256 Field Programmable Gate Arrays (FPGA) 495

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
10CL025YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025YU256C8G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539			1.2	Grid Array, Low Profile, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	1539 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm						14 mm
10CL025ZU256I8G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	24624	Yes	1.03 V	1539		150	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.97 V	.8 mm	100 °C (212 °F)	1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm	-40 to 125 °C range is available as extended industrial			150		14 mm
LFD2NX-40-9BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-9BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-7BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-8BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LFD2NX-40-7BG256I	Lattice Semiconductor	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	111	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		e1	30 s	111	260 °C (500 °F)	14 mm
LIFCL-40-7BG256A	Lattice Semiconductor	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74	1	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	.95 V	.8 mm	125 °C (257 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.7 mm	14 mm			30 s	74	260 °C (500 °F)	14 mm
LFMXO5-25-8BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm				160		14 mm
LFMXO5-25-9BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm				160		14 mm
LFMXO5-25-7BBG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm				160		14 mm
LFMXO5-25-7BBG256C	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.05 V	3125	FDSOI	160	1	Grid Array, Low Profile, Fine Pitch		.95 V	.8 mm	85 °C (185 °F)		0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm				160		14 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.