HQFP Field Programmable Gate Arrays (FPGA) 12

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	No. of Outputs	Length
XC4028XLA-09HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.1 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 50000 gates	e0	227 MHz	256	28 mm
XC4085XLA-08HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	7448	Yes	3.6 V	3136	CMOS	129	55000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ	Field Programmable Gate Arrays	3 V	.65 mm		1 ns	3136 CLBS, 55000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Can also use 180000 gates	e0	263 MHz	129	28 mm
XC4028XL-2HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.5 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	179 MHz	256	28 mm
XC4028XL-2HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm		1.5 ns	1024 CLBS, 18000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	179 MHz	256	28 mm
XC4028XL-3HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1024	Yes	3.6 V	1024	CMOS	256	18000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	1024 CLBS, 18000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 28000 Logic gates	e0	166 MHz	256	28 mm
XC4036XL-1HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.3 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 36000 Logic gates	e0	200 MHz	288	28 mm
XC4036XL-1HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm		1.3 ns	1296 CLBS, 22000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 36000 Logic gates	e0	200 MHz	288	28 mm
XC4036XL-2HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.5 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 36000 Logic gates	e0	179 MHz	288	28 mm
XC4036XL-3HQ160C	Xilinx	FPGA	Other	Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm	85 °C (185 °F)	1.6 ns	1296 CLBS, 22000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 36000 Logic gates	e0	166 MHz	288	28 mm
XC4036XL-3HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	1296	Yes	3.6 V	1296	CMOS	288	22000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm		1.6 ns	1296 CLBS, 22000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 36000 Logic gates	e0	166 MHz	288	28 mm
XC4044XL-1HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm		1.3 ns	1600 CLBS, 27000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 44000 Logic gates	e0	200 MHz	320	28 mm
XC4044XL-3HQ160I	Xilinx	FPGA		Gull Wing	160	HQFP	Square	Plastic/Epoxy	1600	Yes	3.6 V	1600	CMOS	320	27000	3.3	3.3 V	Flatpack, Heat Sink/Slug	HQFP160,1.2SQ,20	Field Programmable Gate Arrays	3 V	.65 mm		1.6 ns	1600 CLBS, 27000 Gates		Tin Lead	Quad	S-PQFP-G160	3	4.1 mm	28 mm	No	Max usable 44000 Logic gates	e0	166 MHz	320	28 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.