TFBGA Field Programmable Gate Arrays (FPGA) 95

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC2V40-5CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.39 ns	64 CLBS, 40000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	750 MHz	30 s	88	260 °C (500 °F)	12 mm
XC2V40-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	576	Yes	1.575 V	64	CMOS	88	40000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.35 ns	64 CLBS, 40000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	820 MHz	30 s	88	260 °C (500 °F)	12 mm
XC2V80-4CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.44 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	650 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2V80-4CSG144I	Xilinx	FPGA		Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm		0.44 ns	128 CLBS, 80000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	650 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2V80-5CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.39 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	750 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2V80-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	1152	Yes	1.575 V	128	CMOS	92	80000	1.5	1.5,1.5/3.3,3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	1.425 V	.8 mm	85 °C (185 °F)	0.35 ns	128 CLBS, 80000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	820 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2S30-5CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 30000	e1	263 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2S30-5CSG144I	Xilinx	FPGA	Industrial	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.7 ns	216 CLBS, 30000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1	263 MHz	30 s	92	260 °C (500 °F)	12 mm
XC2S30-6CSG144C	Xilinx	FPGA	Other	Ball	144	TFBGA	Square	Plastic/Epoxy	972	Yes	2.625 V	216		92	30000	2.5	1.5/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA144,13X13,32	Field Programmable Gate Arrays	2.375 V	.8 mm	85 °C (185 °F)	0.6 ns	216 CLBS, 30000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	Maximum usable gates 30000	e1	263 MHz	30 s	92	260 °C (500 °F)	12 mm
XC3S50-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.61 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	630 MHz	30 s	89	260 °C (500 °F)	8 mm
XC3S50-4CPG132I	Xilinx	FPGA		Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm		0.61 ns	192 CLBS, 50000 Gates		Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	630 MHz	30 s	89	260 °C (500 °F)	8 mm
XC3S50-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	1728	Yes	1.26 V	192	CMOS	89	50000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.53 ns	192 CLBS, 50000 Gates	0 °C (32 °F)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	725 MHz	30 s	89	260 °C (500 °F)	8 mm
XC3S250E-4CP132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XC3S250E-4CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.76 ns	612 CLBS, 250000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3S250E-4CPG132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	5508	Yes	1.26 V	612	CMOS	92	250000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	612 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	572 MHz	30 s	85	260 °C (500 °F)	8 mm
XC3S500E-4CP132I	Xilinx	FPGA	Industrial	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.76 ns	1164 CLBS, 500000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e0	572 MHz	30 s	85	225 °C (437 °F)	8 mm
XC3S500E-5CPG132C	Xilinx	FPGA	Other	Ball	132	TFBGA	Square	Plastic/Epoxy	10476	Yes	1.26 V	1164	CMOS	92	500000	1.2	1.2,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.66 ns	1164 CLBS, 500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.1 mm	8 mm	No		e1	657 MHz	30 s	85	260 °C (500 °F)	8 mm
LIFCL-40-7MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LIFCL-40-7MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LIFCL-40-8MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LIFCL-40-8MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LIFCL-40-9MG289C	Lattice Semiconductor	FPGA	Other	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
LIFCL-40-9MG289I	Lattice Semiconductor	FPGA	Industrial	Ball	289	TFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	74		1		Grid Array, Thin Profile, Fine Pitch	BGA289,17X17,20		.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B289		1.2 mm	9.5 mm						74		9.5 mm
XC6SLX16-N3CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	14579	Yes	1.26 V	1139	CMOS	106		1.2	1.2,1.2/3.3,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	1139 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e1	806 MHz	30 s	106	260 °C (500 °F)	8 mm
XC7S15-1CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S15-1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S15-2CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	1000 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
XC7S15-2CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
XC7S15-L1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	.98 V	1000		100		0.95		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S6-1CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.27 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S6-1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S6-2CPGA196C	Xilinx	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	85 °C (185 °F)	1.05 ns	469 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
XC7S6-2CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	100 °C (212 °F)	1.05 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1286 MHz		100		8 mm
XC7S6-L1CPGA196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469		100		0.95		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.92 V	.5 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196		1.1 mm	8 mm			e1	1098 MHz		100		8 mm
XC7S15-1CPGA196Q	Xilinx	FPGA	Automotive	Ball	196	TFBGA	Square	Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.1 mm	8 mm			e3	1098 MHz		100		8 mm
XC7S6-1CPGA196Q	Xilinx	FPGA	Automotive	Ball	196	TFBGA	Square	Plastic/Epoxy	6000	Yes	1.05 V	469		100		1		Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		.95 V	.5 mm	125 °C (257 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.1 mm	8 mm			e3	1098 MHz		100		8 mm
ICE40HX4K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS			1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2				260 °C (500 °F)	9 mm
ICE40HX4K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	93		1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121TR	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
ICE40HX8K-BG121	Lattice Semiconductor	FPGA	Industrial	Ball	121	TFBGA	Square	Plastic/Epoxy	7680	Yes	1.26 V	960	CMOS	93		1.2		Grid Array, Thin Profile, Fine Pitch			1.14 V	.8 mm	100 °C (212 °F)	7.3 ns	960 CLBS	-40 °C (-40 °F)	Tin Silver Copper Nickel	Bottom	S-PBGA-B121	3	1.1 mm	9 mm			e2			93	260 °C (500 °F)	9 mm
10CL010YM164C6G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL010YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL010YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL010ZM164I8G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy	10320	Yes	1.03 V	645		176		1		Grid Array, Thin Profile, Fine Pitch	BGA164,15X15,20		.97 V	.5 mm	100 °C (212 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm		-40 to 125 °C range is available as extended industrial				176		8 mm
10CL016YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL016YM164I7G	Intel	FPGA	Industrial	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963				1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
LIF-MDF6000-6KMG80I	Lattice Semiconductor	FPGA	Industrial	Ball	80	TFBGA	Square	Plastic/Epoxy	5936	Yes	1.26 V	742		37		1.2		Grid Array, Thin Profile, Fine Pitch	BGA80,10X10,26		1.14 V	.65 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B80		1.2 mm	7 mm						37		7 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.