ATM/SONET/SDH CLOCK RECOVERY CIRCUIT ATM/SONET/SDH Circuits 31

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MAX3675EHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.09 mA

3.3 V

3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3676EHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.111 mA

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

QFP32,.35SQ,32

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

245

5 mm

MAX3876EHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.167 mA

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP32,.28SQ

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

ADN2817ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.247 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2818ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.217 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2817ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.247 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2805ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SONET

YES

1

.131 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

MAX3877EHJ

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

BIPOLAR

3.3 V

FLATPACK, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

5 mm

MAX3676EHJ-T

Maxim Integrated

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

GULL WING

32

TFQFP

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

BIPOLAR

.111 mA

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

QFP32,.35SQ,32

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G32

1

1.2 mm

5 mm

Not Qualified

e0

245

5 mm

ADN2819ACPZ-CML-RL

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

ADN2812ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.259 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

260

5 mm

ADN2812ACPZ-RL

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.259 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2807ACPZ-RL

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

ADN2807ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

BIPOLAR

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

ADN2811ACPZ-CML

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.215 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

ADN2813ACPZ-500RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

155 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

5 mm

ADN2813ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

155 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2813ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

155 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

5 mm

ADN2814ACPZ-500RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

145 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2814ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

145 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2814ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

145 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2815ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

.131 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2816ACPZ-500RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

122 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2816ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

122 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2816ACPZ

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

122 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2806ACPZ-500RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

ADN2806ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

5 mm

ADN2804ACPZ-500RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

5 mm

ADN2804ACPZ-RL7

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

SDH; SONET

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

3

1 mm

5 mm

Not Qualified

e3

30

260

5 mm

HMC856LC5TR-R5

Analog Devices

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

INDUSTRIAL

NO LEAD

32

HQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

-3.3 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N32

3

1.12 mm

5 mm

e4

30

260

5 mm

VSC8247YJB-02

Microchip Technology

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

BGA144(UNSPEC)

95 Cel

BOTTOM

S-PBGA-B144

13 mm

13 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.