QCCN Cellphone ICs 9

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40		Not Qualified		NOT SPECIFIED	NOT SPECIFIED
CC1111F32RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	Not Qualified	e4	30	260
CC1111F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	Not Qualified	e4	30	260
CC1111F8RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	Not Qualified	e4	30	260
CC1070RGWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	2.5/3.3	CHIP CARRIER	LCC20,.20SQ,25	Other Telecom ICs	.635 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N20	3	Not Qualified	e4	30	260
CC1070RGWT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	QCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	2.5/3.3	CHIP CARRIER	LCC20,.20SQ,25	Other Telecom ICs	.635 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N20	3	Not Qualified	e4	30	260
MAX2392ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1	Not Qualified	e0
MAX2396EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.038 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1	Not Qualified	e0
MAX2401ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.043 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N28	1	Not Qualified

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.