456 Field Programmable Gate Arrays (FPGA) 113

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2S200E-6FGG456C	Xilinx	FPGA	Commercial Extended	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	1.89 V	864	CMOS		289	52000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	864 CLBS, 52000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 150000	e1	357 MHz	30 s	289	250 °C (482 °F)	23 mm
XC2S400E-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	10800	Yes	1.89 V	2400	CMOS		410	145000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	2400 CLBS, 145000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 400000	e1	357 MHz	30 s	410	250 °C (482 °F)	23 mm
XC2S600E-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	15552	Yes	1.89 V	3456	CMOS		514	210000	1.8	1.2/3.6,1.8 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.47 ns	3456 CLBS, 210000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates = 600000	e1	357 MHz	30 s	514	250 °C (482 °F)	23 mm
XC2S200-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	1176 CLBS, 200000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 200000	e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC2S200-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC2S150-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			264	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XC2S150-6FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.6 ns	864 CLBS, 150000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No	Maximum usable gates 150000	e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XC2S150-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	3888	Yes	2.625 V	864			260	150000	2.5	1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	864 CLBS, 150000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s	260	250 °C (482 °F)	23 mm
XA3S1000-4FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	391	250 °C (482 °F)	23 mm
XA3S1000-4FGG456Q	Xilinx	FPGA	Automotive	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920		AEC-Q100	391	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	TQFP100,.63SQ	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		1920 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	125 MHz	30 s	391	250 °C (482 °F)	23 mm
XC3S2000-4FG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S2000-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S2000-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S2000-4FGG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	5120 CLBS, 2000000 Gates		Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	630 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S2000-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	725 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S1000L-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	17280	Yes		1920	CMOS		333	1000000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s	333	250 °C (482 °F)	23 mm
XC3S1500L-4FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes		3328	CMOS		333	1500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays		1 mm	85 °C (185 °F)		3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1		30 s	333	250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.