BGA Programmable Logic Devices (PLD) 97

Reset All
Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

EP2A15B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.23 ns

16640

Yes

1.575 V

CMOS

480

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

492 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

480

220 °C (428 °F)

35 mm

492

EP2A25B724C8

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

1.94 ns

24320

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A40B724C7

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

1.55 ns

38400

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A40B724C8

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

1.78 ns

38400

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A40B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.05 ns

38400

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A70B724C7

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.17 ns

67200

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A70B724C8

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.49 ns

67200

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A70B724C9

Altera

Loadable PLD

Other

Ball

724

BGA

Square

Plastic/Epoxy

2.87 ns

67200

Yes

1.575 V

CMOS

524

1.5

1.5,1.5/3.3 V

Grid Array

BGA724,27X27,50

Field Programmable Gate Arrays

Macrocell

1.425 V

1.27 mm

85 °C (185 °F)

536 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B724

3.5 mm

35 mm

No

e0

524

220 °C (428 °F)

35 mm

536

EP2A70F1508C7

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.17 ns

67200

Yes

1.575 V

CMOS

1048

1.5

1.5,1.5/3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3

3.5 mm

40 mm

No

e0

1048

220 °C (428 °F)

40 mm

1060

EP2A70F1508C8

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.49 ns

67200

Yes

1.575 V

CMOS

1048

1.5

1.5,1.5/3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3

3.5 mm

40 mm

No

e0

1048

220 °C (428 °F)

40 mm

1060

EP2A70F1508C9

Altera

Loadable PLD

Other

Ball

1508

BGA

Square

Plastic/Epoxy

2.87 ns

67200

Yes

1.575 V

CMOS

1048

1.5

1.5,1.5/3.3 V

Grid Array

BGA1508,39X39,40

Field Programmable Gate Arrays

Macrocell

1.425 V

1 mm

85 °C (185 °F)

1060 I/O

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B1508

3

3.5 mm

40 mm

No

e0

1048

220 °C (428 °F)

40 mm

1060

XCR3512XL-12FG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

12 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

23 mm

Yes

260

EPXA1F484C1

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 186 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220 °C (428 °F)

23 mm

186

EPXA1F484C2

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 186 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220 °C (428 °F)

23 mm

186

EPXA1F484C3

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 186 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e0

220 °C (428 °F)

23 mm

186

EPXA1F672C1

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 246 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

246

EPXA1F672C2

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 246 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

246

EPXA1F672C3

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 246 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B672

3

2.1 mm

27 mm

No

e0

220 °C (428 °F)

27 mm

246

XC95288XL-7BG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

27 mm

Yes

192

XC95288XL-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XC95288XV-6FG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

208 MHz

30 s

225 °C (437 °F)

17 mm

Yes

192

XC2C512-10FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

91 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270

XC2C512-10FG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 270 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

91 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270

XC2C512-7FG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

119 MHz

30 s

270

225 °C (437 °F)

23 mm

Yes

270

XC2C384-10FG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 240 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e0

83 MHz

30 s

240

225 °C (437 °F)

23 mm

Yes

240

LC5256MV-75FN256C

Lattice Semiconductor

EE PLD

Ball

256

BGA

Square

Plastic/Epoxy

9.5 ns

Yes

3.6 V

256

CMOS

3.3

3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

0 Dedicated Inputs, 141 I/O

0

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

2.1 mm

17 mm

No

e1

40 s

250 °C (482 °F)

17 mm

Yes

141

EP20K200FC484-1XV

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

2.5 ns

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 382 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

220 °C (428 °F)

23 mm

382

XC2C384-10FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 240 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

240

250 °C (482 °F)

23 mm

Yes

240

XC2C384-10FGG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

384

CMOS

240

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 240 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

83 MHz

30 s

240

250 °C (482 °F)

23 mm

Yes

240

XC2C512-10FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

91 MHz

30 s

270

250 °C (482 °F)

23 mm

Yes

270

XC2C512-10FGG324I

Xilinx

Flash PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 270 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

91 MHz

30 s

270

250 °C (482 °F)

23 mm

Yes

270

XC2C512-7FGG324C

Xilinx

Flash PLD

Commercial

Ball

324

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

270

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array

BGA324,22X22,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 270 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

119 MHz

30 s

270

250 °C (482 °F)

23 mm

Yes

270

XC95288XL-10BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

100 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95288XL-10BGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

100 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95288XL-10FGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-10FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

100 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-6BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

208.3 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95288XL-6FGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

208.3 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-7BGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

125 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95288XL-7BGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e1

125 MHz

30 s

192

250 °C (482 °F)

27 mm

Yes

192

XC95288XL-7FGG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

125 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XC95288XL-7FGG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e1

125 MHz

30 s

192

260 °C (500 °F)

17 mm

Yes

192

XCR3512XL-10FGG324I

Xilinx

EE PLD

Industrial

Ball

324

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

512

CMOS

3.3

3/3.3 V

Grid Array

BGA324,20X20,40

Programmable Logic Devices

Yes

Macrocell

2.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 260 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B324

3

2.5 mm

23 mm

No

e1

97 MHz

30 s

250 °C (482 °F)

23 mm

Yes

260

EPM3128AFC256-10

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPM3128AFC256-5

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EPM3128AFC256-7

Altera

EE PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

128

CMOS

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 98 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

3.5 mm

17 mm

No

e0

220 °C (428 °F)

17 mm

Yes

98

EP20K200CF484C-7N

Altera

Loadable PLD

Other

Ball

484

BGA

Square

Plastic/Epoxy

1.48 ns

Yes

2.625 V

2.5

Grid Array

Macrocell

2.375 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 376 I/O

4

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B484

3

2.1 mm

23 mm

No

e1

245 °C (473 °F)

23 mm

376

EP20K600CB672C8

Altera

Loadable PLD

Other

Ball

672

BGA

Square

Plastic/Epoxy

1.78 ns

Yes

1.89 V

1.8

Grid Array

Macrocell

1.71 V

1 mm

85 °C (185 °F)

4 Dedicated Inputs, 508 I/O

4

0 °C (32 °F)

Bottom

S-PBGA-B672

3.5 mm

27 mm

No

27 mm

508

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.