132 Field Programmable Gate Arrays (FPGA) 49

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

LCMXO2-1200HC-5MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-1200HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-1200HC-6MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-1200ZE-1MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-1200ZE-2MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-2000HC-4MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

2112

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-2000HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

2112

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

133 MHz

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-256HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

256

Yes

3.465 V

55

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

55

250 °C (482 °F)

8 mm

LCMXO2-256ZE-1MG132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

256

Yes

1.26 V

55

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

55

250 °C (482 °F)

8 mm

LCMXO2-256ZE-1MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

256

Yes

1.26 V

55

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

55

250 °C (482 °F)

8 mm

LCMXO2-4000HC-5MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

3.465 V

104

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000HE-4MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000HE-5MG132I

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-1MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-2MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-4000ZE-3MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

4320

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

104

250 °C (482 °F)

8 mm

LCMXO2-640HC-4MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

640

Yes

3.465 V

79

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

79

250 °C (482 °F)

8 mm

LCMXO2-640HC-6MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

640

Yes

3.465 V

79

2.5

Tray

2.5/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

Also Operates at 3.3 V nominal supply

e1

30 s

79

250 °C (482 °F)

8 mm

LCMXO2-640ZE-1MG132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

640

Yes

1.26 V

79

1.2

Tray

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

30 s

79

250 °C (482 °F)

8 mm

LCMXO2-1200HC-4MG132IR1

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

3.465 V

CMOS

105

2.5

2.5/3.3 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

2.375 V

.5 mm

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

No

e1

133 MHz

30 s

105

260 °C (500 °F)

LCMXO2-1200ZE-1MG132IR1

Lattice Semiconductor

FPGA

Ball

132

BGA

Square

Plastic/Epoxy

1280

Yes

1.26 V

104

1.2

Tray

1.2 V

Grid Array

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

133 MHz

30 s

104

260 °C (500 °F)

8 mm

XC3164-3PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

4000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

2.7 ns

224 CLBS, 4000 Gates

0 °C (32 °F)

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

270 MHz

110

37.084 mm

XC3164-4PP132C

Xilinx

FPGA

Commercial

Pin/Peg

132

PGA

Square

Plastic/Epoxy

224

No

5.25 V

224

CMOS

110

4000

5

5 V

Grid Array

PGA132,14X14

Field Programmable Gate Arrays

4.75 V

2.54 mm

70 °C (158 °F)

3.3 ns

224 CLBS, 4000 Gates

0 °C (32 °F)

Tin Lead

Perpendicular

S-PPGA-P132

1

3.7338 mm

37.084 mm

No

MAX 120 I/OS; 688 flip-flops; typical gates = 4000 - 5500

e0

230 MHz

110

37.084 mm

XC3S100E-4CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

83

100000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

240 CLBS, 100000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

72

260 °C (500 °F)

8 mm

XC3S100E-4CPG132I

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

2160

Yes

1.26 V

240

CMOS

83

100000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

240 CLBS, 100000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

72

260 °C (500 °F)

8 mm

XA3S250E-4CPG132Q

Xilinx

FPGA

Automotive

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

AEC-Q100

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

4.88 ns

612 CLBS, 250000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

LAXP2-8E-5MN132E

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

AEC-Q100

86

8000

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

125 °C (257 °F)

8000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-5E-5MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-5E-5MN132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.494 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-5E-6MN132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

5000

Yes

1.26 V

625

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.399 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-8E-5MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.494 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-8E-6MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.399 ns

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

LFXP2-8E-6MN132I

Lattice Semiconductor

FPGA

Ball

132

LFBGA

Square

Plastic/Epoxy

8000

Yes

1.26 V

1000

CMOS

86

1.2

1.2,1.2/3.3,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.399 ns

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

435 MHz

40 s

86

260 °C (500 °F)

8 mm

XC3S50-4CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

89

50000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.61 ns

192 CLBS, 50000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

630 MHz

30 s

89

260 °C (500 °F)

8 mm

XC3S50-4CPG132I

Xilinx

FPGA

Ball

132

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

89

50000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

0.61 ns

192 CLBS, 50000 Gates

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

630 MHz

30 s

89

260 °C (500 °F)

8 mm

XC3S50-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

1728

Yes

1.26 V

192

CMOS

89

50000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.53 ns

192 CLBS, 50000 Gates

0 °C (32 °F)

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

725 MHz

30 s

89

260 °C (500 °F)

8 mm

XC3S250E-4CP132I

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

612 CLBS, 250000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e0

572 MHz

30 s

85

225 °C (437 °F)

8 mm

XC3S250E-4CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.76 ns

612 CLBS, 250000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

XC3S250E-4CPG132I

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

5508

Yes

1.26 V

612

CMOS

92

250000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

612 CLBS, 250000 Gates

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

572 MHz

30 s

85

260 °C (500 °F)

8 mm

XC3S500E-4CP132I

Xilinx

FPGA

Industrial

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

100 °C (212 °F)

0.76 ns

1164 CLBS, 500000 Gates

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e0

572 MHz

30 s

85

225 °C (437 °F)

8 mm

XC3S500E-5CPG132C

Xilinx

FPGA

Other

Ball

132

TFBGA

Square

Plastic/Epoxy

10476

Yes

1.26 V

1164

CMOS

92

500000

1.2

1.2,1.2/3.3,2.5 V

Grid Array, Thin Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.14 V

.5 mm

85 °C (185 °F)

0.66 ns

1164 CLBS, 500000 Gates

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.1 mm

8 mm

No

e1

657 MHz

30 s

85

260 °C (500 °F)

8 mm

LCMXO1200C-3MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

1200

Yes

3.465 V

150

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

150 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO1200C-3MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

1200

Yes

3.465 V

150

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

150 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO1200C-4MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

1200

Yes

3.465 V

150

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

150 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO2280C-3MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

285 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO2280C-3MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

285 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO2280C-4MN132I

Lattice Semiconductor

FPGA

Industrial

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

100 °C (212 °F)

285 CLBS

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

LCMXO2280C-5MN132C

Lattice Semiconductor

FPGA

Other

Ball

132

LFBGA

Square

Plastic/Epoxy

2280

Yes

3.465 V

285

101

1.8

1.8/3.3 V

Grid Array, Low Profile, Fine Pitch

BGA132,14X14,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

285 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B132

3

1.35 mm

8 mm

No

e1

40 s

101

260 °C (500 °F)

8 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.