156 Field Programmable Gate Arrays (FPGA) 9

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Maximum Clock Frequency	No. of Outputs	Length
XC4005E-1PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.3 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 5000 Logic gates	166 MHz	112	42.164 mm
XC4005E-2PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 5000 Logic gates	125 MHz	112	42.164 mm
XC4005E-3PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 5000 Logic gates	125 MHz	112	42.164 mm
XC4005E-4PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.25 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 5000 Logic gates	111 MHz	112	42.164 mm
XC4005E-4PG156I	Xilinx	FPGA		Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	196	No	5.5 V	196	CMOS	112	3000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	196 CLBS, 3000 Gates		Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 5000 Logic gates	111 MHz	112	42.164 mm
XC4006E-2PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	1.6 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 6000 Logic gates	125 MHz	125	42.164 mm
XC4006E-3PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 6000 Logic gates	125 MHz	125	42.164 mm
XC4006E-4PG156C	Xilinx	FPGA	Other	Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.25 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.75 V	2.54 mm	85 °C (185 °F)	2.7 ns	256 CLBS, 4000 Gates	0 °C (32 °F)	Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 6000 Logic gates	111 MHz	125	42.164 mm
XC4006E-4PG156I	Xilinx	FPGA		Pin/Peg	156	HPGA	Square	Ceramic, Metal-Sealed Cofired	608	No	5.5 V	256	CMOS	125	4000	5	5 V	Grid Array, Heat Sink/Slug	PGA156,16X16	Field Programmable Gate Arrays	4.5 V	2.54 mm		2.7 ns	256 CLBS, 4000 Gates		Perpendicular	S-CPGA-P156	4.318 mm	42.164 mm	No	Max usable 6000 Logic gates	111 MHz	125	42.164 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.