QFP Programmable Logic Devices (PLD) 58

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC95216-15PQG160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

15 ns

Yes

5.25 V

216

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 133 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

3.7 mm

28 mm

No

e3

55.6 MHz

30 s

245 °C (473 °F)

28 mm

Yes

133

XC95216-20PQG160C

Xilinx

Flash PLD

Commercial

Gull Wing

160

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

216

CMOS

5

3.3/5,5 V

Flatpack

QFP160,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 133 I/O

0

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G160

3

3.7 mm

28 mm

No

e3

50 MHz

30 s

245 °C (473 °F)

28 mm

Yes

133

XC9572-10PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

66.7 MHz

30 s

245 °C (473 °F)

20 mm

Yes

72

XC9572-15PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

55.6 MHz

30 s

245 °C (473 °F)

20 mm

Yes

72

XC9572-7PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

7.5 ns

Yes

5.25 V

72

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

83.3 MHz

30 s

245 °C (473 °F)

20 mm

Yes

72

XC95144-10PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

10 ns

Yes

5.25 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

67.7 MHz

30 s

245 °C (473 °F)

20 mm

Yes

81

XC95144-15PQG100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

QFP

Rectangular

Plastic/Epoxy

15 ns

Yes

5.25 V

144

CMOS

5

3.3/5,5 V

Flatpack

QFP100,.7X.9

Programmable Logic Devices

Yes

Macrocell

4.75 V

.65 mm

70 °C (158 °F)

0 Dedicated Inputs, 81 I/O

0

0 °C (32 °F)

Matte Tin

Quad

R-PQFP-G100

3

3.4 mm

14 mm

No

e3

55.6 MHz

30 s

245 °C (473 °F)

20 mm

Yes

81

ISPLSI1048E-70LQN

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

128

QFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

192

CMOS

5

5 V

Flatpack

QFP128,1.2SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

8 Dedicated Inputs, 96 I/O

8

0 °C (32 °F)

Matte Tin

Quad

S-PQFP-G128

3

4.1 mm

28 mm

No

Use ISPLSI1048EA for new designs

e3

56 MHz

40 s

245 °C (473 °F)

28 mm

No

96

ISPLSI1048E-70LQNI

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

128

QFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.5 V

192

CMOS

5

5 V

Flatpack

QFP128,1.2SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

8 Dedicated Inputs, 96 I/O

8

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G128

3

4.1 mm

28 mm

No

Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs

e3

56 MHz

40 s

245 °C (473 °F)

28 mm

No

96

EPM3064ATC44-4NAG

Intel

EE PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

4.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack

Macrocell

3 V

70 °C (158 °F)

0 Dedicated Inputs, 30 I/O

0

0 °C (32 °F)

Quad

S-PQFP-G44

222.2 MHz

30

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.