Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	Screening Level	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
EPF81188ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V		CMOS		184		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		180	220 °C (428 °F)	32 mm		184
EPF81188ARC240-4	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1008	Yes	5.25 V		CMOS		184		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 184 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1008 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		180	220 °C (428 °F)	32 mm		184
EPF81500ARC240-2	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.7 ns	1296	Yes	5.25 V		CMOS		181		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		177	220 °C (428 °F)	32 mm		181
EPF81500ARC240-3	Altera	Loadable PLD	Commercial	Gull Wing	240	FQFP	Square	Plastic/Epoxy		1296	Yes	5.25 V		CMOS		181		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 181 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm		181
EPF81500ARI240-3	Altera	Loadable PLD	Industrial	Gull Wing	240	FQFP	Square	Plastic/Epoxy	1.8 ns	1296	Yes	5.5 V		CMOS		181		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		Registered	4.5 V		.5 mm	85 °C (185 °F)	4 Dedicated Inputs, 181 I/O	4	-40 °C (-40 °F)	Tin Lead	Quad	S-PQFP-G240	3	4.1 mm	32 mm	No	1296 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		177	220 °C (428 °F)	32 mm		181
EPF8282AVTC100-3	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V		CMOS		78		3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	385 MHz		74	220 °C (428 °F)	14 mm		78
EPF8820ARC208-2	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS		152		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	417 MHz		148	220 °C (428 °F)	28 mm		152
EPF8820ARC208-3	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS		152		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	385 MHz		148	220 °C (428 °F)	28 mm		152
EPF8820ARC208-4	Altera	Loadable PLD	Commercial	Gull Wing	208	FQFP	Square	Plastic/Epoxy		672	Yes	5.25 V		CMOS		152		5		3.3/5,5 V	Flatpack, Fine Pitch	HQFP208,1.2SQ,20	Field Programmable Gate Arrays		Registered	4.75 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 152 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G208	3	4.1 mm	28 mm	No	672 Logic elements; Configurable I/O operation with 3.3 V or 5 V	e0	357 MHz		148	220 °C (428 °F)	28 mm		152
JM38510/50504BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns		No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Mixed	4.75 V		2.54 mm	125 °C (257 °F)	12 Dedicated Inputs, 4 I/O	12	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No	1 External Clock; Register Preload	e0	40 MHz				32.005 mm		4
JM38510/50401BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns		No			TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0
JM38510/50403BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns		No			TTL	MIL-M-38510 Class B			5			In-Line				Mixed				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0	20 MHz
JM38510/50404BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	30 ns		No			TTL	MIL-M-38510 Class B			5			In-Line				Mixed				125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20				No		e0	20 MHz
JM38510/50501BLA	Texas Instruments	OT PLD	Military	Through-Hole	24	DIP	Rectangular	Ceramic, Glass-Sealed	25 ns		No	5.25 V		TTL	MIL-M-38510 Class B			5			In-Line				Combinatorial	4.75 V		2.54 mm	125 °C (257 °F)	14 Dedicated Inputs, 6 I/O	14	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T24		5.08 mm	7.62 mm	No		e0	40 MHz				32.005 mm		6
JM38510/50601BRA	Texas Instruments	OT PLD	Military	Through-Hole	20	DIP	Rectangular	Ceramic, Glass-Sealed	20 ns		No	5.5 V		TTL	MIL-M-38510 Class B	16	PAL-TYPE	5	Tube		In-Line			No	Combinatorial	4.75 V	64	2.54 mm	125 °C (257 °F)	10 Dedicated Inputs, 6 I/O	10	-55 °C (-67 °F)	Tin Lead	Dual	R-GDIP-T20		5.08 mm	6.92 mm	No		e0	40 MHz		8		24.2 mm	No	6
GAL18V10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	20 ns		No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	96	2.54 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead	Dual	R-PDIP-T20	1	4.57 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz		10		26.125 mm		10
GAL20RA10B-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	80	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	45 MHz	30 s	10	225 °C (437 °F)	31.75 mm		10
GAL20RA10B-20LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	20 ns		No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	80	2.54 mm	75 °C (167 °F)	10 Dedicated Inputs, 10 I/O	10	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	33.3 MHz		10		31.75 mm		10
GAL20V8B-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz		8		31.75 mm		8
GAL20V8B-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL20V8B-25QPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.5 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL20V8B-25QP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		20	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	Register Preload; Power-Up Reset	e0	37 MHz		8		31.75 mm		8
GAL18V10B-20LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	20	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		CMOS		18	PAL-TYPE	5		5 V	Chip Carrier	LDCC20,.4SQ	Programmable Logic Devices		Macrocell	4.75 V	96	1.27 mm	75 °C (167 °F)	7 Dedicated Inputs, 10 I/O	7	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J20	1	4.57 mm	8.9662 mm	No	Register Preload; Power-Up Reset	e0	41.6 MHz	30 s	10	225 °C (437 °F)	8.9662 mm		10
GAL20V8C-10LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8B-15LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	45.5 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8B-25LJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	64	1.27 mm	75 °C (167 °F)	12 Dedicated Inputs, 8 I/O	12	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	37 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
GAL20V8C-10LJI	Lattice Semiconductor	EE PLD	Industrial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.5 V		CMOS		20	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.5 V	64	1.27 mm	85 °C (185 °F)	12 Dedicated Inputs, 8 I/O	12	-40 °C (-40 °F)	Tin Lead	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	Register Preload; Power-Up Reset	e0	58.8 MHz	30 s	8	225 °C (437 °F)	11.5062 mm		8
TIBPALR19R4CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		TTL		19	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Mixed	4.75 V	64	1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No	1 External Clock; Register Preload		30 MHz		8		11.5062 mm		4
TIBPALT19R4CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 4 I/O	0	0 °C (32 °F)		Dual	R-PDIP-T24				No	1 External Clock; Register Preload		30 MHz		8				4
TIBPALT19R6CNT	Texas Instruments	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		TTL		19	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Mixed	4.75 V	64	2.54 mm	70 °C (158 °F)	0 Dedicated Inputs, 2 I/O	0	0 °C (32 °F)		Dual	R-PDIP-T24				No	1 External Clock; Register Preload		30 MHz		8				2
TIFPLA839CFN	Texas Instruments	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	20 ns		Yes	5.25 V		TTL		14	PLA-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Combinatorial	4.75 V	32	1.27 mm	70 °C (158 °F)	14 Dedicated Inputs, 0 I/O	14	0 °C (32 °F)		Quad	S-PQCC-J28		4.57 mm	11.5062 mm	No					6		11.5062 mm		0
EPF8452AGC160-3	Altera	Loadable PLD	Commercial	Pin/Peg	160	PGA	Square	Ceramic, Metal-Sealed Cofired		336	No	5.25 V		CMOS		120		5		3.3/5,5 V	Grid Array	PGA160M,15X15	Field Programmable Gate Arrays		Registered	4.75 V		2.54 mm	70 °C (158 °F)	4 Dedicated Inputs, 120 I/O	4	0 °C (32 °F)	Tin Lead	Perpendicular	S-CPGA-P160	1	5.34 mm	39.624 mm	No	336 Logic Elements	e0	385 MHz		116	220 °C (428 °F)	39.624 mm		120
EPF8282AVTC100-4	Altera	Loadable PLD	Commercial	Gull Wing	100	LFQFP	Square	Plastic/Epoxy		208	Yes	3.6 V		CMOS		78		3.3		3.3 V	Flatpack, Low Profile, Fine Pitch	TQFP100,.63SQ	Field Programmable Gate Arrays		Registered	3 V		.5 mm	70 °C (158 °F)	4 Dedicated Inputs, 78 I/O	4	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G100	3	1.27 mm	14 mm	No	208 Logic Elements	e0	357 MHz		74	220 °C (428 °F)	14 mm		78
GAL22V10D-10LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.5 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.5 V	132	2.54 mm	85 °C (185 °F)	11 Dedicated Inputs, 10 I/O	11	-40 °C (-40 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz		10		31.75 mm		10
GAL22V10D-15LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24	1	5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	55.5 MHz		10		31.75 mm		10
GAL22V10D-25LP	Lattice Semiconductor	EE PLD	Commercial Extended	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	25 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	132	2.54 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Dual	R-PDIP-T24		5.334 mm	7.62 mm	No	10 Macrocells; Shared Input/Clock	e0	33.3 MHz	30 s	10	225 °C (437 °F)	31.75 mm		10
GAL22V10D-10QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	83.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
GAL22V10D-25QJ	Lattice Semiconductor	EE PLD	Commercial Extended	J Bend	28	QCCJ	Square	Plastic/Epoxy	25 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	132	1.27 mm	75 °C (167 °F)	11 Dedicated Inputs, 10 I/O	11	0 °C (32 °F)	Tin/Lead (Sn85Pb15)	Quad	S-PQCC-J28	1	4.572 mm	11.5062 mm	No	10 Macrocells; Shared Input/Clock	e0	33.3 MHz	30 s	10	225 °C (437 °F)	11.5062 mm		10
EPM7032VLC44-15	Altera	EE PLD	Commercial	J Bend	44	QCCJ	Square	Plastic/Epoxy	15 ns		Yes	3.6 V	32	CMOS				3.3		3.3 V	Chip Carrier	LDCC44,.7SQ	Programmable Logic Devices	No	Macrocell	3 V		1.27 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J44		4.57 mm	16.5862 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	76.9 MHz			220 °C (428 °F)	16.5862 mm	No	32
EPM7032VTC44-12	Altera	EE PLD	Commercial	Gull Wing	44	LQFP	Square	Plastic/Epoxy	12 ns		Yes	3.6 V	32	CMOS				3.3		3.3 V	Flatpack, Low Profile	TQFP44,.47SQ,32	Programmable Logic Devices	No	Macrocell	3 V		.8 mm	70 °C (158 °F)	0 Dedicated Inputs, 32 I/O	0	0 °C (32 °F)	Tin Lead	Quad	S-PQFP-G44	3	1.27 mm	10 mm	No	Labs interconnected by PIA; 2 Labs; 32 Macrocells; 1 External Clock; Shared Input/Clock	e0	90.9 MHz			220 °C (428 °F)	10 mm	No	32
EP224PC-10	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	8 Macrocells	e0	62.5 MHz		8	220 °C (428 °F)	31.6865 mm		8
EP224PC-7	Altera	OT PLD	Commercial	Through-Hole	24	DIP	Rectangular	Plastic/Epoxy	7.5 ns		No	5.25 V		CMOS		22	PAL-TYPE	5		5 V	In-Line	DIP24,.3	Programmable Logic Devices		Macrocell	4.75 V	72	2.54 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T24		4.318 mm	7.62 mm	No	8 Macrocells	e0	100 MHz		8	220 °C (428 °F)	31.6865 mm		8
EP224LC-10	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	10 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	62.5 MHz		8	220 °C (428 °F)	11.5062 mm		8
EP224LC-12	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	12 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	90.9 MHz		8	220 °C (428 °F)	11.5062 mm		8
EP224LC-7	Altera	OT PLD	Commercial	J Bend	28	QCCJ	Square	Plastic/Epoxy	7.5 ns		Yes	5.25 V		CMOS		22	PAL-TYPE	5		5 V	Chip Carrier	LDCC28,.5SQ	Programmable Logic Devices		Macrocell	4.75 V	72	1.27 mm	70 °C (158 °F)	13 Dedicated Inputs, 8 I/O	13	0 °C (32 °F)	Tin Lead	Quad	S-PQCC-J28		4.572 mm	11.5062 mm	No	8 Macrocells	e0	100 MHz		8	220 °C (428 °F)	11.5062 mm		8
GAL16V8D-10LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	10 ns		No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No	Programmable Output Polarity	e0	66.7 MHz		8		26.162 mm		8
GAL16V8D-15LPI	Lattice Semiconductor	EE PLD	Industrial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.5 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.5 V	64	2.54 mm	85 °C (185 °F)	8 Dedicated Inputs, 8 I/O	8	-40 °C (-40 °F)	Tin/Lead	Dual	R-PDIP-T20		5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8
GAL16V8D-15LP	Lattice Semiconductor	EE PLD	Commercial	Through-Hole	20	DIP	Rectangular	Plastic/Epoxy	15 ns		No	5.25 V		CMOS		18	PAL-TYPE	5		5 V	In-Line	DIP20,.3	Programmable Logic Devices		Macrocell	4.75 V	64	2.54 mm	70 °C (158 °F)	8 Dedicated Inputs, 8 I/O	8	0 °C (32 °F)	Tin Lead	Dual	R-PDIP-T20	1	5.334 mm	7.62 mm	No		e0	45.5 MHz	30 s	8	225 °C (437 °F)	26.162 mm		8

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.