33 ohm Resistor Networks & Arrays 9

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Part	Manufacturer	Resistor Type	Mounting Type	Resistance	Rated Power Dissipation (P)	Maximum Operating Temperature	Tolerance	Element Power Dissipation	Rated Temperature	No. of Functions	Technology	Shape (Package)	No. of Elements	Construction	Packing Method	Size Code	Network Type	No. of Terminals	Package Style (Meter)	Terminal Shape	Sub-Category	First Element Resistance	Minimum Operating Temperature	Temperature Coef (ppm/Cel)	Terminal Finish	Second or Last Element Resistance	Height (Package)	Manufacturer Series	Operating Voltage	Length (Package)	JESD-609 Code	Series	Reference Standard	Width (Package)
741X163330JPC8	Cts	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.504 W	125 Cel	5 %	.063 W	70 Cel	8	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Chip	TR, PAPER, 7 INCH	1606	ISOLATED	16	SMT	WRAPAROUND	Array/Network Resistors	33 ohm	-55 Cel	200	Matte Tin (Sn)		.45 mm	74X	25 V	3.95 mm	e3	74X		1.6 mm
RP104PJ330CS	Samsung Electro-mechanics	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.0625 W	155 Cel	5 %		70 Cel	4	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Chip	TR, PUNCHED PAPER, 7 INCH	0408	ISOLATED	8	SMT	WRAPAROUND	ARRAY/NETWORK RESISTOR	33 ohm	-55 Cel	200	TIN OVER NICKEL		.35 mm		25 V	2 mm	e3			1 mm
CAY16-330J8LF	Bourns	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.031 W	125 Cel	5 %	.031 W	70 Cel	8	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Rectangular	TR, PAPER, 7 INCH	1506	ISOLATED	16	SMT	WRAPAROUND	ARRAY/NETWORK RESISTOR	33 ohm	-55 Cel	200	MATTE TIN OVER NICKEL	33 ohm	.5 mm		25 V	3.8 mm	e3			1.6 mm
CAT16-330J8LF	Bourns	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.25 W	125 Cel	5 %	.0625 W	70 Cel	8	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Rectangular	TR, PAPER, 7 INCH	2406	ISOLATED	16	SMT	WRAPAROUND	ARRAY/NETWORK RESISTOR	33 ohm	-55 Cel	200	MATTE TIN	33 ohm	.6 mm		50 V	6.4 mm	e3			1.6 mm
MNR18E0APJ330	ROHM	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm		125 Cel	5 %	.063 W	70 Cel	8	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Rectangular	TR, PAPER, 7 INCH	0615	ISOLATED	16	SMT	WRAPAROUND	ARRAY/NETWORK RESISTOR	33 ohm	-55 Cel	200	Tin (Sn) - with Nickel (Ni) barrier	33 ohm	.45 mm		25 V	3.8 mm	e3			1.6 mm
CRB3A4E330JT	KYOCERA AVX	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.0625 W	125 Cel	5 %	.0625 W	70 Cel	4		RECTANGULAR PACKAGE	1	Chip	TR, PUNCHED PAPER, 7 INCH	1206	ISOLATED	8	SMT	WRAPAROUND	Array/Network Resistors	33 ohm	-55 Cel		Matte Tin (Sn) - with Nickel (Ni) barrier		.6 mm	CRB	50 V	3.2 mm	e3	CRB3A4E		1.6 mm
MNR04M0APJ330	ROHM	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm		155 Cel	5 %	.063 W	70 Cel	4	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Rectangular	TR, PAPER, 7 INCH	0408	ISOLATED	8	SMT	WRAPAROUND	ARRAY/NETWORK RESISTOR	33 ohm	-55 Cel	200	TIN OVER NICKEL	33 ohm	.35 mm		25 V	2 mm	e3			1 mm
741X163330J	Cts	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.504 W	125 Cel	5 %	.063 W	70 Cel	8	METAL GLAZE/THICK FILM	RECTANGULAR PACKAGE	1	Chip	TR, PAPER, 7 INCH	0615	ISOLATED	16	SMT	WRAPAROUND	Array/Network Resistors	33 ohm	-55 Cel	200	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier		.45 mm	741	25 V	3.8 mm	e0	741X163(GJ TOL)		1.6 mm
CAT16A-330J4LF	Bourns	ARRAY/NETWORK RESISTOR	SURFACE MOUNT	33 ohm	.063 W	125 Cel	5 %	.063 W	70 Cel	4	METAL GLAZE/THICK FILM		1	Rectangular	TR, PAPER, 7 INCH	1206	ISOLATED	8	SMT	WRAPAROUND		33 ohm	-55 Cel	200	TIN	33 ohm	.55 mm		50 V	3.2 mm	e3		AEC-Q200	1.5 mm

Resistor Networks & Arrays

Resistor networks and arrays are electronic components that are designed to combine multiple resistors into a single package. These components are commonly used in various electronic circuits and applications where multiple resistors are required in a small space. Resistor networks and arrays come in different configurations and types, including isolated and non-isolated networks, bussed and isolated bussed arrays, thick and thin film technologies, and more.

Isolated resistor networks and arrays consist of several isolated resistors that are enclosed in a single package. They are used in applications where separate biasing and matching of each resistor is required. Non-isolated resistor networks and arrays consist of resistors that share a common connection, and they are used in applications where multiple resistors are required for biasing or filtering.

Bussed resistor arrays are designed with a common connection between the resistors in a single package, which simplifies the wiring process and reduces the overall size of the circuit. Isolated bussed resistor arrays, on the other hand, offer the benefits of a bussed resistor array, but with the added isolation of the resistors from each other, which can be beneficial in certain applications.

Thick film resistor networks and arrays are made of a ceramic substrate on which a resistive film is deposited. Thin film resistor networks and arrays, on the other hand, are made by depositing a thin film of metal or metal oxide on a ceramic substrate. These technologies offer different performance characteristics, such as power handling, temperature coefficient, and noise performance.