Surface Mount-Straight DIP & SIP Switches 159

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Part RoHS Manufacturer Mounting Feature Maximum Contact AC Rating (R Load) Electrical Life Maximum Contact DC Power Rating (R Load) Insulation Resistance Packing Method Body Length/Diameter Body Width Sealing End Contact Plating Body Height Maximum Contact DC Rating (R Load) Maximum Operating Temperature Maximum AC Contact Current Minimum Operating Temperature Terminal Finish Maximum DC Contact Current Termination Type Manufacturer Series Contact Resistance End Contact Material PCB Hole Count Maximum DC Contact Voltage Additional Features Maximum AC Contact Voltage JESD-609 Code Terminal Length Maximum Contact AC Power Rating (R Load)

A6SN-6102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.677 in (17.2 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

A6SN-7102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.776 in (19.7 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

CHS-01TB2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.213 in (5.4 mm)

2.5 in (63.5 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

CHS-02B1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.213 in (5.4 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-06A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

A6SN-8102-P

Omron

Surface Mount-Straight

1000 Cycle(s)

100 MΩ

Tape and Reel, Embossed; Tube

0.878 in (22.3 mm)

7.5 in (190.5 mm)

IP40; Waterproof; Top Tape Sealed

0.138 in (3.5 mm)

0.025A@24VDC

85 °C (185 °F)

-30 °C (-22 °F)

25 mA

Solder

200 mΩ

24 V

CHS-02TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TB2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TA1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-02TA2

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.22 in (5.6 mm)

4.1 in (104.14 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04TB1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tape and Reel, Embossed, 10 in

0.26 in (6.6 mm)

5.4 in (137.16 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

Gold

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

e4

CHS-04A1

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.26 in (6.6 mm)

5.6 in (142.24 mm)

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

CHS-06A

Nidec Copal Electronics

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Bag

0.362 in (9.2 mm)

5.6 in (142.24 mm)

Waterproof

Gold

0.098 in (2.5 mm)

0.1A@6VDC

85 °C (185 °F)

-40 °C (-40 °F)

100 mA

Solder

50 mΩ

Copper Alloy

6 V

Low Profile

219-4LPST-P

Cts

Surface Mount-Straight

2000 Cycle(s)

1 GΩ

Tube

0.458 in (11.63 mm)

6.68 in (169.672 mm)

Environmentally Sealed; Waterproof

Gold

0.158 in (4.02 mm)

85 °C (185 °F)

-55 °C (-67 °F)

Solder

50 mΩ

Beryllium Copper

Low Profile, Standard: UL

DIP & SIP Switches

DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.

DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.

SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.