240 Field Programmable Gate Arrays (FPGA) 154

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XCV600E-6HQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

15552

Yes

1.89 V

3456

CMOS

158

186624

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

3456 CLBS, 186624 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

357 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV600E-6HQ240I

Xilinx

FPGA

Gull Wing

240

FQFP

Square

Plastic/Epoxy

15552

Yes

1.89 V

3456

CMOS

158

186624

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

0.47 ns

3456 CLBS, 186624 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

357 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV600E-7HQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

15552

Yes

1.89 V

3456

CMOS

158

186624

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.42 ns

3456 CLBS, 186624 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

400 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV600E-7HQ240I

Xilinx

FPGA

Gull Wing

240

FQFP

Square

Plastic/Epoxy

15552

Yes

1.89 V

3456

CMOS

158

186624

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

HQFP240,1.37SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

0.42 ns

3456 CLBS, 186624 Gates

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

400 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV100E-8PQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

158

32400

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.4 ns

600 CLBS, 32400 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

416 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV200E-8PQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

5292

Yes

1.89 V

1176

CMOS

158

63504

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.4 ns

1176 CLBS, 63504 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

416 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV300E-8PQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

6912

Yes

1.89 V

1536

CMOS

158

82944

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.4 ns

1536 CLBS, 82944 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

416 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV400E-8PQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

10800

Yes

1.89 V

2400

CMOS

158

129600

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.4 ns

2400 CLBS, 129600 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

416 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV50E-8PQ240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

1728

Yes

1.89 V

384

CMOS

158

20736

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.4 ns

384 CLBS, 20736 Gates

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e0

416 MHz

30 s

158

225 °C (437 °F)

32 mm

XCV100E-6PQG240C

Xilinx

FPGA

Other

Gull Wing

240

FQFP

Square

Plastic/Epoxy

2700

Yes

1.89 V

600

CMOS

158

32400

1.8

1.2/3.6,1.8 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

1.71 V

.5 mm

85 °C (185 °F)

0.47 ns

600 CLBS, 32400 Gates

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

e3

357 MHz

30 s

158

245 °C (473 °F)

32 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.