BALL ATM/SONET/SDH Circuits 13

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Applications Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

SI5100-H-GL

Silicon Labs

ATM/SONET/SDH TRANSCEIVER

OTHER

BALL

195

LBGA

SQUARE

PLASTIC/EPOXY

SDH; SONET

YES

1

830 mA

1.8 V

1.8

GRID ARRAY, LOW PROFILE

BGA195,14X14,40

ATM/SONET/SDH ICs

1 mm

85 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B195

1.56 mm

15 mm

Not Qualified

e1

15 mm

DS3162

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.3 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3163

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.381 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3164

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.468 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3181

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.28 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3182

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.448 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184N

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3184

Maxim Integrated

ATM/SONET/SDH NETWORK INTERFACE

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

ATM; SDH; SONET

YES

1

.85 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

ATM/SONET/SDH ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

PXB4220EV33

Infineon Technologies

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

2.13 mm

27 mm

27 mm

ZL30165GDG2

Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

SONET;SDH

YES

1

242 mA

1.8 V

GRID ARRAY

BGA144,12X12,40

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.95 mm

13 mm

13 mm

PM5309-FEI

Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT

BALL

500

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

BOTTOM

S-PBGA-B500

PM5337-FEI

Microchip Technology

ATM/SONET/SDH MUX/DEMUX

BALL

896

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B896

VSC8247YJB-02

Microchip Technology

ATM/SONET/SDH CLOCK RECOVERY CIRCUIT

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

BGA144(UNSPEC)

95 Cel

BOTTOM

S-PBGA-B144

13 mm

13 mm

ATM/SONET/SDH Circuits

ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.

ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).

SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.

ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.

However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.