432 Field Programmable Gate Arrays (FPGA) 61

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XC4036XLA-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1296

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.1 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Can also use 65000 gates

e0

227 MHz

30 s

288

225 °C (437 °F)

40 mm

XC4052XLA-08BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Can also use 100000 gates

e0

263 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4085XLA-08BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

7448

Yes

3.6 V

3136

CMOS

352

55000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Can also use 180000 gates

e0

263 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4085XLA-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

7448

Yes

3.6 V

3136

CMOS

352

55000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.1 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Can also use 180000 gates

e0

227 MHz

30 s

352

225 °C (437 °F)

40 mm

XCV300-4BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.8 ns

1536 CLBS, 322970 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV300-4BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.8 ns

1536 CLBS, 322970 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV300-5BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.7 ns

1536 CLBS, 322970 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV300-5BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.7 ns

1536 CLBS, 322970 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV300-6BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

2.625 V

1536

CMOS

316

322970

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.6 ns

1536 CLBS, 322970 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

333 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV400-4BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

10800

Yes

2.625 V

2400

CMOS

316

468252

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.8 ns

2400 CLBS, 468252 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV400-4BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

10800

Yes

2.625 V

2400

CMOS

316

468252

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.8 ns

2400 CLBS, 468252 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV400-5BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

10800

Yes

2.625 V

2400

CMOS

316

468252

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.7 ns

2400 CLBS, 468252 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV400-5BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

10800

Yes

2.625 V

2400

CMOS

316

468252

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.7 ns

2400 CLBS, 468252 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV400-6BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

10800

Yes

2.625 V

2400

CMOS

316

468252

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.6 ns

2400 CLBS, 468252 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

333 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV600-4BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.8 ns

3456 CLBS, 661111 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV600-4BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.8 ns

3456 CLBS, 661111 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV600-5BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.7 ns

3456 CLBS, 661111 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV600-5BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.7 ns

3456 CLBS, 661111 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV600-6BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

15552

Yes

2.625 V

3456

CMOS

316

661111

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.6 ns

3456 CLBS, 661111 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

333 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV800-4BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

21168

Yes

2.625 V

4704

CMOS

316

888439

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.8 ns

4704 CLBS, 888439 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV800-4BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

21168

Yes

2.625 V

4704

CMOS

316

888439

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.8 ns

4704 CLBS, 888439 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

250 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV800-5BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

21168

Yes

2.625 V

4704

CMOS

316

888439

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.7 ns

4704 CLBS, 888439 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV800-5BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

21168

Yes

2.625 V

4704

CMOS

316

888439

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

0.7 ns

4704 CLBS, 888439 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

294 MHz

30 s

316

225 °C (437 °F)

40 mm

XCV800-6BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

21168

Yes

2.625 V

4704

CMOS

316

888439

2.5

1.2/3.6,2.5 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

2.375 V

1.27 mm

85 °C (185 °F)

0.6 ns

4704 CLBS, 888439 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

333 MHz

30 s

316

225 °C (437 °F)

40 mm

XC4036XL-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1296

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Typical gates = 22000-65000

e0

217 MHz

30 s

288

225 °C (437 °F)

40 mm

XC4036XL-1BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1296

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 36000 Logic gates

e0

200 MHz

30 s

288

225 °C (437 °F)

40 mm

XC4036XL-1BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

1296

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

1296 CLBS, 22000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 36000 Logic gates

e0

200 MHz

30 s

288

225 °C (437 °F)

40 mm

XC4036XL-2BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1296

Yes

3.6 V

1296

CMOS

288

22000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

1296 CLBS, 22000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 36000 Logic gates

e0

179 MHz

30 s

288

225 °C (437 °F)

40 mm

XC4044XL-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1600

Yes

3.6 V

1600

CMOS

320

27000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

1600 CLBS, 27000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Typical gates = 27000-80000

e0

217 MHz

30 s

320

225 °C (437 °F)

40 mm

XC4044XL-3BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1600

Yes

3.6 V

1600

CMOS

320

27000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.6 ns

1600 CLBS, 27000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 44000 Logic gates

e0

166 MHz

30 s

320

225 °C (437 °F)

40 mm

XC4052XL-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Typical gates = 33000-100000

e0

217 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-1BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

200 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-1BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

1936 CLBS, 33000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

200 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-2BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

179 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-2BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.5 ns

1936 CLBS, 33000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

179 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-3BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.6 ns

1936 CLBS, 33000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

166 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4052XL-3BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

1936

Yes

3.6 V

1936

CMOS

352

33000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.6 ns

1936 CLBS, 33000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 52000 Logic gates

e0

166 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4062XL-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Typical gates = 40000-130000

e0

217 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-1BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.3 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

200 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-1BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

2304 CLBS, 40000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

200 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-2BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

179 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-2BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.5 ns

2304 CLBS, 40000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

179 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-3BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.6 ns

2304 CLBS, 40000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

166 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4062XL-3BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

2304

Yes

3.6 V

2304

CMOS

384

40000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.6 ns

2304 CLBS, 40000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 62000 Logic gates

e0

166 MHz

30 s

384

225 °C (437 °F)

40 mm

XC4085XL-09BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

7448

Yes

3.6 V

3136

CMOS

352

55000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.2 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Typical gates = 55000-180000

e0

217 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4085XL-1BG432I

Xilinx

FPGA

Ball

432

LBGA

Square

Plastic/Epoxy

7448

Yes

3.6 V

3136

CMOS

352

55000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

1.3 ns

3136 CLBS, 55000 Gates

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 85000 Logic gates

e0

200 MHz

30 s

352

225 °C (437 °F)

40 mm

XC4085XL-2BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

7448

Yes

3.6 V

3136

CMOS

352

55000

3.3

3.3 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

3 V

1.27 mm

85 °C (185 °F)

1.5 ns

3136 CLBS, 55000 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

Max usable 85000 Logic gates

e0

179 MHz

30 s

352

225 °C (437 °F)

40 mm

XCV300E-6BG432C

Xilinx

FPGA

Other

Ball

432

LBGA

Square

Plastic/Epoxy

6912

Yes

1.89 V

1536

CMOS

316

82944

1.8

1.2/3.6,1.8 V

Grid Array, Low Profile

BGA432,31X31,50

Field Programmable Gate Arrays

1.71 V

1.27 mm

85 °C (185 °F)

0.47 ns

1536 CLBS, 82944 Gates

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B432

3

1.7 mm

40 mm

No

e0

357 MHz

30 s

316

225 °C (437 °F)

40 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.