780 Field Programmable Gate Arrays (FPGA) 25

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Position Of Terminal	JESD-30 Code	Maximum Seated Height	Width	Additional Features	No. of Outputs	Length
EP3SE80F780C4LG	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	80000	Yes	.94 V	3200			.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	3200 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3.2 mm	29 mm	Also Operates at 1.1 V VCC nominal		29 mm
EP3SL150F780C4G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	5700 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply	488	29 mm
EP3SL50F780C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	47500	Yes	.94 V	1900		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	85 °C (185 °F)	1900 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply	488	29 mm
10CX105YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780				284
10CX105YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	104000	Yes	.93 V	38000	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	38000 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780				284
10CX150YF780E5G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780				284
10CX150YF780I5G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	150000	Yes	.93 V	54770	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	54770 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780				284
10CX220YF780E5G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780				284
10CX220YF780E6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780				284
10CX220YF780I5G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780				284
10CX220YF780I6G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	284	.9	Grid Array		.87 V		100 °C (212 °F)	80330 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780				284
10CL080YF780C6G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm			29 mm
10CL080YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	5079 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm			29 mm
10CL080YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	5079			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm			29 mm
10CL080ZF780I8G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1	Grid Array	BGA780,28X28,40	.97 V	1 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm	-40 to 125 °C range is available as extended industrial	423	29 mm
10CL120YF780C8G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2	Grid Array		1.15 V	1 mm	85 °C (185 °F)	7443 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm			29 mm
10CL120YF780I7G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy		Yes	1.25 V	7443			1.2	Grid Array		1.15 V	1 mm	100 °C (212 °F)	7443 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	2.4 mm	29 mm			29 mm
10AX027E1F29I1HG	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	270000	Yes	.98 V	10162	TSMC	360	.95	Grid Array		.92 V	1 mm	100 °C (212 °F)	10162 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3.35 mm	29 mm		360	29 mm
EP2AGX65DF29C6G	Intel	FPGA	Other	Ball	780	HBGA	Square	Plastic/Epoxy	60214	Yes	.93 V	2530		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	2530 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	2.6 mm	29 mm		372	29 mm
EP3SL70F780I3G	Intel	FPGA	Industrial	Ball	780	BGA	Square	Plastic/Epoxy	67500	Yes	.94 V	2700		488	0.9	Grid Array	BGA780,28X28,40	.86 V	1 mm	100 °C (212 °F)	2700 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	3 mm	29 mm	It can also operate from 1.05 to 1.15 V supply	488	29 mm
EP2AGX125EF29C4G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	4964 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	2.6 mm	29 mm		372	29 mm
EP2AGX125EF29I5G	Intel	FPGA		Ball	780	HBGA	Square	Plastic/Epoxy	118143	Yes	.93 V	4964		372	0.9	Grid Array, Heat Sink/Slug	BGA780,28X28,40	.87 V	1 mm	100 °C (212 °F)	4964 CLBS	-40 °C (-40 °F)	Bottom	S-PBGA-B780	2.6 mm	29 mm		372	29 mm
5AGZME1E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	220000	Yes	.88 V	8302		342	0.85	Grid Array	BGA780,28X28,40	.82 V	1 mm	85 °C (185 °F)	8302 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3.5 mm	33 mm		342	33 mm
5AGZME3E2H29C3G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	360000	Yes	.88 V	13584		342	0.85	Grid Array	BGA780,28X28,40	.82 V	1 mm	85 °C (185 °F)	13584 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3.5 mm	33 mm		342	33 mm
EP4SGX70DF29C4G	Intel	FPGA		Ball	780	BGA	Square	Plastic/Epoxy	72600	Yes	.93 V	2904		372	0.9	Grid Array	BGA780,28X28,40	.87 V	1 mm	85 °C (185 °F)	2904 CLBS	0 °C (32 °F)	Bottom	S-PBGA-B780	3.3 mm	29 mm		372	29 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.