400

Yes

1.03 V

25500

CMOS

650

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

25500 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1761

4

3.5 mm

42.5 mm

No

e1

1818 MHz

30 s

650

245 °C (473 °F)

42.5 mm

XC7VX415T-2FFG1157C

Xilinx

FPGA

Other

Ball

1157

BGA

Square

Plastic/Epoxy

412160

Yes

1.03 V

32200

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

32200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

600

245 °C (473 °F)

35 mm

XC7VX415T-2FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

412160

Yes

1.03 V

32200

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

32200 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX415T-2FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

412160

Yes

1.03 V

32200

CMOS

600

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

32200 CLBS

0 °C (32 °F)

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX485T-1FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

350

1

0.9,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX485T-1FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

600

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX485T-1FFG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

700

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.65 mm

45 mm

No

e1

1818 MHz

700

45 mm

XC7VX485T-2FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX485T-2FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

600

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX485T-2FFG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

37950

CMOS

700

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

37950 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.65 mm

45 mm

No

e1

1818 MHz

700

45 mm

XC7VX550T-1FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

554240

Yes

1.03 V

43300

CMOS

350

1

0.9,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

43300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX550T-1FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

554240

Yes

1.03 V

43300

CMOS

600

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

43300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX550T-2FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

554240

Yes

1.03 V

43300

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

43300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX550T-2FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

554240

Yes

1.03 V

43300

CMOS

600

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

43300 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX690T-1FFG1157C

Xilinx

FPGA

Other

Ball

1157

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

600

1

0.9,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

3.35 mm

35 mm

No

e1

1818 MHz

600

35 mm

XC7VX690T-1FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

350

1

0.9,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX690T-1FFG1761C

Xilinx

FPGA

Other

Ball

1761

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

850

1

0.9,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1761

3.5 mm

42.5 mm

No

e1

1818 MHz

850

42.5 mm

XC7VX690T-1FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

600

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX690T-1FFG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

1000

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.65 mm

45 mm

No

e1

1818 MHz

1000

45 mm

XC7VX690T-2FFG1157C

Xilinx

FPGA

Other

Ball

1157

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1157

3.35 mm

35 mm

No

e1

1818 MHz

600

35 mm

XC7VX690T-2FFG1158C

Xilinx

FPGA

Other

Ball

1158

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

350

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1158

4

3.35 mm

35 mm

No

e1

1818 MHz

30 s

350

245 °C (473 °F)

35 mm

XC7VX690T-2FFG1926C

Xilinx

FPGA

Other

Ball

1926

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

720

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

54150 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1926

4

3.65 mm

45 mm

No

e1

1818 MHz

30 s

720

245 °C (473 °F)

45 mm

XC7VX690T-2FFG1927C

Xilinx

FPGA

Other

Ball

1927

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

600

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1927

4

3.65 mm

45 mm

No

e1

1818 MHz

600

245 °C (473 °F)

45 mm

XC7VX690T-2FFG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

693120

Yes

1.03 V

54150

CMOS

1000

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

54150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.65 mm

45 mm

No

e1

1818 MHz

1000

45 mm

XC7VX980T-2FFG1930C

Xilinx

FPGA

Other

Ball

1930

BGA

Square

Plastic/Epoxy

979200

Yes

1.03 V

76500

CMOS

900

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

76500 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B1930

3.65 mm

45 mm

No

e1

1818 MHz

900

45 mm

LCMXO2-1200HC-4TG100CR1

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

1280

Yes

3.465 V

CMOS

80

2.5

2.5/3.3 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

No

e3

133 MHz

30 s

80

260 °C (500 °F)

LCMXO2-1200HC-4TG144CR1

Lattice Semiconductor

FPGA

Other

Gull Wing

144

QFP

Square

Plastic/Epoxy

1280

Yes

3.465 V

CMOS

108

2.5

2.5/3.3 V

Flatpack

QFP144,.87SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G144

3

No

e3

133 MHz

30 s

108

260 °C (500 °F)

LCMXO2-1200HC-5TG100CR1

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

1280

Yes

3.465 V

CMOS

80

2.5

2.5/3.3 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

No

e3

133 MHz

80

LCMXO2-1200ZE-1TG100CR1

Lattice Semiconductor

FPGA

Other

Gull Wing

100

QFP

Square

Plastic/Epoxy

1280

Yes

1.26 V

79

1.2

Tray

1.2 V

Flatpack

QFP100,.63SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

133 MHz

30 s

79

260 °C (500 °F)

14 mm

LCMXO2-256HC-6SG32C

Lattice Semiconductor

FPGA

Other

No Lead

32

HVQCCN

Square

256

Yes

3.465 V

32

21

2.5

Tray

2.5/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

32 CLBS

0 °C (32 °F)

Quad

S-XQCC-N32

.6 mm

5 mm

No

Also Operates at 3.3 V nominal supply

21

5 mm

LCMXO2-256ZE-1SG32C

Lattice Semiconductor

FPGA

Other

No Lead

32

HVQCCN

Square

256

Yes

1.26 V

32

21

1.2

Tray

1.2 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

32 CLBS

0 °C (32 °F)

Quad

S-XQCC-N32

.6 mm

5 mm

No

21

5 mm

LCMXO2-256ZE-2SG32C

Lattice Semiconductor

FPGA

Other

No Lead

32

HVQCCN

Square

256

Yes

1.26 V

32

21

1.2

Tray

1.2 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

32 CLBS

0 °C (32 °F)

Quad

S-XQCC-N32

.6 mm

5 mm

No

21

5 mm

XC7VX980T-1FFG1926C

Xilinx

FPGA

Other

Ball

1926

BGA

Square

Plastic/Epoxy

979200

Yes

1.03 V

76500

CMOS

720

1

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

76500 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1926

4

3.65 mm

45 mm

No

e1

1818 MHz

30 s

720

245 °C (473 °F)

45 mm

XC7VX980T-2FFG1926C

Xilinx

FPGA

Other

Ball

1926

BGA

Square

Plastic/Epoxy

979200

Yes

1.03 V

76500

CMOS

720

1

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

76500 CLBS

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B1926

4

3.65 mm

45 mm

No

e1

1818 MHz

30 s

720

245 °C (473 °F)

45 mm

LCMXO2-4000HE-6MG184C

Lattice Semiconductor

FPGA

Other

Ball

184

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

150

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA184,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B184

3

1.5 mm

8 mm

No

e1

150

8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.