| Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Maximum RF Output Frequency | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Minimum RF Output Frequency | Construction | Minimum RF Input Frequency | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Minimum Up Conversion Gain | Maximum Operating Temperature | Minimum Down Conversion Gain | Maximum Output Power | Minimum Intermediate Frequency (IF) | Maximum RF Input Frequency | Minimum Operating Temperature | Terminal Finish | LO Tunable | Maximum Noise Figure | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Input Power (CW) | Minimum Operating Frequency | Maximum Intermediate Frequency (IF) | Maximum Operating Frequency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
STMicroelectronics |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
CMOS |
1.8 |
LCC32,.2SQ,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Silver (Ag) |
e4 |
|||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
5 |
LCC16,.1X.14,20 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
||||||||||||||||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
COMPONENT |
5600 MHz |
3.5 |
LCC24,.16SQ,20 |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
Matte Tin (Sn) - annealed |
YES |
2.5 dB |
e3 |
3500 MHz |
||||||||||||||
|
|
STMicroelectronics |
DOWN CONVERTER |
SURFACE MOUNT |
44 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
1850 MHz |
3.3,5 |
LCC44,.28SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2400 MHz |
-40 Cel |
Matte Tin (Sn) - annealed |
YES |
e3 |
|||||||||||||||||
|
|
STMicroelectronics |
DOWN CONVERTER |
SURFACE MOUNT |
44 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
1850 MHz |
3.3,5 |
LCC44,.28SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2400 MHz |
-40 Cel |
Matte Tin (Sn) - annealed |
YES |
e3 |
|||||||||||||||||
|
Maxim Integrated |
UP CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
2500 MHz |
2.2 |
6.6 mA |
400 MHz |
COMPONENT |
3/5 |
TSOP6,.11,37 |
50 ohm |
RF/Microwave Up/Down Converters |
3.9 dB |
85 Cel |
40 MHz |
-40 Cel |
TIN LEAD |
NO |
11.9 dB |
e0 |
500 MHz |
||||||||||||
|
Maxim Integrated |
UP CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
2500 MHz |
2.1 |
4.1 mA |
400 MHz |
COMPONENT |
3/5 |
TSOP6,.11,37 |
50 ohm |
RF/Microwave Up/Down Converters |
-.1 dB |
85 Cel |
40 MHz |
-40 Cel |
TIN LEAD |
NO |
12.7 dB |
e0 |
500 MHz |
||||||||||||
|
Maxim Integrated |
UP CONVERTER |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
BIPOLAR |
2500 MHz |
2.2 |
26.8 mA |
400 MHz |
COMPONENT |
3/5 |
TSSOP8,.19 |
50 ohm |
RF/Microwave Up/Down Converters |
7.8 dB |
85 Cel |
40 MHz |
-40 Cel |
TIN LEAD |
NO |
10.4 dB |
e0 |
500 MHz |
||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
1.5 |
7.7 mA |
400 MHz |
3/5 |
TSOP6,.11,37 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
5.7 dB |
10 MHz |
2500 MHz |
-40 Cel |
TIN LEAD |
YES |
e0 |
500 MHz |
||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
1.5 |
12.7 mA |
400 MHz |
3/5 |
TSOP6,.11,37 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
6.7 dB |
10 MHz |
2500 MHz |
-40 Cel |
TIN LEAD |
YES |
e0 |
500 MHz |
||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
BIPOLAR |
1.5 |
21.8 mA |
400 MHz |
3/5 |
TSOP6,.11,37 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
8.7 dB |
10 MHz |
2500 MHz |
-40 Cel |
TIN LEAD |
YES |
e0 |
500 MHz |
||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
1.7 |
230 mA |
COMPONENT |
1800 MHz |
3 |
TQFP48,.35SQ |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2100 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
YES |
e0 |
|||||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
265 mA |
COMPONENT |
400 MHz |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
50 MHz |
1000 MHz |
-40 Cel |
TIN LEAD |
YES |
e0 |
250 MHz |
|||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
265 mA |
COMPONENT |
815 MHz |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
9 dB |
50 MHz |
995 MHz |
-40 Cel |
TIN LEAD |
YES |
9.3 dB |
e0 |
250 MHz |
|||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
235 mA |
COMPONENT |
1700 MHz |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
7.2 dB |
40 MHz |
2200 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
YES |
9.7 dB |
e0 |
350 MHz |
|||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
235 mA |
COMPONENT |
1700 MHz |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
7.2 dB |
40 MHz |
2200 MHz |
-40 Cel |
TIN LEAD |
YES |
9.7 dB |
e0 |
350 MHz |
|||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
240 mA |
COMPONENT |
1700 MHz |
5 |
LCC20,.20SQ,25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
7 dB |
40 MHz |
2200 MHz |
-40 Cel |
TIN LEAD |
YES |
9.7 dB |
e0 |
350 MHz |
|||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
265 mA |
COMPONENT |
925 MHz |
5 |
LCC40,.24SQ,20 |
30 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2175 MHz |
0 Cel |
Tin/Lead (Sn/Pb) |
YES |
e0 |
||||||||||||||||||
|
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
COMPONENT |
5 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
85 Cel |
21 dB |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NO |
10 dB |
e4 |
|||||||||||||||||||
|
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
COMPONENT |
5 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
85 Cel |
21 dB |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NO |
10 dB |
e4 |
|||||||||||||||||||
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
COMPONENT |
5 |
TSSOP16,.25 |
RF/Microwave Up/Down Converters |
85 Cel |
21 dB |
-20 Cel |
NO |
10 dB |
||||||||||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
44 |
PLASTIC/EPOXY |
275 mA |
COMPONENT |
925 MHz |
5 |
LCC44,.28SQ,20 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2175 MHz |
0 Cel |
Tin/Lead (Sn85Pb15) |
YES |
e0 |
-25 dBm |
|||||||||||||||||
|
|
Texas Instruments |
DOWN CONVERTER |
SURFACE MOUNT |
120 |
PLASTIC/EPOXY |
CMOS |
400 mA |
COMPONENT |
3.3 |
QFP120,1.2SQ,32 |
RF/Microwave Up/Down Converters |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
YES |
e4 |
|||||||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
48 |
PLASTIC/EPOXY |
275 mA |
COMPONENT |
925 MHz |
5 |
TQFP48,.35SQ |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2175 MHz |
0 Cel |
Tin/Lead (Sn85Pb15) |
YES |
e0 |
-25 dBm |
|||||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
CERAMIC |
265 mA |
COMPONENT |
925 MHz |
5 |
LCC40,.24SQ,20 |
30 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
2175 MHz |
0 Cel |
Tin/Lead (Sn85Pb15) |
YES |
e0 |
||||||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
25.3 mA |
COMPONENT |
800 MHz |
3/3.3 |
TSSOP20,.25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
7.8 dB |
50 MHz |
2500 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
YES |
11.5 dB |
e0 |
400 MHz |
||||||||||||||
|
Maxim Integrated |
DOWN CONVERTER |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
30.8 mA |
COMPONENT |
800 MHz |
3/3.3 |
TSSOP20,.25 |
50 ohm |
RF/Microwave Up/Down Converters |
85 Cel |
9.6 dB |
50 MHz |
2500 MHz |
-40 Cel |
Tin/Lead (Sn/Pb) |
YES |
13.5 dB |
e0 |
400 MHz |
||||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
32 |
COMPONENT |
24000 MHz |
1.8,3.3 |
LCC32,.2SQ,20 |
50 ohm |
85 Cel |
12.5 dB |
800 MHz |
44000 MHz |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
8.5 dB |
e4 |
6000 MHz |
||||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
23600 MHz |
5900 MHz |
COMPONENT |
1.8,3.3,5 |
LCC32,.2SQ,20 |
100 ohm |
7 dB |
85 Cel |
800 MHz |
-40 Cel |
YES |
3500 MHz |
||||||||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
200 mA |
COMPONENT |
5600 MHz |
3.5 |
LCC24,.16SQ,20 |
85 Cel |
10 dB |
0 MHz |
8600 MHz |
-40 Cel |
MATTE TIN |
YES |
2.5 dB |
e3 |
3500 MHz |
||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
20000 MHz |
17000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
13.5 dB |
85 Cel |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
e3 |
10 dBm |
3500 MHz |
||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
24000 MHz |
21000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
10 dB |
85 Cel |
4 dBm |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
14 dB |
e3 |
10 dBm |
3500 MHz |
||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
GAAS |
COMPONENT |
71000 MHz |
DIE OR CHIP |
85 Cel |
8 dB |
0 MHz |
76000 MHz |
-55 Cel |
YES |
10000 MHz |
||||||||||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
GAAS |
COMPONENT |
71000 MHz |
DIE OR CHIP |
85 Cel |
8 dB |
0 MHz |
76000 MHz |
-55 Cel |
YES |
10000 MHz |
||||||||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
24 |
GAAS |
76000 MHz |
71000 MHz |
COMPONENT |
DIE OR CHIP |
50 ohm |
85 Cel |
0 MHz |
-55 Cel |
YES |
10 dBm |
10000 MHz |
|||||||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
CERAMIC |
GAAS |
27000 MHz |
21000 MHz |
COMPONENT |
4.5 |
LCC32,.2SQ,20 |
50 ohm |
7 dB |
85 Cel |
20 dBm |
0 MHz |
-40 Cel |
GOLD OVER NICKEL |
YES |
e4 |
15 dBm |
3750 MHz |
|||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
24000 MHz |
21000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
10 dB |
85 Cel |
4 dBm |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
14 dB |
e3 |
10 dBm |
3500 MHz |
||||||||||||
|
|
Analog Devices |
DOWN CONVERTER |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
150 mA |
COMPONENT |
700 MHz |
3.3 |
LCC40,.24SQ,20 |
50 ohm |
85 Cel |
4.7 dB |
50 MHz |
3800 MHz |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
15.7 dB |
ADDITIONAL 5V SUPPLY IS ALSO REQUIRED |
e4 |
20 dBm |
350 MHz |
||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
23600 MHz |
5900 MHz |
COMPONENT |
1.8,3.3,5 |
LCC32,.2SQ,20 |
100 ohm |
7 dB |
85 Cel |
800 MHz |
-40 Cel |
NICKEL PALLADIUM GOLD |
YES |
e4 |
3500 MHz |
||||||||||||||||
|
|
Analog Devices |
UP CONVERTER |
SURFACE MOUNT |
32 |
PLASTIC/EPOXY |
GAAS |
20000 MHz |
17000 MHz |
COMPONENT |
5 |
LCC32,.2SQ,20 |
50 ohm |
13.5 dB |
85 Cel |
0 MHz |
-40 Cel |
MATTE TIN |
YES |
e3 |
10 dBm |
3500 MHz |
RF/microwave up/down converters are electronic devices that can convert high frequency (HF) signals to a lower frequency or vice versa. These converters are essential components of modern communication systems, where the frequency of the signal needs to be changed to enable transmission and reception. The up/down conversion process can be achieved through a variety of methods, including heterodyne mixing, direct mixing, and superheterodyne mixing.
Heterodyne mixing involves mixing the incoming signal with a local oscillator signal to generate an intermediate frequency (IF) signal. This method is widely used in superheterodyne receivers and is often used in upconversion. Direct mixing involves converting the frequency of the input signal to the desired frequency using a nonlinear device such as a diode. This method is often used in frequency synthesizers and mixers.
Superheterodyne mixing combines the advantages of heterodyne and direct mixing to achieve high sensitivity and selectivity. In a superheterodyne receiver, the incoming signal is mixed with a local oscillator signal to produce an IF signal, which is then amplified and demodulated. Superheterodyne mixing is also used in frequency upconversion, where the input signal is mixed with a local oscillator signal to produce the desired output frequency.
RF/microwave up/down converters are used in a variety of applications, including wireless communication systems, satellite communication systems, radar systems, and test and measurement equipment. They are available in various forms, including integrated circuits (ICs), modules, and subsystems, and can operate at a range of frequencies, from a few megahertz to several gigahertz.