FPGA Field Programmable Gate Arrays (FPGA) 2,400+

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Logic Cells Surface Mount Maximum Supply Voltage No. of CLBs Technology Used Screening Level No. of Inputs No. of Equivalent Gates Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Pitch Of Terminal Maximum Operating Temperature Maximum Combinatorial Delay of a CLB Organization Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length

XA6SLX25-2FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

24051

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XA6SLX25-3FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

24051

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XA6SLX9-2FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

9152

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XA6SLX9-3FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

9152

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XA6SLX16-2FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

14579

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XA6SLX16-3FTG256Q

Xilinx

FPGA

Ball

256

BGA

Square

Plastic

14579

Yes

AEC-Q100

186

1.2,2.5/3.3 V

Grid Array

BGA256,16X16,40

Field Programmable Gate Arrays

1 mm

Tin Silver Copper

Bottom

S-PBGA-B256

3

No

e1

62.5 MHz

30 s

186

260 °C (500 °F)

XC7K160T-1FF676C

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B676

No

e0

1818 MHz

400

XC7K160T-2FF676C

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B676

No

e0

1818 MHz

400

XC7K325T-1FB676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

326080

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B676

4

No

e0

1818 MHz

30 s

400

225 °C (437 °F)

XC7K325T-1FB676C

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

326080

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B676

4

No

e0

1818 MHz

30 s

400

225 °C (437 °F)

XC7K325T-1FF676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

326080

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B676

No

e0

1818 MHz

400

XC7K325T-1FF900C

Xilinx

FPGA

Ball

900

BGA

Square

Plastic/Epoxy

326080

Yes

CMOS

500

1,1.8,3.3 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B900

4

No

e0

1818 MHz

30 s

500

225 °C (437 °F)

XC7K355T-1FF901I

Xilinx

FPGA

Ball

900

BGA

Square

Plastic/Epoxy

356160

Yes

CMOS

300

1,1.8,3.3 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B900

4

No

e0

1818 MHz

30 s

300

225 °C (437 °F)

XC7K410T-1FF900I

Xilinx

FPGA

Ball

900

BGA

Square

Plastic/Epoxy

406720

Yes

CMOS

500

1,1.8,3.3 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B900

4

No

e0

1818 MHz

30 s

500

225 °C (437 °F)

XC7K410T-2FF676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

406720

Yes

CMOS

400

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B676

No

e0

1818 MHz

400

XC7K410T-2FB900I

Xilinx

FPGA

Ball

900

BGA

Square

Plastic/Epoxy

406720

Yes

CMOS

500

1,1.8,3.3 V

Grid Array

BGA900,30X30,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B900

4

No

e0

1818 MHz

30 s

500

225 °C (437 °F)

XC7V585T-1FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

582720

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7V585T-1FF1761I

Xilinx

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

582720

Yes

CMOS

750

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1760

No

e0

1818 MHz

750

XC7VX330T-1FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

326400

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX330T-1FF1761I

Xilinx

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

326400

Yes

CMOS

650

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1760

No

e0

1818 MHz

650

XC7VX330T-2FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

326400

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX415T-1FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

412160

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX415T-2FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

412160

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX415T-2FF1158I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

412160

Yes

CMOS

350

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC7VX485T-1FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX485T-1FF1927C

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

485760

Yes

.93 V

CMOS

600

0.9

0.9,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

.87 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

600

XC7VX485T-2FF1157C

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

600

1

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX485T-2FF1761C

Xilinx

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

485760

Yes

1.03 V

CMOS

700

1

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0 °C (32 °F)

Tin/Lead

Bottom

S-PBGA-B1760

No

e0

1818 MHz

700

XC7VX690T-1FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX690T-1FF1761I

Xilinx

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

850

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1760

No

e0

1818 MHz

850

XC7VX690T-2FF1157I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

600

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

100 °C (212 °F)

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B1156

4

No

e0

1818 MHz

600

XC7VX690T-2FF1158I

Xilinx

FPGA

Ball

1156

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

350

1,1.8 V

Grid Array

BGA1156,34X34,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1156

No

e0

1818 MHz

350

XC7VX690T-2FF1761C

Xilinx

FPGA

Ball

1760

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

850

1,1.8 V

Grid Array

BGA1760,42X42,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1760

No

e0

1818 MHz

850

XC7VX690T-2FF1926I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

720

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

720

XC7VX690T-2FF1930I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

693120

Yes

CMOS

1000

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

1000

XC7VX980T-1FF1930I

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

979200

Yes

CMOS

900

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

900

XC7VX980T-L2FF1926E

Xilinx

FPGA

Ball

1924

BGA

Square

Plastic/Epoxy

979200

Yes

CMOS

720

1,1.8 V

Grid Array

BGA1924,44X44,40

Field Programmable Gate Arrays

1 mm

Tin/Lead

Bottom

S-PBGA-B1924

No

e0

1818 MHz

720

XC7K70T-1FB484I

Xilinx

FPGA

Ball

484

BGA

Square

Plastic

65600

Yes

CMOS

185

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B484

4

No

e0

1818 MHz

30 s

185

225 °C (437 °F)

XC7K70T-1FB676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic

65600

Yes

CMOS

185

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B676

4

No

e0

1818 MHz

30 s

185

225 °C (437 °F)

XC7K70T-2FB484I

Xilinx

FPGA

Ball

484

BGA

Square

Plastic

65600

Yes

CMOS

185

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

1 mm

Tin Lead

Bottom

S-PBGA-B484

4

No

e0

1818 MHz

30 s

185

225 °C (437 °F)

XC7K160T-1FBG484C

Xilinx

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

285

1

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

12675 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

4

2.54 mm

23 mm

No

e1

1098 MHz

30 s

285

250 °C (482 °F)

23 mm

XC7K160T-1FBG484I

Xilinx

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

285

1

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.97 V

1 mm

0.74 ns

12675 CLBS

Tin Silver Copper

Bottom

S-PBGA-B484

4

2.54 mm

23 mm

No

e1

1098 MHz

30 s

285

250 °C (482 °F)

23 mm

XC7K160T-1FBG676C

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

400

1

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

12675 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

4

2.54 mm

27 mm

No

e1

1098 MHz

30 s

400

250 °C (482 °F)

27 mm

XC7K160T-1FBG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

400

1

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

.97 V

1 mm

0.74 ns

12675 CLBS

Tin Silver Copper

Bottom

S-PBGA-B676

4

2.54 mm

27 mm

No

e1

1818 MHz

30 s

400

250 °C (482 °F)

27 mm

XC7K160T-1FFG676C

Xilinx

FPGA

Other

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

400

1

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.74 ns

12675 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B676

4

3.37 mm

27 mm

No

e1

1098 MHz

30 s

400

250 °C (482 °F)

27 mm

XC7K160T-1FFG676I

Xilinx

FPGA

Ball

676

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

400

1

1,1.8,3.3 V

Grid Array

BGA676,26X26,40

Field Programmable Gate Arrays

.97 V

1 mm

0.74 ns

12675 CLBS

Tin Silver Copper

Bottom

S-PBGA-B676

4

3.37 mm

27 mm

No

e1

1098 MHz

30 s

400

250 °C (482 °F)

27 mm

XC7K160T-2FBG484C

Xilinx

FPGA

Other

Ball

484

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

285

1

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.97 V

1 mm

85 °C (185 °F)

0.61 ns

12675 CLBS

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

4

2.54 mm

23 mm

No

e1

1286 MHz

30 s

285

250 °C (482 °F)

23 mm

XC7K160T-2FBG484I

Xilinx

FPGA

Ball

484

BGA

Square

Plastic/Epoxy

162240

Yes

1.03 V

12675

CMOS

285

1

1,1.8,3.3 V

Grid Array

BGA484,22X22,40

Field Programmable Gate Arrays

.97 V

1 mm

0.61 ns

12675 CLBS

Tin Silver Copper

Bottom

S-PBGA-B484

4

2.54 mm

23 mm

No

e1

1286 MHz

30 s

285

250 °C (482 °F)

23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.