SQUARE Analog Data Transmission Interfaces 20

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Hybrid Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Maximum Noise Battery Supply (V) Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Minimum Power Supply Rejection Ratio (PSRR) Additional Features Battery Feed JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

SN75LVCP600DRFT

Texas Instruments

LINE EQUALIZER

OTHER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

40 mA

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

.8 mm

2 mm

Not Qualified

e4

30

260

2 mm

DS100DF410SQ/NOPB

Texas Instruments

LINE EQUALIZER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

4

CMOS

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

.8 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS100DF410SQE/NOPB

Texas Instruments

LINE EQUALIZER

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

4

CMOS

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

.8 mm

7 mm

Not Qualified

e3

30

260

7 mm

DS30EA101SQE/NOPB

Texas Instruments

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.065 mA

3.1 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

DS30EA101SQX/NOPB

Texas Instruments

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.065 mA

3.1 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

HPA02292SQ/NOPB

Texas Instruments

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.1 mA

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

STLC3080

STMicroelectronics

SLIC

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

.0055 mA

5 V

2-4 CONVERSION

3.3,5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

Analog Transmission Interfaces

.8 mm

85 Cel

-48

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G44

1.6 mm

10 mm

Not Qualified

27 dB

CONSTANT CURRENT/RESISTIVE

e4

10 mm

STLC30R80

STMicroelectronics

SLIC

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

2-4 CONVERSION

3.3/5

FLATPACK, LOW PROFILE

QFP44,.47SQ,32

Analog Transmission Interfaces

.8 mm

85 Cel

84 dBrnC

-48

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G44

1.6 mm

10 mm

Not Qualified

27 dB

CONSTANT CURRENT/RESISTIVE

e4

10 mm

SI3220-FQ

Silicon Labs

SLIC

COMMERCIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Analog Transmission Interfaces

.5 mm

70 Cel

15 dBrnC

-15 TO -99

0 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

Not Qualified

40 dB

CONSTANT CURRENT

NOT SPECIFIED

NOT SPECIFIED

10 mm

SI3220-G-GQR

Silicon Labs

SLIC

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

Not Qualified

40

260

10 mm

SI3220-GQ

Silicon Labs

SLIC

INDUSTRIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Analog Transmission Interfaces

.5 mm

85 Cel

15 dBrnC

-15 TO -99

-40 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

Not Qualified

40 dB

CONSTANT CURRENT

NOT SPECIFIED

NOT SPECIFIED

10 mm

STLC3080TR

STMicroelectronics

SLIC

INDUSTRIAL

GULL WING

44

LQFP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

FLATPACK, LOW PROFILE

.8 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G44

1.6 mm

10 mm

Not Qualified

10 mm

MAX3785UTT

Maxim Integrated

LINE EQUALIZER

OTHER

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.055 mA

1.8 V

1.8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC6,.11,37

Analog Transmission Interfaces

.95 mm

85 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-N6

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3805ETE

Maxim Integrated

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

1.8/3.3,3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N16

1

.8 mm

3 mm

Not Qualified

e0

3 mm

LE9652PQC

Microchip Technology

SLIC

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

2-4 CONVERSION

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

19 dBrnC

-12 TO -150

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

32 dB

CONSTANT CURRENT

7 mm

EQCO125X40C1-I/8EX

Microchip Technology

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

.95 mm

4 mm

e4

30

260

4 mm

HMC6545LP5ETR

Analog Devices

LINE EQUALIZER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N32

1

1 mm

5 mm

e3

30

260

5 mm

HMC6545LP5E

Analog Devices

LINE EQUALIZER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

Tin (Sn)

QUAD

S-XQCC-N32

1

1 mm

5 mm

e3

30

260

5 mm

LE87501NQC

Microchip Technology

SLIC

COMMERCIAL EXTENDED

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

12 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

.65 mm

85 Cel

0 Cel

QUAD

S-XQCC-N16

1 mm

4 mm

4 mm

LE9540DUQCT

Microchip Technology

SLIC

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5.6 mA

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

.5 mm

85 Cel

13 dBrnC

-12 TO -145

-40 Cel

QUAD

S-XQCC-N40

1 mm

6 mm

25 dB

CONSTANT CURRENT

6 mm

Analog Data Transmission Interfaces

Analog data transmission interfaces are used to transmit analog signals between electronic devices. They are commonly used in a variety of applications, such as audio and video equipment, medical devices, and industrial control systems.

Analog data transmission interfaces typically consist of a transmitter and a receiver. The transmitter converts the analog signal into a form that can be transmitted over a communication channel, such as a wire or radio frequency signal. The receiver then converts the transmitted signal back into its original analog form.

Some common types of analog data transmission interfaces include:

1. Analog audio interfaces: These are used to transmit audio signals between electronic devices, such as microphones, amplifiers, and speakers. Examples include XLR, RCA, and TRS connectors.

2. Composite video interfaces: These are used to transmit analog video signals, such as those used in standard definition television. Examples include RCA and BNC connectors.

3. VGA interfaces: These are used to transmit analog video signals from computers and other devices to displays, such as computer monitors and projectors.

4. Analog sensor interfaces: These are used to transmit analog signals from sensors, such as temperature sensors or pressure sensors, to electronic devices that can process and analyze the data.

Analog data transmission interfaces offer several advantages over digital interfaces. They are often simpler and less expensive to implement, and they can provide high-quality audio and video signals without the need for compression or conversion. However, they can also be susceptible to interference and noise, and their performance may be limited by the quality of the transmission channel.