Square Programmable Logic Devices (PLD) 1,045

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

ISPLSI1024-60LJ

Lattice Semiconductor

EE PLD

Commercial

No Lead

68

QCCJ

Square

Plastic/Epoxy

25 ns

Yes

5.25 V

96

CMOS

5

5 V

Chip Carrier

LDCC68,1.0SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

2 Dedicated Inputs, 48 I/O

2

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-N68

3

4.57 mm

24.2316 mm

No

In-System Programmable; 4 External Clocks

e0

38 MHz

30 s

225 °C (437 °F)

24.2316 mm

No

48

ISPLSI1016-80LT44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

20 ns

Yes

5.25 V

64

CMOS

5

5 V

Flatpack

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

1 Dedicated Inputs, 32 I/O

1

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

10 mm

No

In-System Programmable; 3 External Clocks

e0

50 MHz

240 °C (464 °F)

10 mm

No

32

ISPLSI1016E-80LT44I

Lattice Semiconductor

EE PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.5 V

64

CMOS

35

PLA-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.5 V

.8 mm

85 °C (185 °F)

3 Dedicated Inputs, 32 I/O

3

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

57 MHz

32

240 °C (464 °F)

10 mm

No

32

ISPLSI1016E-80LT44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

18.5 ns

Yes

5.25 V

64

CMOS

35

PLA-TYPE

5

5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

3 Dedicated Inputs, 32 I/O

3

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

57 MHz

30 s

32

240 °C (464 °F)

10 mm

No

32

ISPLSI2032E-110LJ44

Lattice Semiconductor

EE PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

13 ns

Yes

5.25 V

32

CMOS

5

5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

77 MHz

30 s

225 °C (437 °F)

16.5862 mm

No

32

ISPLSI2032E-110LT44

Lattice Semiconductor

EE PLD

Commercial

Gull Wing

44

LQFP

Square

Plastic/Epoxy

13 ns

Yes

5.25 V

32

CMOS

5

5 V

Flatpack, Low Profile

QFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

4.75 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 32 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G44

3

1.6 mm

10 mm

No

In-System Programmable

e0

77 MHz

10 mm

No

32

GAL22LV10C-10LJ

Lattice Semiconductor

EE PLD

Commercial Extended

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

CMOS

22

PAL-TYPE

3.3

3.3 V

Chip Carrier

LDCC28,.5SQ

Programmable Logic Devices

Macrocell

3 V

132

1.27 mm

75 °C (167 °F)

11 Dedicated Inputs, 10 I/O

11

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J28

1

4.572 mm

11.5062 mm

No

Register Preload; Power-Up Reset

e0

71 MHz

10

11.5062 mm

10

XC95288XL-10BG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

100 MHz

30 s

192

225 °C (437 °F)

27 mm

Yes

192

XC95288XL-10BG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

100 MHz

30 s

192

225 °C (437 °F)

27 mm

Yes

192

XC95288XL-7BG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

27 mm

Yes

192

XC95288XL-6TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

288 Macrocells

e4

208.3 MHz

117

20 mm

Yes

117

XC95288XL-10TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

288 Macrocells

e4

100 MHz

117

20 mm

Yes

117

XC95288XL-10TQ144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

288 Macrocells

e4

100 MHz

117

20 mm

Yes

117

XC95288XL-7TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

125 MHz

117

20 mm

Yes

117

XC95288XL-6PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

208.3 MHz

168

28 mm

Yes

168

XC95288XL-10PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

100 MHz

168

28 mm

Yes

168

XC95288XL-10PQ208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 168 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

100 MHz

168

28 mm

Yes

168

XC95288XL-7PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

125 MHz

168

28 mm

Yes

168

XC95288XL-10CS280I

Xilinx

Flash PLD

Industrial

Ball

280

TFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA280,19X19,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B280

3

1.2 mm

16 mm

No

e0

100 MHz

30 s

192

240 °C (464 °F)

16 mm

Yes

192

EPF81500ARC304-2

Altera

Loadable PLD

Commercial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

1.7 ns

1296

Yes

3.6 V

CMOS

208

3.3

3.3/5,5 V

Flatpack, Fine Pitch

HQFP304,1.7SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 208 I/O

4

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G304

3

4.5 mm

40 mm

No

Can also operate at 5 V supply

e0

417 MHz

204

220 °C (428 °F)

40 mm

208

EPF81500ARC304-4

Altera

Loadable PLD

Commercial

Gull Wing

304

FQFP

Square

Plastic/Epoxy

1.9 ns

1296

Yes

3.6 V

CMOS

208

3.3

3.3/5,5 V

Flatpack, Fine Pitch

HQFP304,1.7SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

70 °C (158 °F)

4 Dedicated Inputs, 208 I/O

4

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G304

3

4.5 mm

40 mm

No

Can also operate at 5 V supply

e0

357 MHz

30 s

204

220 °C (428 °F)

40 mm

208

EPF6024ABI256-2

Altera

Loadable PLD

Ball

256

BGA

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

218

3.3

2.5/3.3,3.3 V

Grid Array

BGA256(UNSPEC)

Field Programmable Gate Arrays

Macrocell

3 V

1.27 mm

4 Dedicated Inputs, 218 I/O

4

Tin/Lead

Bottom

S-PBGA-B256

3

2.3 mm

27 mm

No

Also Configurable with 5 V VCC

e0

153 MHz

30 s

218

220 °C (428 °F)

27 mm

218

EPF6016AQI208-2

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1320

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

4 Dedicated Inputs, 171 I/O

4

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Also Configurable with 5 V VCC

e0

153 MHz

171

220 °C (428 °F)

28 mm

171

EPF6024AQI208-3

Altera

Loadable PLD

Gull Wing

208

FQFP

Square

Plastic/Epoxy

1960

Yes

3.6 V

CMOS

171

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Macrocell

3 V

.5 mm

4 Dedicated Inputs, 171 I/O

4

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Typical gates = 12000 to 240000

e0

171

220 °C (428 °F)

28 mm

171

EPF10K30ABI356-3

Altera

Loadable PLD

Industrial

Ball

356

LBGA

Square

Plastic/Epoxy

0.9 ns

1728

Yes

3.6 V

CMOS

246

3.3

2.5/3.3,3.3 V

Grid Array, Low Profile

BGA356,26X26,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

85 °C (185 °F)

4 Dedicated Inputs, 246 I/O

4

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

1728 Logic Elements; 216 Labs

e0

80 MHz

246

220 °C (428 °F)

35 mm

246

EPF10K130VBC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.5 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K130VBC600-3

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.7 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K130VBC600-4

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.9 ns

6656

Yes

3.6 V

CMOS

470

3.3

3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

e0

470

220 °C (428 °F)

45 mm

470

EPF10K250ABC600-2

Altera

Loadable PLD

Commercial

Ball

600

BGA

Square

Plastic/Epoxy

0.6 ns

12160

Yes

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array

BGA600,35X35,50

Field Programmable Gate Arrays

Registered

3 V

1.27 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B600

1.93 mm

45 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

45 mm

470

EPF10K100GC503-3DX

Altera

Loadable PLD

Commercial

Pin/Peg

503

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.5 ns

4992

No

5.25 V

CMOS

406

5

3.3/5,5 V

Grid Array, Interstitial Pitch

SPGA503,43X43

Field Programmable Gate Arrays

Registered

4.75 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 406 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P503

1

5.077 mm

57.4 mm

No

e0

406

220 °C (428 °F)

57.4 mm

406

EPF10K200EGC599-1

Altera

Loadable PLD

Commercial

Pin/Peg

599

PGA

Square

Ceramic, Metal-Sealed Cofired

0.4 ns

9984

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

9984 Logic Elements

e0

140 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K200EGC599-2

Altera

Loadable PLD

Commercial

Pin/Peg

599

PGA

Square

Ceramic, Metal-Sealed Cofired

0.6 ns

9984

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

9984 Logic Elements

e0

140 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K200EGC599-3

Altera

Loadable PLD

Commercial

Pin/Peg

599

PGA

Square

Ceramic, Metal-Sealed Cofired

0.8 ns

9984

No

2.7 V

CMOS

470

2.5

2.5,2.5/3.3 V

Grid Array

SPGA599,47X47

Field Programmable Gate Arrays

Mixed

2.3 V

2.54 mm

70 °C (158 °F)

470 I/O

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

9984 Logic Elements

e0

140 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K250AGC599-1

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.5 ns

12160

No

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K250AGC599-2

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.6 ns

12160

No

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K250AGC599-3

Altera

Loadable PLD

Commercial

Pin/Peg

599

IPGA

Square

Ceramic, Metal-Sealed Cofired

0.7 ns

12160

No

3.6 V

CMOS

470

3.3

2.5/3.3,3.3 V

Grid Array, Interstitial Pitch

SPGA599,47X47

Field Programmable Gate Arrays

Registered

3 V

2.54 mm

70 °C (158 °F)

4 Dedicated Inputs, 470 I/O

4

0 °C (32 °F)

Tin Lead

Perpendicular

S-CPGA-P599

1

5.08 mm

62.484 mm

No

12160 Logic Elements; 1520 Labs

e0

80 MHz

470

220 °C (428 °F)

62.484 mm

470

EPF10K100BQC208-2

Altera

Loadable PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

147

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

147 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

4992 Logic Elements

e0

140 MHz

147

220 °C (428 °F)

28 mm

147

EPF10K10AQI208-3

Altera

Loadable PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

0.8 ns

576

Yes

3.6 V

CMOS

150

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Field Programmable Gate Arrays

Registered

3 V

.5 mm

85 °C (185 °F)

4 Dedicated Inputs, 134 I/O

4

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

576 Logic Elements; 72 Labs

e0

80 MHz

150

220 °C (428 °F)

28 mm

134

EPF10K100BQC240-1

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

11 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

4992 Logic Elements

e0

140 MHz

189

220 °C (428 °F)

32 mm

189

EPF10K100BQC240-2

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

12 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

4992 Logic Elements

e0

140 MHz

189

220 °C (428 °F)

32 mm

189

EPF10K100BQC240-3

Altera

Loadable PLD

Commercial

Gull Wing

240

FQFP

Square

Plastic/Epoxy

14.5 ns

4992

Yes

2.7 V

CMOS

189

2.5

2.5,2.5/3.3 V

Flatpack, Fine Pitch

QFP240,1.3SQ,20

Field Programmable Gate Arrays

Mixed

2.3 V

.5 mm

70 °C (158 °F)

189 I/O

0 °C (32 °F)

Tin Lead

Quad

S-PQFP-G240

3

4.1 mm

32 mm

No

4992 Logic Elements

e0

140 MHz

189

220 °C (428 °F)

32 mm

189

EPM9320ABC356-10

Altera

EE PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

10.8 ns

Yes

5.25 V

320

CMOS

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

144.9 MHz

220 °C (428 °F)

35 mm

Yes

168

EPM9320BC356-15

Altera

EE PLD

Commercial

Ball

356

LBGA

Square

Plastic/Epoxy

16 ns

Yes

5.25 V

320

CMOS

5

3.3/5,5 V

Grid Array, Low Profile

BGA356,26X26,50

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B356

1.63 mm

35 mm

No

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

117.6 MHz

220 °C (428 °F)

35 mm

Yes

168

EPM3032ALI44-10

Altera

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

32

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

e0

103.1 MHz

220 °C (428 °F)

16.5862 mm

Yes

34

EPM3064ALI44-10

Altera

EE PLD

Industrial

J Bend

44

QCCJ

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

64

CMOS

3.3

2.5/3.3,3.3 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J44

1

4.572 mm

16.5862 mm

No

e0

100 MHz

220 °C (428 °F)

16.5862 mm

Yes

34

EPM9320ALC84-10

Altera

EE PLD

Commercial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10.8 ns

Yes

5.25 V

320

CMOS

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.75 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 60 I/O

0

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

144.9 MHz

220 °C (428 °F)

29.3116 mm

Yes

60

EPM9320ALI84-10

Altera

EE PLD

Industrial

J Bend

84

QCCJ

Square

Plastic/Epoxy

10.8 ns

Yes

5.5 V

320

CMOS

60

5

3.3/5,5 V

Chip Carrier

LDCC84,1.2SQ

Programmable Logic Devices

Yes

Macrocell

4.5 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 60 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J84

3

5.08 mm

29.3116 mm

No

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

144.9 MHz

60

220 °C (428 °F)

29.3116 mm

Yes

60

EPM9320ARC208-10

Altera

EE PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

10.8 ns

Yes

5.25 V

320

CMOS

5

3.3/5,5 V

Flatpack, Fine Pitch

HQFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

4.75 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 132 I/O

0

0 °C (32 °F)

Tin/Lead

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V

e0

144.9 MHz

30 s

220 °C (428 °F)

28 mm

Yes

132

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.