1517 Field Programmable Gate Arrays (FPGA) 92

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU115-L1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1451100	Yes	.927 V	5520		832	.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.873 V	1 mm	100 °C (212 °F)	5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No	Also Operates at 0.95 V nominal supply	e1	30 s	832	245 °C (473 °F)	40 mm
XCVU065-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	600		520	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	600 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	520	245 °C (473 °F)	40 mm
XCVU080-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	975000	Yes	.979 V	672		832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	672 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	768 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	832	245 °C (473 °F)	40 mm
XCVU095-2FFVD1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	768		832	.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	768 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		832		40 mm
XCKU085-1FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1	30 s	676	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1	30 s	702	245 °C (473 °F)	40 mm
XCKU085-1FLVA1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)	62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.4 mm	40 mm	No		e1	30 s	676	245 °C (473 °F)	40 mm
XCKU085-3FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	1.03 V	62190		676	1	1 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1	30 s	676	245 °C (473 °F)	40 mm
XCKU095-1FFVC1517C	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	85 °C (185 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1	30 s	702	245 °C (473 °F)	40 mm
XCKU085-2FLVA1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1	30 s	676	245 °C (473 °F)	40 mm
XCKU095-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		702	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	67200 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm	No		e1	30 s	702	245 °C (473 °F)	40 mm
XCKU085-2FLVA1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1088325	Yes	.979 V	62190		676	0.95	0.95 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)	62190 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	4.09 mm	40 mm	No		e1	30 s	676	245 °C (473 °F)	40 mm
XCKU11P-1FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	512	245 °C (473 °F)	40 mm
XCKU11P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	512	245 °C (473 °F)	40 mm
XCKU11P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	512	245 °C (473 °F)	40 mm
XCKU11P-3FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.927 V	37320		512	0.9		Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	512	245 °C (473 °F)	40 mm
XCKU11P-L1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320		512	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	100 °C (212 °F)	37320 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		512		40 mm
XCKU11P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.742 V	37320		512	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1	30 s	512	245 °C (473 °F)	40 mm
XCKU15P-1FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-3FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.927 V	65340		668	0.9		Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	668	245 °C (473 °F)	40 mm
XCKU15P-L2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1	30 s	668	245 °C (473 °F)	40 mm
XCVU065-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	783300	Yes	.979 V	44760		520	0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	44760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1	30 s	520	245 °C (473 °F)	40 mm
XCVU095-H1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1176000	Yes	.979 V	67200		832	0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	100 °C (212 °F)	67200 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 1 V nominal supply	e1	30 s	832	245 °C (473 °F)	40 mm
XCVU3P-1FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	520	245 °C (473 °F)	40 mm
XCVU3P-2FFVC1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	520	245 °C (473 °F)	40 mm
XCVU3P-3FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.927 V	49260		520	0.9		Grid Array	BGA1517,39X39,40		.873 V	1 mm	100 °C (212 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	520	245 °C (473 °F)	40 mm
XCVU3P-L2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.742 V	49260		520	0.72		Grid Array	BGA1517,39X39,40		.698 V	1 mm	110 °C (230 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm		Also Operates at 0.85 V nominal supply	e1	30 s	520	245 °C (473 °F)	40 mm
XCKU11P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	653100	Yes	.876 V	37320		512	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	37320 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	512	245 °C (473 °F)	40 mm
XCKU15P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1	30 s	668	245 °C (473 °F)	40 mm
XCVU3P-2FFVC1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	862050	Yes	.876 V	49260		520	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)	49260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		520		40 mm
10AX066N1F40I1HG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)	25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm					588		40 mm
5AGXFB5K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	420000	Yes	1.13 V	15849	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	15849 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
5AGXFB7K4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	19024 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
EP4SGX230KF40C2G	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V	9120		744	.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	85 °C (185 °F)	9120 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm							40 mm
10AX066N2F40E1HG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC	588			Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)	25168 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm					588		40 mm
5AGXBB1D4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	11321 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
5AGXMB3G6F40C6G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	13688 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
5AGXFB3H4F40I5G	Intel	FPGA	Industrial	Ball	1517	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	100 °C (212 °F)	13688 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
5AGXFB1H4F40C5G	Intel	FPGA	Other	Ball	1517	HBGA	Square	Plastic/Epoxy	300000	Yes	1.13 V	11321	TSMC	704	1.1		Grid Array, Heat Sink/Slug	BGA1517,39X39,40		1.07 V	1 mm	85 °C (185 °F)	11321 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		2.7 mm	40 mm					704		40 mm
EP4SGX530KH40I4G	Intel	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	531200	Yes	.93 V	21248			0.9		Grid Array	BGA1517,39X39,40		.87 V	1 mm	100 °C (212 °F)	21248 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.4 mm	42.5 mm							42.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.