2104 Field Programmable Gate Arrays (FPGA) 119

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCVU11P-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2835000	Yes	.876 V	162000	624	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	162000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		624		47.5 mm
XCVU13P-2FHGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.24 mm	52.5 mm	e1		832		52.5 mm
XCVU13P-2FHGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	52.5 mm	e1		832		52.5 mm
XCVU13P-2FHGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	52.5 mm	e1		832		52.5 mm
XCVU13P-2FIGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.59 mm	52.5 mm	e1		832		52.5 mm
XCVU35P-1FSVH2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1906800	Yes	.876 V	108960	416	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	108960 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.51 mm	47.5 mm	e1	30 s	416	240 °C (464 °F)	47.5 mm
XCVU5P-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-2FLVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU5P-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	75072 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-2FLVA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU7P-2FLVC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1724100	Yes	.876 V	98520	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	98520 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	e1	30 s	832	245 °C (473 °F)	47.5 mm
XCVU9P-2FLGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.24 mm	47.5 mm	e1		832		47.5 mm
XCVU9P-2FLGB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		832		47.5 mm
XCVU9P-2FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.32 mm	47.5 mm	e1		832		47.5 mm
XCVU9P-2FSGD2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780	832	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.59 mm	47.5 mm	e1		832		47.5 mm
XCVU29P-1FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm			676		52.5 mm
XCVU29P-2FIGD2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	3780000	Yes	.876 V	216000	676	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	216000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.59 mm	52.5 mm			676		52.5 mm
XCKU19P-2FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300	540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm
XCKU19P-1FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300	540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm
XCKU19P-1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300	540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm
XCKU19P-3FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.927 V	105300	540	0.9	Grid Array	BGA2104,46X46,40	.873 V	1 mm	100 °C (212 °F)	105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm
XCKU19P-L1FFVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.742 V	105300	540	0.72	Grid Array	BGA2104,46X46,40	.698 V	1 mm	100 °C (212 °F)	105300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm
XCKU19P-2FFVB2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	1842750	Yes	.876 V	105300	540	0.85	Grid Array	BGA2104,46X46,40	.825 V	1 mm	100 °C (212 °F)	105300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.27 mm	47.5 mm	e1		540		47.5 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.