| Part | RoHS | Manufacturer | Sensors or Transducers Type | Mounting Feature | Output Type | Package Shape or Style | Output Range | Pixel Size (um) | Maximum Supply Voltage | Screening Level | Master Clock | Body Length/Diameter | Body Width | Spectral Response (nm) | Power Supplies (V) | Optical Format (inch) | Sub-Category | Body Height | Minimum Supply Voltage | Maximum Operating Temperature | Horizontal Pixel | Minimum Operating Temperature | Terminal Finish | Termination Type | Data Rate | Output Interface Type | Frame Rate | Maximum Operating Current | Array Type | Additional Features | Housing | JESD-609 Code | Dynamic Range | Vertical Pixel |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
33.02 mm |
20.07 inch |
1 |
14.5 V |
70 Cel |
2336 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
1752 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
33.02 mm |
20.07 inch |
1 |
14.5 V |
70 Cel |
2336 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
1752 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON |
66 dB |
2472 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON |
66 dB |
2472 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON |
66 dB |
2472 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON |
66 dB |
2472 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS A SENSITIVITY OF 39 MICRO VOLT PER ELECTRON |
66 dB |
2472 |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
7.4X7.4 |
15.5 V |
40 MHz |
47.24 mm |
45.34 inch |
1.37 |
3.61 mm |
14.5 V |
70 Cel |
4864 |
-50 Cel |
SOLDER |
8 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 33 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS OPTICAL FORMAT 1.37 INCH, IT HAS EXTENDED LINEAR DYNAMIC RANGE 82.5 DB |
70.5 dB |
3232 |
|||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
7.4X7.4 |
15.5 V |
40 MHz |
47.24 mm |
45.34 inch |
1.37 |
3.61 mm |
14.5 V |
70 Cel |
4864 |
-50 Cel |
SOLDER |
8 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 33 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS OPTICAL FORMAT 1.37 INCH, IT HAS EXTENDED LINEAR DYNAMIC RANGE 82.5 DB |
70.5 dB |
3232 |
|||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
7.4X7.4 |
15.5 V |
40 MHz |
47.24 mm |
45.34 inch |
1.37 |
3.61 mm |
14.5 V |
70 Cel |
4864 |
-50 Cel |
SOLDER |
8 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 33 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS OPTICAL FORMAT 1.37 INCH, IT HAS EXTENDED LINEAR DYNAMIC RANGE 82.5 DB |
70.5 dB |
3232 |
|||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 MHz |
69.96 mm |
44.55 inch |
3.25 mm |
14.5 V |
70 Cel |
8856 |
-50 Cel |
SOLDER |
7 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
66 dB |
5280 |
||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 MHz |
69.96 mm |
44.55 inch |
3.25 mm |
14.5 V |
70 Cel |
8856 |
-50 Cel |
SOLDER |
7 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
66 dB |
5280 |
||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 MHz |
69.96 mm |
44.55 inch |
3.25 mm |
14.5 V |
70 Cel |
8856 |
-50 Cel |
SOLDER |
7 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
66 dB |
5280 |
||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 MHz |
69.96 mm |
44.55 inch |
3.25 mm |
14.5 V |
70 Cel |
8856 |
-50 Cel |
SOLDER |
7 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
66 dB |
5280 |
||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 MHz |
69.96 mm |
44.55 inch |
3.25 mm |
14.5 V |
70 Cel |
8856 |
-50 Cel |
SOLDER |
7 fps |
INTERLINE |
IT HAS A SENSITIVITY OF 38 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER |
66 dB |
5280 |
||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
14X14 |
12.5 V |
48.01 mm |
15.24 inch |
5.51 mm |
11.5 V |
SOLDER |
20 Mbps |
LINEAR |
SENSITIVITY IS 11.5 MICRO VOLT PER ELECTRON |
CERAMIC |
76 dB |
||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
10X10 |
15.5 V |
60.96 mm |
10.16 inch |
5.89 mm |
14.5 V |
70 Cel |
0 Cel |
SOLDER |
30 Mbps |
LINEAR |
SENSITIVITY IS 11.5 MICRO VOLT PER ELECTRON LUMA, 14 MICRO VOLT PER ELECTRON CHROMA; IT ALSO HAVE PIXEL SIZE LUMA 5 X 5 UM |
CERAMIC |
60 dB |
||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
10X10 |
15.5 V |
60.96 mm |
10.16 inch |
5.89 mm |
14.5 V |
70 Cel |
0 Cel |
SOLDER |
30 Mbps |
LINEAR |
SENSITIVITY IS 11.5 MICRO VOLT PER ELECTRON LUMA, 14 MICRO VOLT PER ELECTRON CHROMA; IT ALSO HAVE PIXEL SIZE LUMA 5 X 5 UM |
CERAMIC |
60 dB |
||||||||||||||||
|
|
Onsemi |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
0.45-1.55V |
4.70X4.70 |
2.1 V |
50 MHz |
42.5 mm |
38.1 inch |
4/3 |
1.9 V |
80 Cel |
4000 |
-20 Cel |
SOLDER |
SPI INTERFACE |
70 fps |
FRAME |
IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 1.71 TO 1.89 V, GLOBAL SHUTTER, ROLLING SHUTTER |
CERAMIC |
73 dB |
3000 |
||||||||||
|
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
7.4X7.4 |
15.5 V |
45.34 mm |
44.45 inch |
4.88 mm |
14.5 V |
70 Cel |
4872 |
-50 Cel |
SOLDER |
30 Mbps |
INTERLINE |
IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT HAS 1.37 INCH OPTICAL FORMAT |
65 dB |
3248 |
|||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS OUTPUT SENSITIVITY 35 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER |
66 dB |
2472 |
|||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS OUTPUT SENSITIVITY 35 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER |
66 dB |
2472 |
|||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
40 mm |
29 inch |
4/3 |
14.5 V |
70 Cel |
3296 |
-50 Cel |
SOLDER |
INTERLINE |
IT HAS OUTPUT SENSITIVITY 35 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER |
66 dB |
2472 |
|||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15 V |
43.5 mm |
41 inch |
4/3 |
3.25 mm |
14.7 V |
40 Cel |
2856 |
-70 Cel |
SOLDER |
14 fps |
9 mA |
INTERLINE |
IT HAS OUTPUT SENSITIVITY 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; GLOBAL SHUTTER |
86 dB |
2856 |
||||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
1 |
70 Cel |
-30 Cel |
Matte Tin (Sn) |
SOLDER |
SPI INTERFACE |
37 fps |
FRAME |
GLOBAL SHUTTER, EXTENDED DYNAMIC RANGE UPTO 90 DB |
CERAMIC |
e3 |
60 dB |
|||||||||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
1 |
70 Cel |
-30 Cel |
Matte Tin (Sn) |
SOLDER |
SPI INTERFACE |
37 fps |
FRAME |
GLOBAL SHUTTER, EXTENDED DYNAMIC RANGE UPTO 90 DB |
CERAMIC |
e3 |
60 dB |
|||||||||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
1 |
70 Cel |
-30 Cel |
Matte Tin (Sn) |
SOLDER |
SPI INTERFACE |
37 fps |
FRAME |
GLOBAL SHUTTER, EXTENDED DYNAMIC RANGE UPTO 90 DB |
CERAMIC |
e3 |
60 dB |
|||||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
CURRENT OUTPUT |
RECTANGULAR |
12X12 |
17 V |
63.8 mm |
51.25 inch |
3.45 mm |
14.8 V |
60 Cel |
3024 |
-50 Cel |
SOLDER |
FULL FRAME |
IT HAS A OUTPUT SENSITIVITY OF 24 MICROVOLT PER ELECTRON; IT ALSO OPERATES AT DYNAMIC RANGE 75 DB AT 20 MHZ LINEAR |
CERAMIC |
84 dB |
3024 |
|||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
VOLTAGE OUTPUT |
RECTANGULAR |
7.4X7.4 |
15.3 V |
43.5 mm |
41 inch |
4/3 |
14.7 V |
40 Cel |
2096 |
-30 Cel |
SOLDER |
20 Mbps |
30 fps |
9 mA |
INTERLINE |
ELECTRONIC AND GLOBAL SHUTTER; DATA RATE 40 MHZ HCCD; DYNAMIC RANGE 60 AND 92 DB HIGH GAIN AND INTRA-SCENE RESPECTIVELY; SENSITIVITY 45 MICRO V/E- |
72 dB |
2096 |
|||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
CURRENT OUTPUT |
RECTANGULAR |
4.5X4.5 |
15.5 V |
47.24 mm |
45.34 inch |
4/2.9 |
3.61 mm |
14.5 V |
70 Cel |
8040 |
-50 Cel |
SOLDER |
60 Mbps |
11 mA |
INTERLINE |
IT HAVE OUTPUT SENSTIVITY OF 42 MICRO VOLT PER ELECTRON |
CERAMIC |
60 dB |
5360 |
||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
DIGITAL OUTPUT |
RECTANGULAR |
4.5X4.5 |
15.5 V |
60 MHz |
14.5 V |
60 Cel |
10440 |
-50 Cel |
SOLDER |
11 mA |
FRAME |
GLASS |
60 dB |
4800 |
|||||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
15.5 V |
47.24 mm |
45.34 inch |
1.7 |
3.61 mm |
14.5 V |
70 Cel |
6576 |
-50 Cel |
40 Mbps |
4 fps |
11 mA |
INTERLINE |
IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON |
64 dB |
4384 |
||||||||||||||
|
Onsemi |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
RECTANGULAR |
7.4X7.4 |
15.5 V |
40 mm |
29 inch |
4/3 |
3 mm |
14.5 V |
70 Cel |
2048 |
-50 Cel |
SOLDER |
28 fps |
11 mA |
INTERLINE |
IT HAS OUTPUT SENSITIVITY OF 8.7 MICRO VOLT PER ELECTRON LOW, 33 MICRO VOLT PER ELECTRON HIGH |
82 dB |
2048 |
||||||||||||||
|
Toshiba |
IMAGE SENSOR,CCD |
THROUGH HOLE MOUNT |
DIGITAL VOLTAGE |
RECTANGULAR |
1.50-3.50V |
8X200 |
5.5 V |
2 MHz |
41.6 mm |
9.65 inch |
400-1200 |
3.22 mm |
3 V |
60 Cel |
-25 Cel |
SOLDER |
1 Mbps |
LINEAR |
ELECTRONIC SHUTTER |
CERAMIC |
49.54 dB |
|||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
2/3 |
70 Cel |
2048 |
-30 Cel |
SPI INTERFACE |
340 fps |
FRAME |
GLOBAL SHUTTER |
CERAMIC |
90 dB |
1088 |
||||||||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
2/3 |
70 Cel |
2048 |
-30 Cel |
SPI INTERFACE |
340 fps |
FRAME |
GLOBAL SHUTTER |
CERAMIC |
90 dB |
1088 |
||||||||||||||||||
|
|
Ams Ag |
IMAGE SENSOR,CMOS |
THROUGH HOLE MOUNT |
RECTANGULAR |
5.5X5.5 |
2/3 |
70 Cel |
2048 |
-30 Cel |
SPI INTERFACE |
340 fps |
FRAME |
GLOBAL SHUTTER |
CERAMIC |
90 dB |
1088 |
Image sensors are electronic devices that capture images and convert them into digital signals that can be processed and stored in electronic devices such as cameras, smartphones, and security systems. They are a critical component of digital imaging technology and have revolutionized the way we capture and store visual information.
Image sensors work by detecting and converting light into electrical signals. They typically consist of a grid of millions of tiny photodiodes, each of which generates an electrical charge in response to the amount of light it receives. When light enters the sensor, it is absorbed by the photodiodes, which generate a corresponding electrical signal. The signals from each photodiode are then combined to form a digital image.
There are two main types of image sensors: charge-coupled devices (CCDs) and complementary metal-oxide-semiconductor (CMOS) sensors. CCDs are the older of the two technologies and are characterized by their high image quality, low noise, and low power consumption. CMOS sensors, on the other hand, are more modern and are known for their high-speed performance, low power consumption, and lower cost.
Image sensors are widely used in a variety of applications, including digital cameras, smartphones, security systems, and medical imaging. They have also enabled the development of new technologies such as virtual and augmented reality, self-driving cars, and facial recognition.