1152 Field Programmable Gate Arrays (FPGA) 119

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
EP3SL110F1152C4G	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	107500	Yes	.94 V	4300		744	0.9	Grid Array	BGA1152,34X34,40	.86 V	1 mm	85 °C (185 °F)	4300 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm	It can also operate from 1.05 to 1.15 V supply	744	35 mm
MPF300T-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TL-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		0 °C (32 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TL-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
MPF300TS-1FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
5AGXMB1G4F35I5G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	136880	TSMC	704	1.1	Grid Array	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	136880 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		704	35 mm
EP4SGX230FF35I3G	Intel	FPGA	Industrial	Ball	1152	BGA	Square	Plastic/Epoxy	228000	Yes	.93 V	9120		564	.9	Grid Array	BGA1152,34X34,40	.87 V	1 mm	100 °C (212 °F)	9120 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.5 mm	35 mm		564	35 mm
5AGXFB3H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688	TSMC	704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		704	35 mm
5AGXFA5H4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		544	35 mm
5AGXFB7H4F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	504000	Yes	1.18 V	19024	TSMC	704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	19024 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		704	35 mm
5AGTFD3H3F35I3G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.18 V	13688		704	1.15	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.12 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		704	35 mm
5AGXMA7G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	242000	Yes	1.13 V	9168	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	9168 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		544	35 mm
5AGXMA5G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC	544	1.1	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	1.07 V	1 mm	100 °C (212 °F)	7170 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B1152	2.7 mm	35 mm		544	35 mm
MPF300T-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512	1	Grid Array	BGA1152,34X34,40	.97 V	1 mm	100 °C (212 °F)		-40 °C (-40 °F)	Bottom	S-PBGA-B1152	3.47 mm	35 mm	It also Operates at 1.05 V nominal supply	512	35 mm
EP2AGX190FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	181165	Yes	.93 V	7612		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	7612 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	2.55 mm	35 mm		612	35 mm
EP2AGX260FF35C6G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	244188	Yes	.93 V	10260		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	10260 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	2.55 mm	35 mm		612	35 mm
EP2AGX95EF35C4G	Intel	FPGA		Ball	1152	HBGA	Square	Plastic/Epoxy	89178	Yes	.93 V	3747		612	0.9	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	3747 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	2.55 mm	35 mm		612	35 mm
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	378000	Yes	.88 V	47250		430	0.85	Grid Array	BGA1152,34X34,40	.82 V	1 mm	100 °C (212 °F)	47250 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.706 mm	35 mm		430	35 mm
10AX032H2F35E1HG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes		11990	TSMC	384		Grid Array	BGA1152,34X34,40		1 mm	100 °C (212 °F)	11990 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.35 mm	35 mm		384	35 mm
EP4SGX360FF35C4G	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	353600	Yes	.93 V	14144		564	0.9	Grid Array	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	14144 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.3 mm	35 mm		564	35 mm
EP4SGX180FF35C3G	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	175750	Yes	.93 V	7030		564	0.9	Grid Array	BGA1152,34X34,40	.87 V	1 mm	85 °C (185 °F)	7030 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B1152	3.4 mm	35 mm		564	35 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.