Flash PLD Programmable Logic Devices (PLD) 411

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Part RoHS Manufacturer Programmable IC Type Grading Of Temperature Form Of Terminal No. of Terminals Package Code Package Shape Package Body Material Propagation Delay No. of Logic Cells Surface Mount Maximum Supply Voltage No. of Macro Cells Technology Used Screening Level No. of Inputs Architecture Nominal Supply Voltage (V) Packing Method Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category In-System Programmable Output Function Minimum Supply Voltage No. of Product Terms Pitch Of Terminal Maximum Operating Temperature Organization No. of Dedicated Inputs Minimum Operating Temperature Finishing Of Terminal Used Position Of Terminal JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) No. of Outputs Peak Reflow Temperature (C) Length JTAG Boundary Scan Test No. of I/O Lines

XC9572XV-5VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

222 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XC9572XV-7CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 38 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e0

125 MHz

30 s

240 °C (464 °F)

7 mm

Yes

38

XC9572XV-7PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.37 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

125 MHz

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC9572XV-7TQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 72 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e0

125 MHz

30 s

225 °C (437 °F)

14 mm

Yes

72

XC9572XV-7VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

72

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

125 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XC95144XV-7TQ144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

144

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e0

125 MHz

30 s

225 °C (437 °F)

20 mm

Yes

117

XC9536XV-5CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e0

30 s

240 °C (464 °F)

7 mm

Yes

36

XC9536XV-5PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.37 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC9536XV-5VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

222.2 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XC9536XV-7CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 36 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e0

30 s

240 °C (464 °F)

7 mm

Yes

36

XC9536XV-7PC44C

Xilinx

Flash PLD

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Chip Carrier

LDCC44,.7SQ

Programmable Logic Devices

Yes

Macrocell

2.37 V

1.27 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J44

3

4.57 mm

16.5862 mm

No

e0

30 s

225 °C (437 °F)

16.5862 mm

Yes

34

XC9536XV-7VQ44C

Xilinx

Flash PLD

Commercial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

2.62 V

36

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

2.37 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 34 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e0

125 MHz

30 s

240 °C (464 °F)

10 mm

Yes

34

XA9536XL-15VQG44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

34

XA9536XL-15VQG44Q

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

AEC-Q100; TS 16949

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

105 °C (221 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

34

XA9572XL-15TQG100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

72

XA9572XL-15TQG100Q

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Low Profile, Fine Pitch

Macrocell

3 V

.5 mm

105 °C (221 °F)

0 Dedicated Inputs, 72 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e3

30 s

260 °C (500 °F)

14 mm

72

XA9572XL-15VQG44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

34

XA9572XL-15VQG44Q

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

AEC-Q100; TS 16949

3.3

Flatpack, Thin Profile

Macrocell

3 V

.8 mm

105 °C (221 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

34

XA9572XL-15VQG64I

Xilinx

Flash PLD

Industrial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 52 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

52

XA9572XL-15VQG64Q

Xilinx

Flash PLD

Industrial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Flatpack, Thin Profile, Fine Pitch

Macrocell

3 V

.5 mm

105 °C (221 °F)

0 Dedicated Inputs, 52 I/O

0

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e3

30 s

260 °C (500 °F)

10 mm

52

XA95144XL-15CSG144I

Xilinx

Flash PLD

Industrial

Ball

144

BGA

Square

Plastic/Epoxy

15.5 ns

Yes

3.6 V

CMOS

3.3

Grid Array

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e1

30 s

260 °C (500 °F)

12 mm

117

XC2C512-7FT256I

Xilinx

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e0

119 MHz

30 s

212

225 °C (437 °F)

17 mm

Yes

212

XC2C512-7FTG256I

Xilinx

Flash PLD

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

7.5 ns

Yes

1.9 V

512

CMOS

212

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 212 I/O

0

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

e1

119 MHz

30 s

212

260 °C (500 °F)

17 mm

Yes

212

ATF16V8BQL-15PI

Atmel

Flash PLD

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 ns

No

5.5 V

CMOS

18

PAL-TYPE

5

5 V

In-Line

DIP20,.3

Programmable Logic Devices

Macrocell

4.5 V

64

2.54 mm

85 °C (185 °F)

8 Dedicated Inputs, 8 I/O

8

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

1

5.334 mm

7.62 mm

No

e0

45 MHz

8

25.908 mm

8

XC9536XL-7CS48I

Xilinx

Flash PLD

Industrial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

e0

138.88 MHz

30 s

36

240 °C (464 °F)

7 mm

Yes

36

XC9536XL-7VQ44I

Xilinx

Flash PLD

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

36

CMOS

34

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 34 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G44

3

1.2 mm

10 mm

No

e4

138.88 MHz

34

10 mm

Yes

34

XC9536XL-7VQ64I

Xilinx

Flash PLD

Industrial

Gull Wing

64

TFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

36

CMOS

36

3.3

2.5/3.3,3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP64,.47SQ

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 36 I/O

0

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G64

3

1.2 mm

10 mm

No

e0

138.88 MHz

30 s

36

240 °C (464 °F)

10 mm

Yes

36

XC2C256-6FT256C

Xilinx

Flash PLD

Commercial

Ball

256

LBGA

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

184

PLA-TYPE

1.8

1.5/3.3,1.8 V

Grid Array, Low Profile

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

1.7 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 184 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B256

3

1.55 mm

17 mm

No

Real Digital Design Technology

e0

139 MHz

30 s

184

225 °C (437 °F)

17 mm

Yes

184

XC2C256-6PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

173

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 173 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

Real Digital Design Technology

e4

139 MHz

173

28 mm

Yes

173

XC2C256-6TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

118

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 118 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

Real Digital Design Technology

e4

139 MHz

118

20 mm

Yes

118

XC2C256-6VQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

256

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

Real Digital Design Technology

e4

139 MHz

80

14 mm

Yes

80

XC95288XL-7BG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,20X20,50

Programmable Logic Devices

Yes

Macrocell

3 V

1.27 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2.55 mm

27 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

27 mm

Yes

192

XC95288XL-7CS280I

Xilinx

Flash PLD

Industrial

Ball

280

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA280,19X19,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B280

3

1.2 mm

16 mm

No

e0

125 MHz

30 s

192

240 °C (464 °F)

16 mm

Yes

192

XC95288XL-7FG256I

Xilinx

Flash PLD

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

192

3.3

2.5/3.3,3.3 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

3 V

1 mm

85 °C (185 °F)

0 Dedicated Inputs, 192 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

125 MHz

30 s

192

225 °C (437 °F)

17 mm

Yes

192

XC95288XL-7PQ208I

Xilinx

Flash PLD

Industrial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

168

3.3

2.5/3.3,3.3 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 168 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e4

125 MHz

168

28 mm

Yes

168

XC95288XL-7TQ144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

288

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

125 MHz

117

20 mm

Yes

117

XC9572XL-5CS48C

Xilinx

Flash PLD

Commercial

Ball

48

FBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

72

CMOS

38

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 38 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

72 Macrocells

e0

178.6 MHz

30 s

38

240 °C (464 °F)

7 mm

Yes

38

XC9572XL-7CS48I

Xilinx

Flash PLD

Industrial

Ball

48

FBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

72

CMOS

38

3.3

2.5/3.3,3.3 V

Grid Array, Fine Pitch

BGA48,7X7,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 38 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B48

3

1.8 mm

7 mm

No

72 Macrocells

e0

125 MHz

30 s

38

240 °C (464 °F)

7 mm

Yes

38

XC95288XV-6FG256C

Xilinx

Flash PLD

Commercial

Ball

256

BGA

Square

Plastic/Epoxy

6 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Grid Array

BGA256,16X16,40

Programmable Logic Devices

Yes

Macrocell

2.37 V

1 mm

70 °C (158 °F)

0 Dedicated Inputs, 192 I/O

0

0 °C (32 °F)

Tin/Lead (Sn63Pb37)

Bottom

S-PBGA-B256

3

2 mm

17 mm

No

e0

208 MHz

30 s

225 °C (437 °F)

17 mm

Yes

192

XC95288XV-6PQ208C

Xilinx

Flash PLD

Commercial

Gull Wing

208

FQFP

Square

Plastic/Epoxy

6 ns

Yes

2.62 V

288

CMOS

2.5

1.8/3.3,2.5 V

Flatpack, Fine Pitch

QFP208,1.2SQ,20

Programmable Logic Devices

Yes

Macrocell

2.37 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 168 I/O

0

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQFP-G208

3

4.1 mm

28 mm

No

e0

208 MHz

30 s

225 °C (437 °F)

28 mm

Yes

168

XC95144XL-10CS144C

Xilinx

Flash PLD

Commercial

Ball

144

TFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95144XL-10CS144I

Xilinx

Flash PLD

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

10 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95144XL-5CS144C

Xilinx

Flash PLD

Commercial

Ball

144

TFBGA

Square

Plastic/Epoxy

5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

70 °C (158 °F)

0 Dedicated Inputs, 117 I/O

0

0 °C (32 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95144XL-7CS144I

Xilinx

Flash PLD

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Grid Array, Thin Profile, Fine Pitch

BGA144,13X13,32

Programmable Logic Devices

Yes

Macrocell

3 V

.8 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

1.2 mm

12 mm

No

e0

138.88 MHz

30 s

117

240 °C (464 °F)

12 mm

Yes

117

XC95144XL-7TQ100I

Xilinx

Flash PLD

Industrial

Gull Wing

100

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

81

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP100,.63SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 81 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.6 mm

14 mm

No

e4

138.88 MHz

81

14 mm

Yes

81

XC95144XL-7TQ144I

Xilinx

Flash PLD

Industrial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

7.5 ns

Yes

3.6 V

144

CMOS

117

3.3

2.5/3.3,3.3 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

3 V

.5 mm

85 °C (185 °F)

0 Dedicated Inputs, 117 I/O

0

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

138.88 MHz

117

20 mm

Yes

117

XC2C128-6TQ144C

Xilinx

Flash PLD

Commercial

Gull Wing

144

LFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

128

CMOS

100

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Low Profile, Fine Pitch

QFP144,.87SQ,20

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 100 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G144

3

1.6 mm

20 mm

No

e4

152 MHz

100

20 mm

Yes

100

XC2C128-6VQ100C

Xilinx

Flash PLD

Commercial

Gull Wing

100

TFQFP

Square

Plastic/Epoxy

6 ns

Yes

1.9 V

128

CMOS

80

PLA-TYPE

1.8

1.5/3.3,1.8 V

Flatpack, Thin Profile, Fine Pitch

TQFP100,.63SQ

Programmable Logic Devices

Yes

Macrocell

1.7 V

.5 mm

70 °C (158 °F)

0 Dedicated Inputs, 80 I/O

0

0 °C (32 °F)

Nickel Palladium Gold

Quad

S-PQFP-G100

3

1.2 mm

14 mm

No

e4

152 MHz

80

14 mm

Yes

80

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.