| Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
L-3 Narda-miteq |
DOUBLE BALANCED |
2.5 |
COAXIAL |
85 Cel |
-54 Cel |
9 dB |
SMA-F |
1000 MHz |
18000 MHz |
|||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
TIN LEAD |
e0 |
||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
TIN LEAD |
e0 |
||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
700 MHz |
3000 MHz |
|||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
5 |
LCC40,.24SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
2500 MHz |
2900 MHz |
|||||||
|
L-3 Narda-miteq |
DOUBLE BALANCED |
1.5 |
85 Cel |
-54 Cel |
10 dB |
HIGH RELIABILITY, HIGH DYNAMIC RANGE |
2000 MHz |
26000 MHz |
||||||||||||||||
|
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
85 Cel |
-40 Cel |
HIGH RELIABILITY |
390 MHz |
500 MHz |
|||||||||||||||
|
|
Broadcom |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
12 dB |
18000 MHz |
40000 MHz |
|||||||||
|
|
Broadcom |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
12 dB |
18000 MHz |
40000 MHz |
|||||||||
|
|
Broadcom |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
25 dBm |
COMPONENT |
LCC8,.2SQ,28 |
50 ohm |
RF/Microwave Mixers |
125 Cel |
-55 Cel |
12 dB |
18000 MHz |
40000 MHz |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
HIGH ISOLATION |
e3 |
1200 MHz |
2500 MHz |
||||||
|
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
1700 MHz |
2200 MHz |
|||||||||||||
|
|
Skyworks Solutions |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
HIGH RELIABILITY |
700 MHz |
1000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
HIGH ISOLATION |
500 MHz |
1700 MHz |
||||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
HIGH ISOLATION |
e3 |
500 MHz |
1700 MHz |
|||||||||||||
|
|
NXP Semiconductors |
DOUBLE BALANCED |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
10 dBm |
2 |
8 mA |
COMPONENT |
2.8 |
TSSOP6,.08 |
50 ohm |
RF/Microwave Mixers |
Tin (Sn) |
e3 |
880 MHz |
2450 MHz |
||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
8.4 dB |
HIGH ISOLATION |
e3 |
1200 MHz |
2500 MHz |
||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
8.5 dB |
HIGH ISOLATION |
e3 |
500 MHz |
1700 MHz |
||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
14 |
PLASTIC/EPOXY |
BIPOLAR |
2 |
75 mA |
COMPONENT |
5 |
TSSOP14,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
0 MHz |
2500 MHz |
|||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BIPOLAR |
MODULE |
+-5 |
LDCC20,.4SQ |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
HIGH ISOLATION |
e3 |
1200 MHz |
2500 MHz |
|||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
HIGH ISOLATION |
e3 |
1200 MHz |
2500 MHz |
|||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
HIGH ISOLATION |
e3 |
500 MHz |
1700 MHz |
|||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
20 dBm |
COMPONENT |
3.3/5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
HIGH ISOLATION |
e3 |
500 MHz |
1700 MHz |
|||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
7 |
GAAS |
25 dBm |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
|||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
|||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
|||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
18 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
12.5 dB |
14000 MHz |
30000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
10 dB |
6000 MHz |
14000 MHz |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
9 dB |
4000 MHz |
8000 MHz |
|||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
16 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
TUNGSTEN NICKEL GOLD |
14 dB |
2250 MHz |
18000 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
13 dBm |
COMPONENT |
TSSOP8,.19 |
85 Cel |
-40 Cel |
10 dB |
1500 MHz |
4500 MHz |
|||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
27 dBm |
3 mA |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
12 dB |
10000 MHz |
26000 MHz |
||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
11.5 dB |
25000 MHz |
40000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
TUNGSTEN NICKEL GOLD |
11 dB |
4000 MHz |
8500 MHz |
||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
11.5 dB |
10000 MHz |
20000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
9.5 dB |
5500 MHz |
14000 MHz |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
15.5 dB |
7000 MHz |
34000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
13.5 dB |
24000 MHz |
32000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
18 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
12.5 dB |
14000 MHz |
32000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
2500 MHz |
7000 MHz |
||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
9.5 dB |
5500 MHz |
14000 MHz |
||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
25 dBm |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tungsten/Nickel/Gold (W/Ni/Au) |
9.5 dB |
5500 MHz |
14000 MHz |
|||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
21 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
13 dB |
6000 MHz |
26000 MHz |
||||||||||||||
|
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
13.5 dB |
24000 MHz |
34000 MHz |
||||||||||||||
|
L-3 Narda-miteq |
DOUBLE BALANCED |
2.5 |
COAXIAL |
85 Cel |
-54 Cel |
9 dB |
SMA-F |
1000 MHz |
18000 MHz |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.