OTHER ATM/SONET/SDH Circuits 8

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ONET1101LRGETG4	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	118 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	100 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
MAX3832UCB	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	ATM; SDH; SONET	YES	1		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	1	1.2 mm	10 mm	Not Qualified	e0			10 mm
MAX3831UCB-D	Maxim Integrated	ATM/SONET/SDH MUX/DEMUX	OTHER	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e0			10 mm
SI5100-H-GL	Silicon Labs	ATM/SONET/SDH TRANSCEIVER	OTHER	BALL	195	LBGA	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	830 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE	BGA195,14X14,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B195		1.56 mm	15 mm	Not Qualified	e1			15 mm
ONET9901PARGPG4	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	.055 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N20		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
ONET1101LRGET	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1	118 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	100 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
ONET8511TY	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	SONET	YES	1	.07 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-25 Cel		UPPER	R-XUUC-N18				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
ONET9901PARGP	Texas Instruments	ATM/SONET/SDH SUPPORT CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	SDH; SONET	YES	1		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel		QUAD	S-PQCC-N20		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.