VFBGA Field Programmable Gate Arrays (FPGA) 107

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Packing Method	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO3L-4300E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1		100	260 °C (500 °F)	6 mm
LCMXO3L-4300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
LCMXO3L-4300E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1		206	260 °C (500 °F)	9 mm
LCMXO3L-4300E-5MG324C	Lattice Semiconductor	FPGA	Other	Ball	324	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm	e1	30 s		260 °C (500 °F)	10 mm
LCMXO3L-4300E-5MG324I	Lattice Semiconductor	FPGA		Ball	324	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		268	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm	e1	30 s	268	260 °C (500 °F)	10 mm
LCMXO3L-4300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1			260 °C (500 °F)	6 mm
LCMXO3L-4300E-6MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		100	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1		100	260 °C (500 °F)	6 mm
LCMXO3L-4300E-6MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
LCMXO3L-4300E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1		206	260 °C (500 °F)	9 mm
LCMXO3L-4300E-6MG324C	Lattice Semiconductor	FPGA	Other	Ball	324	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm	e1	30 s		260 °C (500 °F)	10 mm
LCMXO3L-4300E-6MG324I	Lattice Semiconductor	FPGA		Ball	324	VFBGA	Square	Plastic/Epoxy	4300	Yes	1.26 V	540		268	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1 mm	10 mm	e1	30 s	268	260 °C (500 °F)	10 mm
LCMXO3L-640E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1			260 °C (500 °F)	6 mm
LCMXO3L-640E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80		100	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1		100	260 °C (500 °F)	6 mm
LCMXO3L-640E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1			260 °C (500 °F)	6 mm
ICE40LM2K-CM49TR1K	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	256	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		256 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B49		1 mm	3 mm					3 mm
LIFCL-17-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-8MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V			48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-7MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LIFCL-40-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	48	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm		30 s	48	260 °C (500 °F)	6 mm
LCMXO3LF-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
LCMXO3LF-1300E-5UWG36CTR1K	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					2.541 mm
LCMXO3LF-1300E-5UWG36CTR50	Lattice Semiconductor	FPGA	Other	Ball	36	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	160			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm					2.541 mm
LCMXO3LF-1300E-5UWG36ITR50	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm			28		2.541 mm
LCMXO3LF-1300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1			260 °C (500 °F)	6 mm
LCMXO3LF-2100E-5UWG49CTR50	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm	e1			260 °C (500 °F)	3.185 mm
LCMXO3LF-2100E-5UWG49CTR	Lattice Semiconductor	FPGA	Other	Ball	49	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	264			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm	e1			260 °C (500 °F)	3.185 mm
LCMXO3LF-2100E-5UWG49ITR50	Lattice Semiconductor	FPGA		Ball	49	VFBGA	Rectangular	Plastic/Epoxy	2100	Yes	1.26 V	264		38	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B49	3	.6 mm	3.106 mm	e1		38	260 °C (500 °F)	3.185 mm
LCMXO3LF-2100E-6MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	2100	Yes	1.26 V	264		100	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1		100	260 °C (500 °F)	6 mm
LCMXO3LF-4300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
LCMXO3LF-4300E-5UWG81CTR50	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm	e1			260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81CTR	Lattice Semiconductor	FPGA	Other	Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	540			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm	e1			260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR50	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm	e1		63	260 °C (500 °F)	3.797 mm
LCMXO3LF-4300E-5UWG81ITR	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy	4300	Yes	1.26 V	540		63	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	R-PBGA-B81	1	.567 mm	3.693 mm	e1		63	260 °C (500 °F)	3.797 mm
LCMXO3LF-6900E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	858			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
LCMXO3LF-6900E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	6900	Yes	1.26 V	858		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1		206	260 °C (500 °F)	9 mm
LCMXO3LF-6900E-6MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	858			1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1			260 °C (500 °F)	9 mm
ICE5LP4K-SWG36ITR50	Lattice Semiconductor	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	440	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.35 mm	100 °C (212 °F)		440 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36	1	.491 mm	2.078 mm		30 s		260 °C (500 °F)	2.078 mm
LCMXO3LF-9400E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1		206	260 °C (500 °F)	9 mm
LCMXO3LF-9400E-6MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175		206	1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm	e1		206	260 °C (500 °F)	9 mm
ICE40UP3K-UWG30ITR1K	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm		30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP3K-UWG30ITR50	Lattice Semiconductor	FPGA		Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm		30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP3K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy	2800	Yes	1.26 V	350	CMOS	21	1.2	Tape and Reel	Grid Array, Very Thin Profile, Fine Pitch	BGA30,5X6,16	1.14 V	.4 mm	100 °C (212 °F)	9 ns	350 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm		30 s	21	260 °C (500 °F)	2.537 mm
ICE40UP5K-UWG30ITR	Lattice Semiconductor	FPGA	Industrial	Ball	30	VFBGA	Rectangular	Plastic/Epoxy		Yes	1.26 V	660	CMOS		1.2		Grid Array, Very Thin Profile, Fine Pitch		1.14 V	.4 mm	100 °C (212 °F)		660 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B30	1	.6 mm	2.114 mm		30 s		260 °C (500 °F)	2.537 mm
LFD2NX-40-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI	23	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm
LFD2NX-17-9MG121I	Lattice Semiconductor	FPGA	Industrial	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI	23	1		Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20	.95 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm	e1	30 s	23	260 °C (500 °F)	6 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.