Loadable PLD Programmable Logic Devices (PLD) 100

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	No. of I/O Lines
EPF81188ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		180	220 °C (428 °F)	32 mm	184
EPF81188ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		180	220 °C (428 °F)	32 mm	184
EPF81188ARC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V	CMOS	184	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		180	220 °C (428 °F)	32 mm	184
EPF81500ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.7 ns	1296	Yes	5.25 V	CMOS	181	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		177	220 °C (428 °F)	32 mm	181
EPF81500ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1296	Yes	5.25 V	CMOS	181	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm	181
EPF81500ARI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.8 ns	1296	Yes	5.5 V	CMOS	181	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Registered	4.5 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 181 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm	181
EPF8282AVTC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V	CMOS	78	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	385 MHz		74	220 °C (428 °F)	14 mm	78
EPF8820ARC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	28 mm	152
EPF8820ARC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	28 mm	152
EPF8820ARC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V	CMOS	152	5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	4.75 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	28 mm	152
EPF8452AGC160-3	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		336	No	5.25 V	CMOS	120	5	3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	336 Logic Elements	e0	385 MHz		116	220 °C (428 °F)	39.624 mm	120
EPF8282AVTC100-4	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V	CMOS	78	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	357 MHz		74	220 °C (428 °F)	14 mm	78
EPF10K100BFC256-1	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm	191
EPF10K100BFC256-2	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V	CMOS	191	2.5	2.5,2.5/3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Mixed	2.3 V	1 mm	70 °C (158 °F)	191 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	4992 Logic Elements	e0	140 MHz		191	220 °C (428 °F)	17 mm	191
EPF10K10AFC256-3	Altera	Loadable PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V	CMOS	150	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,20X20,50	Field Programmable Gate Arrays	Registered	3 V	1 mm	70 °C (158 °F)	4 Dedicated Inputs, 150 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	17 mm	150
EPF10K50SFI484-2	Altera	Loadable PLD	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	0.4 ns	2880	Yes	2.625 V	CMOS	254	2.5	2.5,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	Mixed	2.375 V	1 mm	85 °C (185 °F)	254 I/O		-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No		e0			254	220 °C (428 °F)	23 mm	254
EPF81500ARC304-2	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	1.7 ns	1296	Yes	3.6 V	CMOS	208	3.3	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also operate at 5 V supply	e0	417 MHz		204	220 °C (428 °F)	40 mm	208
EPF81500ARC304-4	Altera	Loadable PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	1.9 ns	1296	Yes	3.6 V	CMOS	208	3.3	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Lead	Quad	S-PQFP-G304	3	4.5 mm	40 mm	No	Can also operate at 5 V supply	e0	357 MHz	30 s	204	220 °C (428 °F)	40 mm	208
EPF6024ABI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	218	3.3	2.5/3.3,3.3 V	Grid Array	BGA256(UNSPEC)	Field Programmable Gate Arrays	Macrocell	3 V	1.27 mm		4 Dedicated Inputs, 218 I/O	4		Tin/Lead	Bottom	S-PBGA-B256	3	2.3 mm	27 mm	No	Also Configurable with 5 V VCC	e0	153 MHz	30 s	218	220 °C (428 °F)	27 mm	218
EPF6016AQI208-2	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		1320	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 171 I/O	4		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Also Configurable with 5 V VCC	e0	153 MHz		171	220 °C (428 °F)	28 mm	171
EPF6024AQI208-3	Altera	Loadable PLD		Gull Wing	208	FQFP	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	171	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	3 V	.5 mm		4 Dedicated Inputs, 171 I/O	4		Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Typical gates = 12000 to 240000	e0			171	220 °C (428 °F)	28 mm	171
EPF10K30ABI356-3	Altera	Loadable PLD	Industrial	Ball	356	LBGA	Square	Plastic/Epoxy	0.9 ns	1728	Yes	3.6 V	CMOS	246	3.3	2.5/3.3,3.3 V	Grid Array, Low Profile	BGA356,26X26,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 246 I/O	4	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B356		1.63 mm	35 mm	No	1728 Logic Elements; 216 Labs	e0	80 MHz		246	220 °C (428 °F)	35 mm	246
EPF10K130VBC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.5 ns	6656	Yes	3.6 V	CMOS	470	3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K130VBC600-3	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.7 ns	6656	Yes	3.6 V	CMOS	470	3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K130VBC600-4	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.9 ns	6656	Yes	3.6 V	CMOS	470	3.3	3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No		e0			470	220 °C (428 °F)	45 mm	470
EPF10K250ABC600-2	Altera	Loadable PLD	Commercial	Ball	600	BGA	Square	Plastic/Epoxy	0.6 ns	12160	Yes	3.6 V	CMOS	470	3.3	2.5/3.3,3.3 V	Grid Array	BGA600,35X35,50	Field Programmable Gate Arrays	Registered	3 V	1.27 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B600		1.93 mm	45 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	45 mm	470
EPF10K100GC503-3DX	Altera	Loadable PLD	Commercial	Pin/Peg	503	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	4992	No	5.25 V	CMOS	406	5	3.3/5,5 V	Grid Array, Interstitial Pitch	SPGA503,43X43	Field Programmable Gate Arrays	Registered	4.75 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 406 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P503	1	5.077 mm	57.4 mm	No		e0			406	220 °C (428 °F)	57.4 mm	406
EPF10K200EGC599-1	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.4 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K200EGC599-2	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K200EGC599-3	Altera	Loadable PLD	Commercial	Pin/Peg	599	PGA	Square	Ceramic, Metal-Sealed Cofired	0.8 ns	9984	No	2.7 V	CMOS	470	2.5	2.5,2.5/3.3 V	Grid Array	SPGA599,47X47	Field Programmable Gate Arrays	Mixed	2.3 V	2.54 mm	70 °C (158 °F)	470 I/O		0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	9984 Logic Elements	e0	140 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K250AGC599-1	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.5 ns	12160	No	3.6 V	CMOS	470	3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K250AGC599-2	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.6 ns	12160	No	3.6 V	CMOS	470	3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K250AGC599-3	Altera	Loadable PLD	Commercial	Pin/Peg	599	IPGA	Square	Ceramic, Metal-Sealed Cofired	0.7 ns	12160	No	3.6 V	CMOS	470	3.3	2.5/3.3,3.3 V	Grid Array, Interstitial Pitch	SPGA599,47X47	Field Programmable Gate Arrays	Registered	3 V	2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 470 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P599	1	5.08 mm	62.484 mm	No	12160 Logic Elements; 1520 Labs	e0	80 MHz		470	220 °C (428 °F)	62.484 mm	470
EPF10K100BQC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V	CMOS	147	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	147 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	4992 Logic Elements	e0	140 MHz		147	220 °C (428 °F)	28 mm	147
EPF10K10AQI208-3	Altera	Loadable PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	0.8 ns	576	Yes	3.6 V	CMOS	150	3.3	2.5/3.3,3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays	Registered	3 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 134 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	576 Logic Elements; 72 Labs	e0	80 MHz		150	220 °C (428 °F)	28 mm	134
EPF10K100BQC240-1	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	11 ns	4992	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm	189
EPF10K100BQC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	12 ns	4992	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm	189
EPF10K100BQC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	14.5 ns	4992	Yes	2.7 V	CMOS	189	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	QFP240,1.3SQ,20	Field Programmable Gate Arrays	Mixed	2.3 V	.5 mm	70 °C (158 °F)	189 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	4992 Logic Elements	e0	140 MHz		189	220 °C (428 °F)	32 mm	189
EP20K200EBC652-1	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	1.58 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm	376
EP20K200EBC652-3	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	2.33 ns	8320	Yes	1.89 V	CMOS	368	1.8	1.8,1.8/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	1.71 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B652	3	3.5 mm	45 mm	No		e0			368	220 °C (428 °F)	45 mm	376
EP20K400BI652-2	Altera	Loadable PLD		Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns	16640	Yes	2.625 V	CMOS	496	2.5	2.5,2.5/3.3 V	Grid Array	BGA652,35X35,50	Field Programmable Gate Arrays	Macrocell	2.375 V	1.27 mm		4 Dedicated Inputs, 502 I/O	4		Tin Lead	Bottom	S-PBGA-B652		3.5 mm	45 mm	No		e0			496	220 °C (428 °F)	45 mm	502
EP20K100TC144-2	Altera	Loadable PLD	Other	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	3 ns	4160	Yes	2.625 V	CMOS	95	2.5	2.5,2.5/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	101 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e0			95	220 °C (428 °F)	20 mm	101
EP20K200RC208-1	Altera	Loadable PLD	Other	Gull Wing	208	HFQFP	Square	Plastic/Epoxy	2.5 ns	8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Heat Sink/Slug, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	144 I/O		0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			138	220 °C (428 °F)	28 mm	144
EP20K200RC208-2	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e0			138	220 °C (428 °F)	28 mm	144
EP20K200RC208-3	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	3.6 ns	8320	Yes	2.625 V	CMOS	138	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 144 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208		4.1 mm	28 mm	No		e0			138	220 °C (428 °F)	28 mm	144
EP20K200RC240-2	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3 ns	8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240		4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EP20K200RC240-3	Altera	Loadable PLD	Other	Gull Wing	240	FQFP	Square	Plastic/Epoxy	3.6 ns	8320	Yes	2.625 V	CMOS	168	2.5	2.5,2.5/3.3 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays	Macrocell	2.375 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 174 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No		e0			168	220 °C (428 °F)	32 mm	174
EPF6024AFI256-2	Altera	Loadable PLD		Ball	256	BGA	Square	Plastic/Epoxy		1960	Yes	3.6 V	CMOS	219	3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	Macrocell	3 V	1 mm		4 Dedicated Inputs, 219 I/O	4		Tin Lead	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e0	153 MHz		219	220 °C (428 °F)	17 mm	219

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.