225 Field Programmable Gate Arrays (FPGA) 57

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC7S25-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	.98 V	1825		150	0.95	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	150	13 mm
XC7S6-1CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	100	13 mm
XC7S6-1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	100	13 mm
XC7S6-2CSGA225C	Xilinx	FPGA	Other	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	85 °C (185 °F)	1.05 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1286 MHz	100	13 mm
XC7S6-2CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1286 MHz	100	13 mm
XC7S6-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469		100	0.95	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.92 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	100	13 mm
XC7S15-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	100	13 mm
XC7S25-1CSGA225Q	Xilinx	FPGA	Automotive	Ball	225	LFBGA	Square	Plastic/Epoxy	23360	Yes	1.05 V	1825		150	1	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	1825 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	1.4 mm	13 mm	e1	1098 MHz	150	13 mm
TI60F225I3	Efinix	FPGA		Ball	225	VFBGA	Square	Plastic/Epoxy	62016	Yes	.98 V		TSMC	163	0.95	Grid Array, Very Thin Profile, Fine Pitch	BGA225,15X15,25	.92 V	.65 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B225	1 mm	10 mm			163	10 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.