32 Cellphone ICs 23

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
BGA7210	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	1	.85 mm	5 mm					5 mm
MAX2047ETJ	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm		e0			5 mm
CC1101IRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1101TRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1131IRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1131QRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1131TRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1151IRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1151QRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
CC1151TRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified	e4	30	260	5 mm
AD8366ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	2			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2046ETJ-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
CC1020RUZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
CC1020RUZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	3	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
BGA7204,115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	1	.85 mm	5 mm			30	260	5 mm
BGA7210,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		.85 mm	5 mm					5 mm
BGA7210X	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	1	.85 mm	5 mm				260	5 mm
BGA7350,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
BGA7350,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
CC1021RSST	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.1536 Mbps	S-PQCC-N32	3	1 mm	7 mm		e4	30	260	7 mm
ST25R3912-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
ST25R3913-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.