Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
XA9572XL-15VQG64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XA9572XL-15VQG64Q	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS			3.3		Flatpack, Thin Profile, Fine Pitch				Macrocell	3 V		.5 mm	105 °C (221 °F)	0 Dedicated Inputs, 52 I/O	0	-40 °C (-40 °F)	Matte Tin	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e3		30 s		260 °C (500 °F)	10 mm		52
XA95144XL-15CSG144I	Xilinx	Flash PLD	Industrial	Ball	144	BGA	Square	Plastic/Epoxy	15.5 ns		Yes	3.6 V		CMOS			3.3		Grid Array				Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 117 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.2 mm	12 mm	No		e1		30 s		260 °C (500 °F)	12 mm		117
XC2C512-7FT256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	119 MHz	30 s	212	225 °C (437 °F)	17 mm	Yes	212
XC2C512-7FTG256I	Xilinx	Flash PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	1.9 V	512	CMOS	212	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	119 MHz	30 s	212	260 °C (500 °F)	17 mm	Yes	212
LC4256V-3FTN256BC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	3 ns		Yes	3.6 V	256		164	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 160 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	212 MHz	40 s	160	260 °C (500 °F)	17 mm	Yes	160
LC4256V-5FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	156 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
LC4256V-75FTN256AC	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 128 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	111 MHz	40 s	128	260 °C (500 °F)	17 mm	Yes	128
LC4512V-5FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	156 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
LC4512V-75FT256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	111 MHz	30 s	208	225 °C (437 °F)	17 mm	Yes	208
LC4512V-75FTN256C	Lattice Semiconductor	EE PLD		Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	512		212	PAD-TYPE	3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V	83	1 mm	90 °C (194 °F)	4 Dedicated Inputs, 208 I/O	4	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	111 MHz	40 s	208	260 °C (500 °F)	17 mm	Yes	208
ATF16V8BQL-15PI	Atmel	Flash PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.5 V		CMOS	18	PAL-TYPE	5	5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45 MHz		8		25.908 mm		8
XCR3256XL-10FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	105 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-12FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	256	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 164 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	88 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3256XL-7FT256C	Xilinx	EE PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256	CMOS			3.3	3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	3 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 164 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	154 MHz	30 s		225 °C (437 °F)	17 mm	Yes	164
XCR3384XL-10FG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 220 I/O	0	-40 °C (-40 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	102 MHz	30 s		225 °C (437 °F)	23 mm	Yes	220
XC9536XL-7CS48I	Xilinx	Flash PLD	Industrial	Ball	48	FBGA	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Grid Array, Fine Pitch	BGA48,7X7,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B48	3	1.8 mm	7 mm	No		e0	138.88 MHz	30 s	36	240 °C (464 °F)	7 mm	Yes	36
XC9536XL-7VQ44I	Xilinx	Flash PLD	Industrial	Gull Wing	44	TQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	34		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V		.8 mm	85 °C (185 °F)	0 Dedicated Inputs, 34 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e4	138.88 MHz		34		10 mm	Yes	34
XC9536XL-7VQ64I	Xilinx	Flash PLD	Industrial	Gull Wing	64	TFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	36	CMOS	36		3.3	2.5/3.3,3.3 V	Flatpack, Thin Profile, Fine Pitch	TQFP64,.47SQ	Programmable Logic Devices	Yes	Macrocell	3 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 36 I/O	0	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G64	3	1.2 mm	10 mm	No		e0	138.88 MHz	30 s	36	240 °C (464 °F)	10 mm	Yes	36
XCR3384XL-10TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	102 MHz				20 mm	Yes	118
XCR3384XL-12TQ144I	Xilinx	EE PLD	Industrial	Gull Wing	144	LFQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	384	CMOS			3.3	3/3.3 V	Flatpack, Low Profile, Fine Pitch	QFP144,.87SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 118 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G144	3	1.6 mm	20 mm	No		e4	83 MHz				20 mm	Yes	118
EP20K200CQ208C7	Altera	Loadable PLD	Other	Gull Wing	208	FQFP	Square	Plastic/Epoxy	1.48 ns	8320	Yes	1.89 V		CMOS	128		1.8	1.8,1.8/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Field Programmable Gate Arrays		Macrocell	1.71 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 136 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e0			128	220 °C (428 °F)	28 mm		136
EP20K600CF33C7	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.48 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm		588
EP20K600CF33C8	Altera	Loadable PLD	Other	Ball	1020	BGA	Square	Plastic/Epoxy	1.78 ns		Yes	1.89 V					1.8		Grid Array				Macrocell	1.71 V		1 mm	85 °C (185 °F)	4 Dedicated Inputs, 588 I/O	4	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1020	3	3.5 mm	33 mm	No		e0				220 °C (428 °F)	33 mm		588
EP2A15B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.69 ns	16640	Yes	1.575 V		CMOS	480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	16640	Yes	1.575 V		CMOS	480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm		492
EP2A15B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.23 ns	16640	Yes	1.575 V		CMOS	480		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	492 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			480	220 °C (428 °F)	35 mm		492
EP2A25B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.94 ns	24320	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.55 ns	38400	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	1.78 ns	38400	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A40B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.05 ns	38400	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C7	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.17 ns	67200	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C8	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.49 ns	67200	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A70B724C9	Altera	Loadable PLD	Other	Ball	724	BGA	Square	Plastic/Epoxy	2.87 ns	67200	Yes	1.575 V		CMOS	524		1.5	1.5,1.5/3.3 V	Grid Array	BGA724,27X27,50	Field Programmable Gate Arrays		Macrocell	1.425 V		1.27 mm	85 °C (185 °F)	536 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B724		3.5 mm	35 mm	No		e0			524	220 °C (428 °F)	35 mm		536
EP2A70F1508C7	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.17 ns	67200	Yes	1.575 V		CMOS	1048		1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V		1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e0			1048	220 °C (428 °F)	40 mm		1060
EP2A70F1508C8	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.49 ns	67200	Yes	1.575 V		CMOS	1048		1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V		1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e0			1048	220 °C (428 °F)	40 mm		1060
EP2A70F1508C9	Altera	Loadable PLD	Other	Ball	1508	BGA	Square	Plastic/Epoxy	2.87 ns	67200	Yes	1.575 V		CMOS	1048		1.5	1.5,1.5/3.3 V	Grid Array	BGA1508,39X39,40	Field Programmable Gate Arrays		Macrocell	1.425 V		1 mm	85 °C (185 °F)	1060 I/O		0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B1508	3	3.5 mm	40 mm	No		e0			1048	220 °C (428 °F)	40 mm		1060
XCR3512XL-12FG324I	Xilinx	EE PLD	Industrial	Ball	324	BGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array	BGA324,20X20,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 260 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B324	3	2.5 mm	23 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	23 mm	Yes	260
XCR3512XL-12FT256I	Xilinx	EE PLD	Industrial	Ball	256	LBGA	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS			3.3	3/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	2.7 V		1 mm	85 °C (185 °F)	0 Dedicated Inputs, 212 I/O	0	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	77 MHz	30 s		225 °C (437 °F)	17 mm	Yes	212
XCR3512XL-12PQ208I	Xilinx	EE PLD	Industrial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	512	CMOS	184	PLA-TYPE	3.3	3/3.3 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	2.7 V		.5 mm	85 °C (185 °F)	0 Dedicated Inputs, 180 I/O	0	-40 °C (-40 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No		e4	67.56 MHz		180		28 mm	Yes	180
LC4032V-10T44I	Lattice Semiconductor	EE PLD		Gull Wing	44	TQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	32		32	PAD-TYPE	3.3	3.3 V	Flatpack, Thin Profile	TQFP44,.47SQ,32	Programmable Logic Devices	Yes	Macrocell	3 V	83	.8 mm	105 °C (221 °F)	2 Dedicated Inputs, 30 I/O	2	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.2 mm	10 mm	No		e0	86 MHz	30 s	30	240 °C (464 °F)	10 mm	Yes	30
LC4128V-5T100I	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	5 ns		Yes	3.6 V	128		74	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	10 Dedicated Inputs, 64 I/O	10	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	156 MHz	30 s	64	240 °C (464 °F)	14 mm	Yes	64
LC4128V-75T128I	Lattice Semiconductor	EE PLD		Gull Wing	128	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	128		96	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP128,.64SQ,16	Programmable Logic Devices	Yes	Macrocell	3 V	83	.4 mm	105 °C (221 °F)	4 Dedicated Inputs, 92 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G128	3	1.6 mm	14 mm	No		e0	111 MHz	30 s	92	240 °C (464 °F)	14 mm	Yes	92
LC4256V-10T176I	Lattice Semiconductor	EE PLD		Gull Wing	176	LFQFP	Square	Plastic/Epoxy	10 ns		Yes	3.6 V	256		132	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP176,1.0SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	105 °C (221 °F)	4 Dedicated Inputs, 128 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G176	3	1.6 mm	21 mm	No		e0	86 MHz	30 s	128	256 °C (492.8 °F)	21 mm	Yes	128
LC4256V-75T100C	Lattice Semiconductor	EE PLD		Gull Wing	100	LFQFP	Square	Plastic/Epoxy	7.5 ns		Yes	3.6 V	256		74	PAD-TYPE	3.3	3.3 V	Flatpack, Low Profile, Fine Pitch	QFP100,.63SQ,20	Programmable Logic Devices	Yes	Macrocell	3 V	83	.5 mm	90 °C (194 °F)	10 Dedicated Inputs, 64 I/O	10	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.6 mm	14 mm	No		e0	111 MHz	30 s	64	240 °C (464 °F)	14 mm	Yes	64
XC2C256-6FT256C	Xilinx	Flash PLD	Commercial	Ball	256	LBGA	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	184	PLA-TYPE	1.8	1.5/3.3,1.8 V	Grid Array, Low Profile	BGA256,16X16,40	Programmable Logic Devices	Yes	Macrocell	1.7 V		1 mm	70 °C (158 °F)	0 Dedicated Inputs, 184 I/O	0	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Real Digital Design Technology	e0	139 MHz	30 s	184	225 °C (437 °F)	17 mm	Yes	184
XC2C256-6PQ208C	Xilinx	Flash PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy	6 ns		Yes	1.9 V	256	CMOS	173	PLA-TYPE	1.8	1.5/3.3,1.8 V	Flatpack, Fine Pitch	QFP208,1.2SQ,20	Programmable Logic Devices	Yes	Macrocell	1.7 V		.5 mm	70 °C (158 °F)	0 Dedicated Inputs, 173 I/O	0	0 °C (32 °F)	Nickel Palladium Gold	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	Real Digital Design Technology	e4	139 MHz		173		28 mm	Yes	173

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.