Rectangular Programmable Logic Devices (PLD) 147

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
ATF22V10C-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	e0	55.5 MHz		10		31.877 mm		10
ATF22V10CQ-15PC	Atmel	Flash PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	70 °C (158 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	e0	55.5 MHz		10		31.877 mm		10
JM38510/50502BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Registered	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 0 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	e0	40 MHz				32.005 mm		0
JM38510/50503BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 2 I/O	12	-55 °C (-67 °F)		Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		28.5 MHz				32.005 mm		2
TIBPAL20R4-20MJTB	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.25 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	e0	40 MHz		8		32.005 mm	No	4
TIBPAL16R4-15MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	15 ns	No	5.5 V		TTL	MIL-PRF-38535	12	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	50 MHz		8		24.195 mm	No	4
TIBPAL16R6-15MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	15 ns	Yes	5.5 V		TTL	MIL-PRF-38535	10	PAL-TYPE	5		5 V	Flatpack	FL20,.3	Programmable Logic Devices		Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDFP-F20		2.45 mm	6.92 mm	No		50 MHz		6				2
TIBPAL16R8-7MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL	MIL-PRF-38535	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	74 MHz		8		24.195 mm	No	0
PAL16L8AMWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	38535Q/M;38534H;883B	16	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No	e0	25 MHz		8		13.09 mm	No	6
PAL16R4AMWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	38535Q/M;38534H;883B	12	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No	e0	25 MHz		8		13.09 mm	No	4
JM38510/50603BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		41.6 MHz						2
JM38510/50604BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.25 V		TTL	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube		In-Line			No	Mixed	4.75 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No	e0	40 MHz		8		24.2 mm	No	4
JM38510/50605BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	25 MHz		8		24.2 mm	No	6
JM38510/50606BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns	No	5.5 V		TTL	MIL-M-38510 Class B	8	PAL-TYPE	5	Tube		In-Line			No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	25 MHz		8		24.2 mm	No	0
JM38510/50607BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.5 V		2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		25 MHz						2
JM38510/50608BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-M-38510 Class B	12	PAL-TYPE	5	Tube		In-Line			No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	25 MHz		8		24.2 mm	No	4
TIBPAL16L8-30MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns	No	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	25 MHz		8		24.195 mm	No	6
TIBPAL16L8-30MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	30 ns	Yes	5.5 V		TTL	MIL-STD-883	16	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Combinatorial	4.5 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No	e0	25 MHz		8		13.09 mm	No	6
TIBPAL16R4-10MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	12 ns	No	5.5 V		TTL	MIL-PRF-38535	12	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 4 I/O	8	-55 °C (-67 °F)		Dual	R-GDIP-T20		5.08 mm	7.62 mm	No		52.5 MHz		8		25.4 mm		4
TIBPAL16R6-20MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-PRF-38535	10	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Mixed	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 2 I/O	8	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	41.6 MHz		6		24.195 mm	No	2
TIBPAL16R8-30MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	25 ns	Yes	5.5 V		TTL	MIL-STD-883	8	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.54 mm	6.92 mm	No	e0	25 MHz		8		13.09 mm	No	0
TIBPAL16R8-10MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	10 ns	No	5.5 V		TTL	MIL-PRF-38535	8	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	2.54 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDIP-T20		5.08 mm	7.62 mm	No	e0	52.5 MHz		8		24.195 mm	No	0
TIBPAL16R8-10MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	10 ns	Yes	5.5 V		TTL	MIL-PRF-38535	8	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Registered	4.5 V	64	1.27 mm	125 °C (257 °F)	8 Dedicated Inputs, 0 I/O	8	-55 °C (-67 °F)	Tin/Lead	Dual	R-GDFP-F20		2.45 mm	6.92 mm	No	e0	52.5 MHz		8		13.72 mm	No	0
TIBPAL16L8-20MJB	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns	No	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5	Tube	5 V	In-Line	DIP20,.3	Programmable Logic Devices	No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No	e0	40 MHz		8		24.2 mm	No	6
TIBPAL16L8-20MWB	Texas Instruments	OT PLD	Military	Flat	20	DFP	Rectangular	Ceramic, Glass-Sealed	20 ns	Yes	5.5 V		TTL	MIL-PRF-38535	16	PAL-TYPE	5	Tube	5 V	Flatpack	FL20,.3	Programmable Logic Devices	No	Combinatorial	4.75 V	64	1.27 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDFP-F20		2.45 mm	6.92 mm	No	e0	40 MHz		8		13.09 mm	No	6
GAL20V8B-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	e3	45.5 MHz		8	260 °C (500 °F)	31.75 mm		8
GAL16V8D-15LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-25LPNI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
M4A5-128/64-10YNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	128	CMOS			PAL-TYPE	5		5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	2 Dedicated Inputs, 64 I/O	2	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	20 mm	Yes	64
M4A5-128/64-10YNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.5 V	128	CMOS				5		5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.5 V		.65 mm	85 °C (185 °F)	2 Dedicated Inputs, 64 I/O	2	-40 °C (-40 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	20 mm	Yes	64
ATF16V8BQL-15PI	Atmel	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No	e0	45 MHz		8		25.908 mm		8
XC9572-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	66.7 MHz	30 s		245 °C (473 °F)	20 mm	Yes	72
XC9572-15PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	55.6 MHz	30 s		245 °C (473 °F)	20 mm	Yes	72
XC9572-7PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	7.5 ns	Yes	5.25 V	72	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 72 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	83.3 MHz	30 s		245 °C (473 °F)	20 mm	Yes	72
XC95108-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	HQFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	108	CMOS				5		3.3/5,5 V	Flatpack, Heat Sink/Slug	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3		30 s		245 °C (473 °F)	20 mm	Yes	81
XC95144-10PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	10 ns	Yes	5.25 V	144	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	67.7 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
XC95144-15PQG100C	Xilinx	Flash PLD	Commercial	Gull Wing	100	QFP	Rectangular	Plastic/Epoxy	15 ns	Yes	5.25 V	144	CMOS				5		3.3/5,5 V	Flatpack	QFP100,.7X.9	Programmable Logic Devices	Yes	Macrocell	4.75 V		.65 mm	70 °C (158 °F)	0 Dedicated Inputs, 81 I/O	0	0 °C (32 °F)	Matte Tin	Quad	R-PQFP-G100	3	3.4 mm	14 mm	No	e3	55.6 MHz	30 s		245 °C (473 °F)	20 mm	Yes	81
GAL16V8D-10LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	66.7 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-15LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	45.5 MHz	5 s	8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-15QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	45.5 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-25LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	37 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-25QPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	37 MHz		8	260 °C (500 °F)	26.162 mm		8
GAL16V8D-7LPN	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	7.5 ns	No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	e3	100 MHz	30 s	8	260 °C (500 °F)	26.162 mm		8
GAL22V10D-10QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	e3	83.3 MHz		10		31.75 mm		10
GAL22V10D-15LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	e3	55.5 MHz	30 s	10	260 °C (500 °F)	31.75 mm		10
GAL22V10D-15QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns	No	5.25 V	10	CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices	No	Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	e3	55.5 MHz		10		31.75 mm	No	10
GAL22V10D-25LPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	e3	33.3 MHz		10		31.75 mm		10
GAL22V10D-25QPN	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns	No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Matte Tin	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	e3	33.3 MHz		10		31.75 mm		10

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.