Square Programmable Logic Devices (PLD) 1,045

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
M4A5-256/128-10YNC	Lattice Semiconductor	EE PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	256	CMOS				5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V		.5 mm	70 °C (158 °F)	14 Dedicated Inputs, 128 I/O	14	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	28 mm	Yes	128
M4A5-256/128-10YNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	256	CMOS				5	5 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	14 Dedicated Inputs, 128 I/O	14	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	28 mm	Yes	128
M4A5-32/32-10JNC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-10JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-32/32-12JNI	Lattice Semiconductor	EE PLD	Industrial	J Bend	44	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	32	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.5 V		1.27 mm	85 °C (185 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	52.6 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-64/32-10JNC	Lattice Semiconductor	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	64	CMOS				5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	62.5 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	32
M4A5-96/48-12VNI	Lattice Semiconductor	EE PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	5.5 V	96	CMOS			PAL-TYPE	5	5 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 48 I/O	4	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3	52.6 MHz	40 s		260 °C (500 °F)	14 mm	Yes	48
LA4032V-75TN44E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	44	TQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	32	CMOS	AEC-Q100	30		3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	125 °C (257 °F)	0 Dedicated Inputs, 30 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e3	168 MHz	40 s	30	260 °C (500 °F)	10 mm	Yes	30
LA4064V-75TN100E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	64	CMOS	AEC-Q100	64		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3	168 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LA4064V-75TN48E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	48	TFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	64	CMOS	AEC-Q100	32		3.3	3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP48,.35SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 32 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G48	3	1.2 mm	7 mm	No	e3	168 MHz	40 s	32	260 °C (500 °F)	7 mm	Yes	32
LA4128V-75TN100E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	128	CMOS	AEC-Q100	64		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 64 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3	168 MHz	40 s	64	260 °C (500 °F)	14 mm	Yes	64
LA4128V-75TN144E	Lattice Semiconductor	EE PLD	Automotive	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	8 ns		Yes	3.6 V	128	CMOS	AEC-Q100	96		3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	125 °C (257 °F)	0 Dedicated Inputs, 96 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e3	168 MHz	40 s	96	260 °C (500 °F)	20 mm	Yes	96
XA9536XL-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		34
XA9536XL-15VQG44Q	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS	AEC-Q100; TS 16949			3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	105 °C (221 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		34
XA9572XL-15TQG100I	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		30 s		260 °C (500 °F)	14 mm		72
XA9572XL-15TQG100Q	Xilinx	Flash PLD	Industrial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Low Profile, Fine Pitch				Macrocell	3 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 72 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No	e3		30 s		260 °C (500 °F)	14 mm		72
XA9572XL-15VQG44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		34
XA9572XL-15VQG44Q	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS	AEC-Q100; TS 16949			3.3		Flatpack, Thin Profile				Macrocell	3 V		.8 mm	105 °C (221 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		34
XA9572XL-15VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		52
XA9572XL-15VQG64Q	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	e3		30 s		260 °C (500 °F)	10 mm		52
XA95144XL-15CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	BGA	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS				3.3		Grid Array				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No	e1		30 s		260 °C (500 °F)	12 mm		117
XC2C512-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	119 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS		212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
LC4256V-3FTN256BC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256			164	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 160 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	212 MHz	40 s	160	260 °C (500 °F)	17 mm	Yes	160
LC4256V-5FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256			132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	156 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
LC4256V-75FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256			132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	111 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
LC4512V-5FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	512			212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	156 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
LC4512V-75FT256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512			212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	111 MHz	30 s	208	225 °C (437 °F)	17 mm	Yes	208
LC4512V-75FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512			212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e1	111 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
XCR3256XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	105 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-12FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS				3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS				3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	e0	154 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3384XL-10FG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 220 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No	e0	102 MHz	30 s		225 °C (437 °F)	23 mm	Yes	220
XC9536XL-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No	e0	138.88 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9536XL-7VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		34		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No	e4	138.88 MHz		34		10 mm	Yes	34
XC9536XL-7VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS		36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No	e0	138.88 MHz	30 s	36	240 °C (464 °F)	10 mm	Yes	36
XCR3384XL-10TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4	102 MHz				20 mm	Yes	118
XCR3384XL-12TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	384	CMOS				3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No	e4	83 MHz				20 mm	Yes	118
EP20K200CQ208C7	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V		CMOS		128		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e0			128	220 °C (428 °F)	28 mm		136
EP20K600CF33C7	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V						1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		588
EP20K600CF33C8	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V						1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		588
EP2A15B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.69 ns	16640	Yes	1.575 V		CMOS		480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V		CMOS		480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS		480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A25B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V		CMOS		524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.55 ns	38400	Yes	1.575 V		CMOS		524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns	38400	Yes	1.575 V		CMOS		524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.