SQUARE Cellphone ICs 256

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADRF5547BCPZN	Analog Devices	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N40	3	1 mm	6 mm			30	260	6 mm
S2-LPTXQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N24		1 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
LX5584BLQ-TR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		1.023 mm	3 mm					3 mm
AFE7920IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
ADRF6650ACPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
ADRF6650ACPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
WLAN7102CZ	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		214 mA	3.85 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.07SQ,16	.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	3	.7 mm	2 mm				260	2 mm
CC1260RGZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
CC1260RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm	7 mm		e4	30	260	7 mm
AFE7700IALK	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e0	20	220	17 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		150 mA	1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.7 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9986BBPZ-4D2AC	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	324	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1		4070 mA	1 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA324,18X18,32	.8 mm	120 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm			30	260	15 mm
AFE8030IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8030EDIABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8030EDIALK	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e0		220	17 mm
A7682E	Simcom Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	85	XMA	SQUARE	UNSPECIFIED	NO	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	S-XXMA-N85		2.4 mm	19.6 mm					19.6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.