20 Programmable Logic Devices (PLD) 95

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

TIBPAL16R4-15MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

50 MHz

8

24.195 mm

No

4

TIBPAL16R6-15MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

15 ns

Yes

5.5 V

TTL

MIL-PRF-38535

10

PAL-TYPE

5

5 V

Flatpack

FL20,.3

Programmable Logic Devices

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

50 MHz

6

2

TIBPAL16R8-7MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

74 MHz

8

24.195 mm

No

0

PAL16L8A-2MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

16 MHz

8

8.89 mm

No

6

PAL16L8AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

6

PAL16L8AMWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

16

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

6

PAL16R4A-2MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

40 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

16 MHz

8

8.89 mm

No

4

PAL16R4AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

4

PAL16R4AMWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

12

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

4

PAL16R6AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

10

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Mixed

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

6

8.89 mm

No

2

PAL16R8AMFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

25 ns

Yes

5.5 V

TTL

38535Q/M;38534H;883B

8

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

0

JM38510/50603BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

41.6 MHz

2

JM38510/50604BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.25 V

TTL

MIL-M-38510 Class B

12

PAL-TYPE

5

Tube

In-Line

No

Mixed

4.75 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

4

JM38510/50605BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-M-38510 Class B

16

PAL-TYPE

5

Tube

In-Line

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

6

JM38510/50606BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

25 ns

No

5.5 V

TTL

MIL-M-38510 Class B

8

PAL-TYPE

5

Tube

In-Line

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

0

JM38510/50607BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-M-38510 Class B

5

In-Line

Mixed

4.5 V

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

25 MHz

2

JM38510/50608BRA

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-M-38510 Class B

12

PAL-TYPE

5

Tube

In-Line

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.2 mm

No

4

TIBPAL16L8-30MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

30 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

25 MHz

8

8.89 mm

No

6

TIBPAL16L8-30MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

30 ns

No

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

25 MHz

8

24.195 mm

No

6

TIBPAL16L8-30MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

30 ns

Yes

5.5 V

TTL

MIL-STD-883

16

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

6

TIBPAL16R4-10MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

12 ns

No

5.5 V

TTL

MIL-PRF-38535

12

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 4 I/O

8

-55 °C (-67 °F)

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

52.5 MHz

8

25.4 mm

4

TIBPAL16R6-20MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-PRF-38535

10

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Mixed

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 2 I/O

8

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

41.6 MHz

6

24.195 mm

No

2

TIBPAL16R8-30MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

25 ns

Yes

5.5 V

TTL

MIL-STD-883

8

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.54 mm

6.92 mm

No

e0

25 MHz

8

13.09 mm

No

0

TIBPAL16L8-12MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

14 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Combinatorial

4.5 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

48 MHz

8

8.89 mm

6

TIBPAL16R8-12MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 ns

Yes

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

48 MHz

8

8.89 mm

0

TIBPAL16R8-10MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 ns

No

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

2.54 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T20

5.08 mm

7.62 mm

No

e0

52.5 MHz

8

24.195 mm

No

0

TIBPAL16R8-10MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

10 ns

Yes

5.5 V

TTL

MIL-PRF-38535

8

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Registered

4.5 V

64

1.27 mm

125 °C (257 °F)

8 Dedicated Inputs, 0 I/O

8

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

e0

52.5 MHz

8

13.72 mm

No

0

TIBPAL16L8-20MFKB

Texas Instruments

OT PLD

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

20 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

Tube

5 V

Chip Carrier

LCC20,.35SQ

Programmable Logic Devices

No

Combinatorial

4.75 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

2.03 mm

8.89 mm

No

e0

40 MHz

8

8.89 mm

No

6

TIBPAL16L8-20MJB

Texas Instruments

OT PLD

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

20 ns

No

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

Tube

5 V

In-Line

DIP20,.3

Programmable Logic Devices

No

Combinatorial

4.75 V

64

2.54 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

5.08 mm

6.92 mm

No

e0

40 MHz

8

24.2 mm

No

6

TIBPAL16L8-20MWB

Texas Instruments

OT PLD

Military

Flat

20

DFP

Rectangular

Ceramic, Glass-Sealed

20 ns

Yes

5.5 V

TTL

MIL-PRF-38535

16

PAL-TYPE

5

Tube

5 V

Flatpack

FL20,.3

Programmable Logic Devices

No

Combinatorial

4.75 V

64

1.27 mm

125 °C (257 °F)

10 Dedicated Inputs, 6 I/O

10

-55 °C (-67 °F)

Tin Lead

Dual

R-GDFP-F20

2.45 mm

6.92 mm

No

e0

40 MHz

8

13.09 mm

No

6

GAL16V8D-15LPNI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

45.5 MHz

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-25LPNI

Lattice Semiconductor

EE PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

37 MHz

8

260 °C (500 °F)

26.162 mm

8

ATF16V8BQL-15PI

Atmel

Flash PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

1

5.334 mm

7.62 mm

No

e0

45 MHz

8

25.908 mm

8

GAL16V8D-10LPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

66.7 MHz

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-15LJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

45.5 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-15LPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

45.5 MHz

5 s

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-15QJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

45.5 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-15QPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

45.5 MHz

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-25LJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-25LPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

37 MHz

30 s

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-25QJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-25QPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

25 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

37 MHz

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-7LJN

Lattice Semiconductor

EE PLD

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.25 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.75 V

64

1.27 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

100 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-7LPN

Lattice Semiconductor

EE PLD

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

7.5 ns

No

5.25 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.75 V

64

2.54 mm

70 °C (158 °F)

8 Dedicated Inputs, 8 I/O

8

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

5.334 mm

7.62 mm

No

e3

100 MHz

30 s

8

260 °C (500 °F)

26.162 mm

8

GAL16V8D-25LJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-25QJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

37 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

GAL16V8D-7LJNI

Lattice Semiconductor

EE PLD

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

5.5 V

CMOS

18

PAL-TYPE

5

5 V

Chip Carrier

LDCC20,.4SQ

Programmable Logic Devices

Macrocell

4.5 V

64

1.27 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

4.572 mm

8.9662 mm

No

e3

100 MHz

40 s

8

250 °C (482 °F)

8.9662 mm

8

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.