Altera Programmable Logic Devices (PLD) 249

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPM7128BUC49-10	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	10 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No	e0	94.3 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM7128BUC49-4	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	4 ns		Yes	2.625 V	128	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No	e0	243.9 MHz			220 °C (428 °F)	7 mm	Yes	41
EPM9560ARC304-10F	Altera	EE PLD	Commercial	Gull Wing	304	FQFP	Square	Plastic/Epoxy	11.4 ns		Yes	5.25 V	560	CMOS		5	3.3/5,5 V	Flatpack, Fine Pitch	HQFP304,1.7SQ,20	Programmable Logic Devices	Yes	Macrocell	4.75 V	.5 mm	70 °C (158 °F)	0 Dedicated Inputs	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G304		4.5 mm	40 mm	No	e0				220 °C (428 °F)	40 mm	Yes
EP20K400BC652-2XV	Altera	Loadable PLD	Other	Ball	652	BGA	Square	Plastic/Epoxy	3.1 ns		Yes	2.625 V		CMOS		2.5		Grid Array				Macrocell	2.375 V	1.27 mm	85 °C (185 °F)	4 Dedicated Inputs, 502 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B652		3.5 mm	45 mm	No	e1				220 °C (428 °F)	45 mm		502
EPM7064BUC49-7	Altera	EE PLD	Commercial	Ball	49	LFBGA	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	64	CMOS		2.5	1.8/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA49,7X7,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 41 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B49		1.55 mm	7 mm	No	e0	303 MHz			220 °C (428 °F)	7 mm	Yes	41
EP20K200CQ208C7	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V		CMOS	128	1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V	.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	e0			128	220 °C (428 °F)	28 mm		136
EP20K600CF33C7	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		588
EP20K600CF33C8	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		588
EP2A15B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.69 ns	16640	Yes	1.575 V		CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V		CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS	480	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			480	220 °C (428 °F)	35 mm		492
EP2A25B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.55 ns	38400	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns	38400	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.17 ns	67200	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.49 ns	67200	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.87 ns	67200	Yes	1.575 V		CMOS	524	1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V	1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0			524	220 °C (428 °F)	35 mm		536
EP2A70F1508C7	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.17 ns	67200	Yes	1.575 V		CMOS	1048	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0			1048	220 °C (428 °F)	40 mm		1060
EP2A70F1508C8	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.49 ns	67200	Yes	1.575 V		CMOS	1048	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0			1048	220 °C (428 °F)	40 mm		1060
EP2A70F1508C9	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.87 ns	67200	Yes	1.575 V		CMOS	1048	1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V	1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No	e0			1048	220 °C (428 °F)	40 mm		1060
EP2A40B724I8	Altera	Loadable PLD		Ball	724	HBGA	Square	Plastic/Epoxy	1.7 ns		Yes	1.575 V		CMOS		1.5		Grid Array, Heat Sink/Slug				Macrocell	1.425 V	1.27 mm		536 I/O			Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No	e0				220 °C (428 °F)	35 mm		536
EPXA10F1020C1	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 711 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		711
EPXA10F1020C2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 711 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		711
EPXA10F1020C3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 711 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		711
EPXA1F484C1	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	e0				220 °C (428 °F)	23 mm		186
EPXA1F484C2	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	e0				220 °C (428 °F)	23 mm		186
EPXA1F484C3	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 186 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	e0				220 °C (428 °F)	23 mm		186
EPXA1F672C1	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 246 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No	e0				220 °C (428 °F)	27 mm		246
EPXA1F672C2	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 246 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No	e0				220 °C (428 °F)	27 mm		246
EPXA1F672C3	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 246 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B672	3	2.1 mm	27 mm	No	e0				220 °C (428 °F)	27 mm		246
EPXA4F1020C1	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 488 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		488
EPXA4F1020C2	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 488 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		488
EPXA4F1020C3	Altera	Loadable PLD	Other	Ball	1020	HBGA	Square	Plastic/Epoxy			Yes	1.89 V				1.8		Grid Array, Heat Sink/Slug				Macrocell	1.71 V	1 mm	85 °C (185 °F)	0 Dedicated Inputs, 488 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No	e0				220 °C (428 °F)	33 mm		488
EP1800ILC-70	Altera	OT PLD	Commercial	J Bend	68	QCCJ	Square	Plastic	70 ns		Yes		48	CMOS		5	5 V	Chip Carrier	LDCC68,1.0SQ	Programmable Logic Devices	No			1.27 mm	70 °C (158 °F)			0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J68				No	e0				220 °C (428 °F)		No
EP20K200FC484-1XV	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	2.5 ns		Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 382 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	e1				220 °C (428 °F)	23 mm		382
EPM7064LI84-10	Altera	EE PLD	Industrial	J Bend	84	QCCJ	Square	Plastic	10 ns		Yes		64	CMOS			3.3/5,5 V	Chip Carrier	LDCC84,1.2SQ	Programmable Logic Devices	No			1.27 mm	85 °C (185 °F)			-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J84				No	e0				220 °C (428 °F)		No
EPM3128AFC256-10	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 98 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No	e0				220 °C (428 °F)	17 mm	Yes	98
EPM3128AFC256-5	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 98 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No	e0				220 °C (428 °F)	17 mm	Yes	98
EPM3128AFC256-7	Altera	EE PLD	Commercial	Ball	256	BGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128	CMOS		3.3	2.5/3.3,3.3 V	Grid Array	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	1 mm	70 °C (158 °F)	0 Dedicated Inputs, 98 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	3.5 mm	17 mm	No	e0				220 °C (428 °F)	17 mm	Yes	98
EPM7032BTC44-3N	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	32	CMOS		2.5	1.8/3.3,2.5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	e3	303 MHz			260 °C (500 °F)	10 mm	Yes	36
EPM7032BTC44-5N	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	32	CMOS		2.5	1.8/3.3,2.5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	e3	303 MHz			260 °C (500 °F)	10 mm	Yes	36
EPM7032BTC44-7N	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	3.5 ns		Yes	2.625 V	32	CMOS		2.5	1.8/3.3,2.5 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	2.375 V	.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	e3	303 MHz			260 °C (500 °F)	10 mm	Yes	36
EP20K200CF484C-7N	Altera	Loadable PLD	Other	Ball	484	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	2.625 V				2.5		Grid Array				Macrocell	2.375 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 376 I/O	4	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.1 mm	23 mm	No	e1				245 °C (473 °F)	23 mm		376
EP20K600CB672C8	Altera	Loadable PLD	Other	Ball	672	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V				1.8		Grid Array				Macrocell	1.71 V	1 mm	85 °C (185 °F)	4 Dedicated Inputs, 508 I/O	4	0 °C (32 °F)		Bottom	S-PBGA-B672		3.5 mm	27 mm	No						27 mm		508
EPM7032SLC44-10N	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V	32	CMOS		5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin/Copper	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e2	125 MHz	40 s		245 °C (473 °F)	16.5862 mm	Yes	36
EPM7032SLC44-5N	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	5 ns		Yes	5.25 V	32	CMOS		5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	250 MHz				16.5862 mm	Yes	36
EPM7032SLC44-6N	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	6 ns		Yes	5.25 V	32	CMOS		5	5 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	Yes	Macrocell	4.75 V	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 36 I/O	0	0 °C (32 °F)	Matte Tin	Quad	S-PQCC-J44	3	4.572 mm	16.5862 mm	No	e3	200 MHz				16.5862 mm	Yes	36

Programmable Logic Devices (PLD)

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.