| Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
96 |
2.54 mm |
75 °C (167 °F) |
7 Dedicated Inputs, 10 I/O |
7 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T20 |
1 |
4.57 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
41.6 MHz |
10 |
26.125 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
80 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
45 MHz |
30 s |
10 |
225 °C (437 °F) |
31.75 mm |
10 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
20 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
80 |
2.54 mm |
75 °C (167 °F) |
10 Dedicated Inputs, 10 I/O |
10 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
33.3 MHz |
10 |
31.75 mm |
10 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
45.5 MHz |
8 |
31.75 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
37 MHz |
8 |
31.75 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
37 MHz |
8 |
31.75 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
Register Preload; Power-Up Reset |
e0 |
37 MHz |
8 |
31.75 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
96 |
1.27 mm |
75 °C (167 °F) |
7 Dedicated Inputs, 10 I/O |
7 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.57 mm |
8.9662 mm |
No |
Register Preload; Power-Up Reset |
e0 |
41.6 MHz |
30 s |
10 |
225 °C (437 °F) |
8.9662 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
58.8 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
45.5 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
75 °C (167 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
37 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
20 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
12 Dedicated Inputs, 8 I/O |
12 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
58.8 MHz |
30 s |
8 |
225 °C (437 °F) |
11.5062 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
132 |
2.54 mm |
85 °C (185 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
83.3 MHz |
10 |
31.75 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
1 |
5.334 mm |
7.62 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
55.5 MHz |
10 |
31.75 mm |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP24,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
2.54 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
10 |
225 °C (437 °F) |
31.75 mm |
10 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
83.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
10 Macrocells; Shared Input/Clock |
e0 |
33.3 MHz |
30 s |
10 |
225 °C (437 °F) |
11.5062 mm |
10 |
||||||||
|
Altera |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
15 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
No |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
76.9 MHz |
220 °C (428 °F) |
16.5862 mm |
No |
32 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
12 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Flatpack, Low Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
No |
Macrocell |
3 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
No |
Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock |
e0 |
90.9 MHz |
220 °C (428 °F) |
10 mm |
No |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
Programmable Output Polarity |
e0 |
66.7 MHz |
8 |
26.162 mm |
8 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e0 |
45.5 MHz |
30 s |
8 |
225 °C (437 °F) |
26.162 mm |
8 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
No |
e0 |
45.5 MHz |
30 s |
8 |
225 °C (437 °F) |
26.162 mm |
8 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
2.54 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e0 |
37 MHz |
8 |
26.162 mm |
8 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin/Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e0 |
37 MHz |
30 s |
8 |
225 °C (437 °F) |
26.162 mm |
8 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
25 ns |
No |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
In-Line |
DIP20,.3 |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
2.54 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
No |
e0 |
37 MHz |
8 |
26.162 mm |
8 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
Programmable Output Polarity |
e0 |
66.7 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
Programmable Output Polarity |
e0 |
66.7 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e0 |
66.7 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e0 |
41.6 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.5 V |
64 |
1.27 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
e0 |
37 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
5 ns |
Yes |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Programmable Logic Devices |
Macrocell |
4.75 V |
64 |
1.27 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 8 I/O |
8 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
No |
Programmable Output Polarity |
e0 |
142.8 MHz |
30 s |
8 |
225 °C (437 °F) |
8.9662 mm |
8 |
||||||||
|
Atmel |
EE PLD |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
64 |
CMOS |
5 |
3.3/5,5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
2 |
4.57 mm |
16.5862 mm |
No |
e0 |
60 MHz |
225 °C (437 °F) |
16.5862 mm |
Yes |
32 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
100 |
LFQFP |
Square |
Plastic/Epoxy |
17.5 ns |
Yes |
5.25 V |
128 |
CMOS |
66 |
PLA-TYPE |
5 |
5 V |
Flatpack, Low Profile, Fine Pitch |
QFP100,.63SQ,20 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.5 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 64 I/O |
2 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
No |
e0 |
56 MHz |
30 s |
64 |
240 °C (464 °F) |
14 mm |
No |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs; Use 1048E-70 for new 1048E-50 designs |
e0 |
56 MHz |
30 s |
225 °C (437 °F) |
28 mm |
No |
96 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
128 |
QFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.25 V |
192 |
CMOS |
5 |
5 V |
Flatpack |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
8 Dedicated Inputs, 96 I/O |
8 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
No |
Use ISPLSI1048EA for new designs |
e0 |
56 MHz |
30 s |
225 °C (437 °F) |
28 mm |
No |
96 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
160 |
QFP |
Square |
Plastic/Epoxy |
18 ns |
Yes |
5.5 V |
256 |
CMOS |
5 |
5 V |
Flatpack |
QFP160,1.2SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.65 mm |
85 °C (185 °F) |
0 Dedicated Inputs, 128 I/O |
0 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQFP-G160 |
3 |
4.1 mm |
28 mm |
No |
e0 |
50 MHz |
30 s |
225 °C (437 °F) |
28 mm |
Yes |
128 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 32 I/O |
1 |
0 °C (32 °F) |
Tin/Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
In-System Programmable; 3 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
3.6 V |
32 |
CMOS |
3.3 |
3.3 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
3 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
No |
e0 |
77 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
No Lead |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.5 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
1.27 mm |
85 °C (185 °F) |
2 Dedicated Inputs, 48 I/O |
2 |
-40 °C (-40 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-N68 |
3 |
4.57 mm |
24.2316 mm |
No |
In-System Programmable; 4 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
24.2316 mm |
No |
48 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
No Lead |
68 |
QCCJ |
Square |
Plastic/Epoxy |
25 ns |
Yes |
5.25 V |
96 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC68,1.0SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
2 Dedicated Inputs, 48 I/O |
2 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-N68 |
3 |
4.57 mm |
24.2316 mm |
No |
In-System Programmable; 4 External Clocks |
e0 |
38 MHz |
30 s |
225 °C (437 °F) |
24.2316 mm |
No |
48 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
20 ns |
Yes |
5.25 V |
64 |
CMOS |
5 |
5 V |
Flatpack |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
1 Dedicated Inputs, 32 I/O |
1 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
10 mm |
No |
In-System Programmable; 3 External Clocks |
e0 |
50 MHz |
240 °C (464 °F) |
10 mm |
No |
32 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.5 V |
64 |
CMOS |
35 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.5 V |
.8 mm |
85 °C (185 °F) |
3 Dedicated Inputs, 32 I/O |
3 |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
57 MHz |
32 |
240 °C (464 °F) |
10 mm |
No |
32 |
||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
18.5 ns |
Yes |
5.25 V |
64 |
CMOS |
35 |
PLA-TYPE |
5 |
5 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
3 Dedicated Inputs, 32 I/O |
3 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
No |
e0 |
57 MHz |
30 s |
32 |
240 °C (464 °F) |
10 mm |
No |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
13 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
No |
e0 |
77 MHz |
30 s |
225 °C (437 °F) |
16.5862 mm |
No |
32 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial |
Gull Wing |
44 |
LQFP |
Square |
Plastic/Epoxy |
13 ns |
Yes |
5.25 V |
32 |
CMOS |
5 |
5 V |
Flatpack, Low Profile |
QFP44,.47SQ,32 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
.8 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 32 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQFP-G44 |
3 |
1.6 mm |
10 mm |
No |
In-System Programmable |
e0 |
77 MHz |
10 mm |
No |
32 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
Commercial Extended |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 ns |
Yes |
3.6 V |
CMOS |
22 |
PAL-TYPE |
3.3 |
3.3 V |
Chip Carrier |
LDCC28,.5SQ |
Programmable Logic Devices |
Macrocell |
3 V |
132 |
1.27 mm |
75 °C (167 °F) |
11 Dedicated Inputs, 10 I/O |
11 |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Quad |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
No |
Register Preload; Power-Up Reset |
e0 |
71 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
10.8 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
144.9 MHz |
220 °C (428 °F) |
35 mm |
Yes |
168 |
|||||||||||
|
Altera |
EE PLD |
Commercial |
Ball |
356 |
LBGA |
Square |
Plastic/Epoxy |
16 ns |
Yes |
5.25 V |
320 |
CMOS |
5 |
3.3/5,5 V |
Grid Array, Low Profile |
BGA356,26X26,50 |
Programmable Logic Devices |
Yes |
Macrocell |
4.75 V |
1.27 mm |
70 °C (158 °F) |
0 Dedicated Inputs, 168 I/O |
0 |
0 °C (32 °F) |
Tin Lead |
Bottom |
S-PBGA-B356 |
1.63 mm |
35 mm |
No |
320 Macrocells; 20 Labs; 484 Flip Flops; Configurable I/O operation with 3.3 V or 5 V |
e0 |
117.6 MHz |
220 °C (428 °F) |
35 mm |
Yes |
168 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.