Square Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
LCMXO3L-1300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	160					2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-1300C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-2100C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	264					2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	540					2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		540 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-4300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4300	Yes	3.465 V	540			206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		540 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858					2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-6900C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858					2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3L-6900C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	6900	Yes	3.465 V	858			206		2.5		Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
EPF8820GM883B-3	Altera	FPGA	Military	Pin/Peg	192	PGA	Square	Ceramic	672	No			CMOS	38535Q/M;38534H;883B	152			3.3/5,5 V	Grid Array	PGA192,17X17	Field Programmable Gate Arrays		2.54 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Perpendicular	S-XPGA-P192				No		e0			148	220 °C (428 °F)
EPF8820WM883B-3	Altera	FPGA	Military	Gull Wing	208	QFP	Square	Ceramic	672	Yes			CMOS	38535Q/M;38534H;883B	152			3.3/5,5 V	Flatpack	QFP208,1.2SQ,20	Field Programmable Gate Arrays		.5 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Quad	S-XQFP-G208				No		e0			148	220 °C (428 °F)
XCS30XL-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS40XL-5BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	205	225 °C (437 °F)	27 mm
XCS05XL-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Maximum usable gates 5000	e0	250 MHz	30 s	77	225 °C (437 °F)	29.3116 mm
XCS10XL-5PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	MAXIMUM usable gates 10000	e0	250 MHz	30 s	112	225 °C (437 °F)	29.3116 mm
XCS05XL-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	100 CLBS, 2000 Gates		Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e0	217 MHz	30 s	77	225 °C (437 °F)	14 mm
XCS05XL-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	100	Yes	3.6 V	100	CMOS		77	2000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	100 CLBS, 2000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 5000	e0	250 MHz	30 s	77	240 °C (464 °F)	14 mm
XCS10XL-4VQ100I	Xilinx	FPGA		Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	196 CLBS, 3000 Gates		Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAXIMUM usable gates 10000	e0	217 MHz	30 s	112	225 °C (437 °F)	14 mm
XCS10XL-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	MAXIMUM usable gates 10000	e0	250 MHz	30 s	112	240 °C (464 °F)	14 mm
XCS20XL-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 20000	e0	250 MHz	30 s	160	240 °C (464 °F)	14 mm
XCS30XL-5VQ100C	Xilinx	FPGA	Other	Gull Wing	100	TFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G100	3	1.2 mm	14 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	240 °C (464 °F)	14 mm
XCS10XL-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	196	Yes	3.6 V	196	CMOS		112	3000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	196 CLBS, 3000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	MAXIMUM usable gates 10000	e0	250 MHz	30 s	112	225 °C (437 °F)	20 mm
XCS20XL-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	217 MHz	30 s	160	225 °C (437 °F)	20 mm
XCS20XL-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 20000	e0	250 MHz	30 s	160	225 °C (437 °F)	20 mm
XCS30XL-4TQ144I	Xilinx	FPGA		Gull Wing	144	LFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	20 mm
XCS30XL-5TQ144C	Xilinx	FPGA	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	225 °C (437 °F)	20 mm
XCS20XL-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	400 CLBS, 7000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 20000	e0	217 MHz	30 s	160	225 °C (437 °F)	28 mm
XCS20XL-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	400	Yes	3.6 V	400	CMOS		160	7000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	400 CLBS, 7000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 20000	e0	250 MHz	30 s	160	225 °C (437 °F)	28 mm
XCS30XL-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	576 CLBS, 10000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	28 mm
XCS30XL-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	225 °C (437 °F)	28 mm
XCS40XL-4PQ208I	Xilinx	FPGA		Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm		1.1 ns	784 CLBS, 13000 Gates		Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	28 mm
XCS40XL-5PQ208C	Xilinx	FPGA	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	205	225 °C (437 °F)	28 mm
XCS30XL-5PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 30000	e0	250 MHz	30 s	196	225 °C (437 °F)	32 mm
XCS40XL-5PQ240C	Xilinx	FPGA	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	3 V	.5 mm	85 °C (185 °F)	1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	Maximum usable gates 40000	e0	250 MHz	30 s	205	225 °C (437 °F)	32 mm
XC6VLX195T-3FF784C	Xilinx	FPGA	Other	Ball	784	BGA	Square	Plastic/Epoxy	199680	Yes	1.05 V		CMOS		400		1	1,1.2/2.5 V	Grid Array	BGA784,28X28,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B784	4	2.86 mm	29 mm	No		e0	1412 MHz	30 s	400	220 °C (428 °F)	29 mm
XC6VLX240T-3FF1759C	Xilinx	FPGA	Other	Ball	1759	BGA	Square	Plastic/Epoxy	241152	Yes	1.05 V		CMOS		720		1	1,1.2/2.5 V	Grid Array	BGA1759,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1759	4	3.5 mm	42.5 mm	No		e0	1412 MHz	30 s	720	225 °C (437 °F)	42.5 mm
XC6VLX75T-3FF484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74496	Yes	1.05 V		CMOS		240		1	1,1.2/2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	4	3 mm	23 mm	No		e0	1412 MHz	30 s	240	220 °C (428 °F)	23 mm
XCS30-3BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		196	10000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	125 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS30-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	5.25 V	576	CMOS		196	10000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	166 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS30XL-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	576	Yes	3.6 V	576	CMOS		196	10000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	576 CLBS, 10000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 30000	e0	217 MHz	30 s	196	225 °C (437 °F)	27 mm
XCS40-3BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS		205	13000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.6 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	125 MHz	30 s	205	225 °C (437 °F)	27 mm
XCS40-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	5.25 V	784	CMOS		205	13000	5	5 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	1.2 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	166 MHz	30 s	205	225 °C (437 °F)	27 mm
XCS40XL-4BG256C	Xilinx	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	784	Yes	3.6 V	784	CMOS		205	13000	3.3	3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	3 V	1.27 mm	85 °C (185 °F)	1.1 ns	784 CLBS, 13000 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B256	3	2.55 mm	27 mm	No	Maximum usable gates 40000	e0	217 MHz	30 s	205	225 °C (437 °F)	27 mm
XC3030A-7PC44C	Xilinx	FPGA	Other	J Bend	44	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		34	1500	5	5 V	Chip Carrier	LDCC44,.7SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	34	225 °C (437 °F)	16.5862 mm
XC3120A-3PC68C	Xilinx	FPGA	Other	J Bend	68	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		58	1000	5	5 V	Chip Carrier	LDCC68,1.0SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	2.7 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68	1	5.08 mm	24.2316 mm	No	Max usable 1500 Logic gates	e0	270 MHz		58		24.2316 mm
XC3020A-7PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	64	Yes	5.25 V	64	CMOS		64	1000	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	64 CLBS, 1000 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 1500 Logic gates	e0	113 MHz	30 s	64	225 °C (437 °F)	29.3116 mm
XC3030A-7PC84C	Xilinx	FPGA	Other	J Bend	84	QCCJ	Square	Plastic/Epoxy	100	Yes	5.25 V	100	CMOS		74	1500	5	5 V	Chip Carrier	LDCC84,1.2SQ	Field Programmable Gate Arrays	4.75 V	1.27 mm	85 °C (185 °F)	5.1 ns	100 CLBS, 1500 Gates	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J84	3	5.08 mm	29.3116 mm	No	Max usable 2000 Logic gates	e0	113 MHz	30 s	74	225 °C (437 °F)	29.3116 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.