FBGA Field Programmable Gate Arrays (FPGA) 179

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XCKU3P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304	0.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	100 °C (212 °F)	20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU3P-L2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.742 V	20340		304	0.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	110 °C (230 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm	Also Operates at 0.85 V nominal supply	e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-1SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-2SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-3SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.927 V	27120		304	0.9	Grid Array, Fine Pitch	BGA784,28X28,32	.873 V	.8 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-L1SFVB784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120		304	.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	100 °C (212 °F)	27120 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm	It also Operates at 0.85 V	e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-L2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.742 V	27120		304	0.72	Grid Array, Fine Pitch	BGA784,28X28,32	.698 V	.8 mm	110 °C (230 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm	Also Operates at 0.85 V nominal supply	e1	30 s	304	250 °C (482 °F)	23 mm
XCKU3P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
XCKU5P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	474600	Yes	.876 V	27120		304	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	27120 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm		e1	30 s	304	250 °C (482 °F)	23 mm
10CL016YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL016YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL016ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			340		19 mm
10CL040YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm		e1	30 s		260 °C (500 °F)	19 mm
10CL040YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL040YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL040ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			325		19 mm
10CL055YU484A7G	Intel	FPGA	Automotive	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	125 °C (257 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484C8G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	85 °C (185 °F)	3491 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	3491			1.2	Grid Array, Fine Pitch		1.15 V	.8 mm	100 °C (212 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm						19 mm
10CL055ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	55856	Yes	1.03 V	3491		321	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	3491 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			321		19 mm
10CL080YU484I7G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes		5079			1.2	Grid Array, Fine Pitch			.8 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.2 mm	19 mm						19 mm
10CL080ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	81264	Yes	1.03 V	5079		423	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)	5079 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm	-40 to 125 °C range is available as extended industrial			423		19 mm
MPF100T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			284		19 mm
MPF300TS-FCV484M	Microchip Technology	FPGA	Military	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	125 °C (257 °F)		-55 °C (-67 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			284		19 mm
MPF300TS-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			284	260 °C (500 °F)	19 mm
MPF300T-FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			284		19 mm
MPF100T-1FCVG484I	Microchip Technology	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	109000	Yes	1.03 V		CMOS	284	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		-40 °C (-40 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			284		19 mm
XCAU20P-1SFVB784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	13625 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm				228		23 mm
XCAU20P-1SFVB784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	13625 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm				228		23 mm
XCAU20P-2SFVB784E	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	13625 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm				228		23 mm
XCAU20P-2SFVB784I	Xilinx	FPGA		Ball	784	FBGA	Square	Plastic/Epoxy	238437	Yes	.876 V	13625		228	0.85	Grid Array, Fine Pitch	BGA784,28X28,32	.825 V	.8 mm	100 °C (212 °F)	13625 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B784		3.32 mm	23 mm				228		23 mm
M2S150TS-1FCV484M	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	146124	Yes	1.26 V			248	1.2	Grid Array, Fine Pitch	BGA484,22X22,32	1.14 V	.8 mm	125 °C (257 °F)		-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484		3.15 mm	19 mm		e0		248		19 mm
MPF050T-FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square	Plastic/Epoxy	48000	Yes	1.03 V		CMOS	176	1	Grid Array, Fine Pitch	BGA484,22X22,32	.97 V	.8 mm	100 °C (212 °F)		0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm	It also Operates at 1.05 V nominal supply			176		19 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.